Friday, June 29, 2012

TXC launched new High Speed Current Steering Logic (HCSL) Crystal Oscillator in 7.0x5.0mm (named BX-series) and 5.0x3.2mm (named CX-series) ceramic package. It combines an AT-cut crystal with 3rd overtone design, support supply voltage 2.5V and 3.3V to achieve low phase jitter and low phase noise (0.2pS Typ., from 12KHz~20MHz) for PCI Express (PCIe) and other high-speed interface applications.

TXC launched new smallest Crystal in 1.2x1.0x0.3mm (named 8J-series) ceramic package. It designed for all kind electronic products that needed smaller crystal unit. ex. Smart phone , medical applications.

This 8J product is now available and 2 million pcs and more monthly production capacity has been allocated to customer immediate demand ramp-up. Energy saving and carbon reduction is all electronic product’s mission. TXC 1210 crystal is the best choice to make environmental protection. In the past, crystal’s performance was restricted by smaller process. So TXC all new developed 1210 crystal can match all smaller electronic product request.

Typical reference synthesizing frequency:36MHz,37.4MHz,38.4MHz,40MHz,48MHz and 54MHz.

Amphenol Industrial Global Operations has expanded its worldwide reach earning Australian TUV approval for its Starline EX and Amphe-EX series of connectors. These connectors are the first multi-pin power/signal products within the connector market that have earned this designation. This approval allows for both connector series to be used in the Australian mining and gas markets.

Designed for hazardous ATEX and IECEx applications, these rugged connectors feature exceptional mating properties and are available in high grade 316 stainless steel. These series of connectors offer a higher level of corrosion resistance for use in the harshest environments including mining, land drilling and offshore drilling.

TowerJazz, the global specialty foundry leader, and Triune Systems LLC, an IC design and test development provider, today announced that Triune has developed a proprietary analog/power management technology using the TowerJazz TS35PM process on its state of the art 0.18um based power management platform. Triune has trademarked this energy saving green technology, called nanoSmart®, and is releasing two products currently ramping to volume production showcasing this technology, the TS14001 and TS12001.

Triune’s TS14001 is an ultra-low-power LDO regulator which provides regulated output with best-in-class ultra-low quiescent current losses of 20nA under no-load conditions which helps reduce energy and heat. The TS12001 is an ultra-low-power under voltage load protect switch that utilizes off-active™ technology. Off-active™ provides active control of turning off, and then on, the control of the load with only 200pA losses, increasing efficiencies and resulting in less power wasted. In addition to these two products, several more energy saving products are planned to be launched this year to meet growing market demands. According to IDTechEx, the energy harvesting device market is projected to grow exponentially this decade; 10B+ energy harvesting devices are forecast to ship by 2019 – a 20x increase over ~500 million units that shipped in 2009.

nanoSmart® technology has been designed to target portable and low power applications for the consumer, industrial and medical markets as well as energy harvesting systems, off-grid autonomous systems such as solar panels for electricity, and SmartCard applications. Advantages of nanoSmart® technology include ultra-low power loss for light load conditions, flexibility to work with a wide range of output loads, and a minimized bill of materials (BOM) while still providing high-efficiency operation. Triune’s nanoSmart® and MPPT-lite™ technologies have also been leveraged for novel portable solar harvesting solutions through a National Science Foundation small business innovation and research (SBIR) grant award (No. 1113400). In addition, nanoSmart® technology can eliminate standby power losses for many systems and extend battery life on portable products. It expands the utility of alternate energy harvesting sources such as micro-solar and enables new autonomous systems.

“We chose to develop this ultra-low power technology for analog and power management applications with TowerJazz because they offered the best process for our needs, and were willing to work with us on differentiated out-of-the-box solutions,” said Ross Teggatz, President of Triune Systems. “Our nanoSmart® technology further leverages TowerJazz’s processes to provide truly unique solutions that can virtually eliminate the carbon footprint of any product while in standby mode, and we look forward to developing several new and exciting products around this.”

