New AdvancedMC Modules Feature Low-Profile Push-Pull Handle
Electronics packaging specialist Schroff has introduced a new family of
AdvancedMC modules that incorporate an innovative push-pull handle with
a much lower profile than conventional alternatives. Fully compliant with the PICMG AMC.0 R2.0 specification, the new
handle is designed for microswitch activation and features an integral
blue LED with light-pipe for clear visual indication of module status
during hot-swap.
To remove a module from a system, the user simply presses on the
black button - which springs forward - and then pulls the handle out
to unlock the module and extract it. Available with either stainless-steel or aluminium U-shaped
front panels, the modules come in single and double, mid-size and
full-size versions, as defined in the AdvancedMC standard. Filler
modules are available in the same range of sizes. All module and filler variants are fully shielded, using lateral
and lower EMC gasketing and copper-nickel coated textile cladding.
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