“TowerJazz continually draws on our customers’ needs to drive our technology offerings. And, the fact that power management experts such as Triune’s engineers chose TowerJazz’s power platform is proof of our technology superiority. Triune has been a valued partner for several years and their inputs have contributed to the best-in-class power management technology we have today. The device performance capability of nanoSmart® demonstrates what cooperation and flexibility can achieve in implementing new ideas,” said Dr. Avi Strum, Vice President and General Manager of the Specialty Business Unit at TowerJazz.

Thermo Fisher Scientific Inc., the world leader in serving science, is featuring its Thermo Scientific AquaPro Multi-Input Intelligent Process Analyzer during ACHEMA 2012. The new AquaPro analyzer features a large full-color display, a plug-and-play architecture, a front panel USB port, up to four channels in one instrument and multiple digital communication options. The AquaPro analyzer is being showcased within Thermo Scientific booth B7, hall 4.2 during ACHEMA 2012, being held from June 18-22 in Frankfurt.

The AquaPro is a sophisticated and highly flexible analysis platform for a wide range of process applications. Its unique plug-and-play architecture makes it easy to add new features and parameters; all a user needs to do is open the analyzer, slide and click. This simple multi-channel configuration offers the ability to add a simple analog parameter and/or advanced DataStick™ digital sensors to add host communications such as MODBUS, CANopen, Profibus, Ethernet and others. All this comes in one solution and can be done with just a click.

A key feature of the AquaPro analyzer is its large 3.4” (86.36mm) full-color display. Its bright backlit screen can be seen at nearly any angle and in any lighting condition, making it one of the most versatile in the industry. The interface is clean and easy to understand with intuitive menu -driven design for “out of the box” use without the need to study a manual.

The multi-function front panel USB port featured on the AquaPro analyzer offers additional versatility. By plugging in a USB data stick, users can download data from the data logging feature and store it in the AquaPro for easy transfer of settings and parameters to other AquaPro analyzers in the field. The port can also be used to upload new features and updates.

The AquaPro analyzer is programmed with seven user-selectable languages – English, Spanish, French, German, Italian, Portuguese and Chinese. This makes standardizing on the system, anywhere in the world, much easier.

Thermo Fisher Scientific Inc. (NYSE:TMO), the world leader in serving science, extended its leading FT-IR spectrometry platform by introducing the first research-grade FT-IR system designed for simple one-touch operation. The new Thermo Scientific Nicolet iS50 FT-IR spectrometer is one of several innovative products being introduced at ACHEMA to help customers increase laboratory efficiency in markets ranging from pharma and biotech, to chemical and petrochemical, to industrial and applied. These new offerings, along with the company’s comprehensive portfolio of chromatography, mass spectrometry, and environmental analysis technologies, are being showcased within Thermo Scientific booth B7, hall 4.2 at ACHEMA 2012, being held from June 18 - 22 in Frankfurt.

“In today’s economic environment, our customers need analytical tools that help them work much more efficiently, while improving the accuracy of their results,” said Marc N. Casper, president and chief executive officer of Thermo Fisher. “To meet this challenge, a key element of our innovation strategy is to strengthen our core technology platforms, and the new iS50 FT-IR spectrometer is another excellent example. This new product significantly enhances our industry-leading capabilities by providing our customers with a system that greatly simplifies FT-IR analysis to accelerate their results in research or process applications.”

The Nicolet iS™50 spectrometer builds on the company’s industry-leading Magna, Nexus and Nicolet 6700 spectrometry systems. It features purpose-built accessories and integrated software designed to provide all-in-one materials analysis that helps laboratories improve productivity by solving analytical challenges more quickly and easily. When equipped with optional modules, the iS50 system becomes a powerful materials analysis workhorse capable of extracting vast amounts of information from a wide range of samples.

Also during ACHEMA 2012, Thermo Fisher introduced its Thermo Scientific UltiMate 3000 XRS UHPLC system, setting a new standard of flexibility for the UltiMate 3000 UHPLC+ family. The UltiMate 3000 XRS™ leverages the company’s Dionex UHPLC product line to offer increased capabilities in solvent delivery and sample handling for high-throughput laboratories. The large portfolio of detector options further enhances this flexibility across a wide range of applications.

Thermo Fisher also showcased its new high-performance Thermo Scientific TSQ 8000 triple quadrupole GC-MS system, an easy-to-use instrument that enables greater analytical speed, precision and accuracy while saving time and reducing laboratory costs. The TSQ 8000™ is ideal for forensic toxicology and sports doping testing, as well as applied markets such as food and environmental analysis. For food and polymer laboratories, the new Thermo Scientific Process 11 twin-screw extruder is four to five times smaller than competing twin-screw extruders, requires less sample material and reduces analysis time.

TriQuint is announcing two new linear, highly efficient solutions for point-to-point (PtP) and VSAT applications at IMS MTT-S in Montreal (June 17-22). TriQuint's new 1W TGA2527-SM (12.4-15.4 GHz) is ideal for PtP and other mmWave systems, delivering 24dB gain with 30dBm P1dB and 31dBm (Psat).

It provides a linear solution with exceptional efficiency – 20% better than other products. TriQuint delivers a cost-effective, packaged VSAT solution with its new 1W, TGA4539-SM for Ka-band (28-30 GHz), providing 30.5dBm (Psat) and small signal gain of 20dB. Samples and evaluation boards are available for both of these integrated solutions that deliver cost-effective high performance. Contact product marketing or TriQuint sales for details.

TriQuint is announcing two new low noise amplifiers (LNAs) that simplify the RF design process and achieve highly linear, best-in-class noise performance. The TQP3M9036 and TQP3M9037 are surface-mount, integrated GaAs pHEMT devices that deliver assembly convenience while meeting the stringent linearity and noise figure requirements of 3G / 4G base station designs.

TQP3M9036 covers 400-1500 MHz with a noise figure of 0.45dB, 19dB of gain at 900 MHz, and high linearity (+35 dBm OIP3). The TQP3M9037 operates from 1.5-2.7 GHz with a noise figure of 0.4dB and 20dB of gain at 1900 MHz, and an OIP3 of +36dBm. Both products are currently sampling and will be available in September 2012. Contact product marketing or TriQuint sales for details.

TriQuint supports constant innovation as shown in the finer gradation of its newly-released TQP4M9083 7-bit digital step attenuator (DSA). Providing up to 31.75dB of attenuation in 0.25dB steps and operating from 0.4-3.5 GHz, the TQP4M9083 achieves low insertion loss, high speed, linearity and upgraded resolution.

These characteristics ideally meet public safety and commercial wireless base station design requirements while supporting test equipment and many other similar applications with more system gain control choices. Contact product marketing or TriQuint sales for innovative DSAs and other RF design solutions.

TriQuint met with many colleagues, partners and industry leaders at IMS MTT-S 2012 in Montreal, discussing our new range of GaN and GaAs solutions. TriQuint showcased newly-released GaN products including TGA2572-FL, TGA2579-FL and TGA2593-GSG (available August 1st), while sharing its RF design expertise in many special sessions. TriQuint’s innovative new GaN packaged transistor, T1G6003028-FS offers 3dB more gain than competing devices, which can cut the number of stages in amplifier designs by 50%.

TriQuint also released VSAT and PtP / mmWave innovations that integrate functions for smaller BOMs; the new TGA2527-cuts power consumption 20%. New TriQuint BTS LNAs offer the lowest noise figure of any packaged, integrated solution (as low as 0.4dB). Contact product marketing or visit our sales webpage for details.

Tripp Lite, a world-leading manufacturer of power protection and connectivity solutions, has introduced a new energy-saving, row-based air conditioning unit. The SRCOOL33K has a 42U rack form factor and delivers up to 33,000 BTU of efficient cooling for high-density rack installations in data centers, server rooms and network closets. The AC unit has several advanced features that allow it to cool more effectively than other units on the market.

Key Features and Benefits:

•     Improves efficiency and lowers operating costs
•     DC (direct current)-inverter-driven compressor and microprocessor-controlled electronic expansion valve allow continuous operation at precise cooling levels
•     Prevents line noise, voltage disruptions and potential circuit overloads by limiting inrush current
•     Close-coupled cooling maximizes hot-aisle/cold-aisle efficiency and cooling predictability
•     Built-in local and optional remote monitoring and control of temperature, humidity, fan speed, alarms and logs
•     Self-contained, zero-maintenance design unit re-humidifies condensate and expels it through the exhaust air stream —no floor drain necessary, water collection tank to empty or plumbing required
•     Includes a standard L6-30P input plug for easy installation—no electrician needed

Seiko Epson Corporation ("Epson," TSE: 6724) today announced development of the RX-4035SA/LC and RX-8035SA/LC real-time clock modules(*1) - units designed to be compatible with primary batteries, secondary batteries, capacitors (one type of storage cell) and various other power sources. The company plans to begin accepting orders for these new products from the end of July. Volume production is slated to commence for the RX-8035SA from August, and for the RX-4035SA/LC and RX-8035LC from October.

Alongside growing public awareness of the need to conserve energy, manufacturers have made rapid moves to ensure lower power consumption in electronic devices. This trend has sparked increased use of real-time clocks for retaining the current time in electronic devices in place of microcontrollers (which effectively internalize clock function), due to the ability of such clocks to retain the current time with extremely low power consumption.

Conventional real-time clocks use an external special-purpose power management IC to sustain operation of the clock in case the electronic device's main power supply is cut off. However, this can cause battery power loss, prompting calls for solutions toward lower power consumption and greater efficiency. To address these needs, Epson has developed the RX-4035SA/LC and RX-8035SA/LC real-time clock modules with built-in power source switching function, realizing extremely low leakage current and voltage drops, while maximizing battery power.

Seiko Epson Corporation ("Epson," TSE: 6724) today announced that it has developed and begun sales of the NX1032XS IC test handler capable of transferring, inspecting and sorting semiconductors with one of the world's highest throughput levels.*1 By installing this product, customers will be able to greatly reduce inspection costs in the downstream processes of semiconductor manufacturing.

An IC test handler is a system that transfers finished semiconductors to inspection equipment for electrical, visual and other final performance tests and then sorts them into multiple categories, such as good and defective. In response to robust demand for smartphones, tablets and automotive devices in recent years, semiconductor manufacturers have expressed a growing interest in the use of high-speed and high-precision IC test handlers to boost production of high-performance semiconductors (logic ICs*2).

"Our customers demanded a high-speed test handler and we created the NX1032XS IC test handler to meet these needs," said Hideo Hirao, responsible for Epson's Factory Automation Division. "As a leading*3 manufacturer of IC test handlers, we were determined to develop the IC test handler with the world's highest throughput." The new handler is capable of transferring, inspecting and sorting up to 20,000 logic ICs every hour.

With the ability to transfer 32 semiconductors to inspection equipment at a time, this new model offers twice the capacity of Epson's previous top model, the NS-8160W. Epson also uses its original Smart Motion Control robot control technology to enable fast movement while maintaining low vibration when transferring semiconductors. In addition, the plate can be heated to enable testing at extreme temperatures of up to 155 °C, a requirement for semiconductors used in automotive applications.

Epson will demonstrate this product at its booth (No. 6742) at SEMICON West 2012 to be held in San Francisco from July 10 to 12.

A man walking down the street checks a device attached to his wrist. The device is an Epson-made monitor that measures his pulse rate, but whose only contact point is his wrist. The face on the LCD screen tells him how much exercise is required to burn fat, and is designed to encourage him to do the correct amount of exercise.

This article discusses the development story behind the wristwatch-type pulse monitor that contains Epson’s sensing technology, and Epson’s plans to grow its healthcare business.

Conventional pulse monitors – including those previously manufactured on an OEM basis by Epson – involve a band wrapped around the finger, which contains a lot of blood vessels. However, finger bands are easily noticed and make it difficult for patients to perform manual work. Epson developed its new product to answer patients’ demands for a pulse monitor that did not require a finger band.

To create this product, Epson drew on its 20 years of experience in pulse sensing technology with the aim of creating a wristwatch-type device. The product that emerged takes advantage of the light-absorbing property of hemoglobin. The monitor directs harmless LED light inside the skin, and then uses light-absorbing elements to measure the amount of light that is not absorbed by the hemoglobin and which is reflected back from inside the body. The amount of hemoglobin in the blood increases when the blood vessels expand – for example after exercise - meaning that the amount of light absorbed by the body also increases. On the other hand, when blood vessels contract the amount of hemoglobin decreases along with the amount of light absorbed. Epson’s product measures the pulse rate according to the amount of light entering the light-absorbing elements.

Toumaz Limited (AIM: TMZ, 'Toumaz', or 'the Group'), a pioneer in low cost, ultra low power wireless communications and broadcast technology, has raised £11.2m through a placing ('Placing') of 128,000,001 new ordinary shares of 0.25p ('Ordinary Shares') with institutional investors each at a price of 8.75p per share ('Placing Price').

The proceeds will mainly be used to invest further in Toumaz Microsystems. Toumaz Microsystems was recently established as a new fabless subsidiary by Toumaz with investment and support from Imagination Technologies Group plc (LSE:IMG, 'Imagination') to design, develop and sell wireless semiconductor chips and embedded solutions for the growing area of internet and cloud-connected applications.

The potential uses for this technology span across many markets from healthcare, home automation and wireless multimedia to enterprise solutions, monitoring devices and toys. Geographically, Toumaz is seeing growing opportunities across the world with particularly large market potential in the Far East.

Toumaz Microsystems' strategy is to deliver both low-power and high-performance connectivity solutions addressing both ultra low-power, battery-operated connected devices and also high data-rate devices needed for wireless audio and video delivery. A key focus is developing a new multi-standard connectivity chip. This ultra-low power radio receiver and transmitter chip will incorporate the new IEEE standard 802.15.6, for Body Area Networks ('BAN', see notes to editors).

Toumaz has been a very active participant and driver of the IEEE committee specifying and developing this important standard. This new standard has very recently been approved ahead of plan and part of the additional funds will enable Toumaz to develop the first chip incorporating the new standard alongside other key low power radio standards, such as Bluetooth LE and Zigbee, as quickly as possible. Toumaz has a strong next generation connectivity roadmap and on-going developments in both low-power and performance areas which can be executed and exploited with this additional funding and the recent investment and support from Imagination Technologies.

The new chips will also be incorporated in the next generation Sensium solution for wireless healthcare monitoring of vital signs, both in and out of the hospital making it compatible with the new IEEE standard.

Following this rapid approval of the new standard and establishment of our forward-looking roadmap Toumaz and Imagination have simplified the ownership structure of Toumaz Microsystems through exchanging Imagination's 25% holding in Toumaz Microsystems for 57,142,857 new Ordinary Shares of Toumaz at the Placing Price ('Exchange').

Application has been made for a total of 185,142,858 new Ordinary Shares to be admitted to trading on AIM, which is expected to be effective from and dealings in the new Ordinary Shares to commence on 16 February 2012.

GE ­(NYSE: GE) today announced it has agreed to acquire a majority stake in the Vadodara-based Advanced Systek Private Limited, one of India’s leading suppliers of terminal automation systems and flow metering solutions. The transaction will enhance GE’s ability to offer solutions to customers in regions such as South Asia and the Middle East. Terms of the transaction were not disclosed.

Oil and gas asset automation applications require specialized skills to ensure the safe transportation and accurate measurement of natural gas, crude oil and petroleum products. Advanced Systek offers its midstream and upstream oil and gas industry customers total terminal management and flow metering solutions including design, engineering, supply, installation, commissioning and maintenance.

By combining Advanced Systek’s capabilities with GE technology and world-class product suite of flow meters, control valves, UPS, controllers and instrumentation, this transaction enables the GE Oil & Gas business to broaden its offerings for the industry and deepen its relationship with customers seeking more efficient energy solutions.

Headquartered in Vadodara, Advanced Systek also has its manufacturing facility based there. Under the terms of the transaction, the senior management team of Advanced Systek will continue to serve as directors and will work with GE to utilize their industry expertise to help the business grow.

John L. Flannery, president and CEO of GE India, said: “GE and Advanced Systek complement each other very well. Advanced Systek’s capabilities and its established track record in the oil andgas industry combined with our expertise and product portfolio in custody transfer will help us expand our service offerings to our customers. This merging of strengths will help us address growth opportunities in India and other emerging countries.”

Mr. Umed Fifadra and Mr. Mukesh Kapadia, joint managing directors of Advanced Systek, said: “Advanced Systek’s electronic flow measurement devices and automation software will be complemented by GE Energy’s existing strength in measurement instrumentation, diagnostics and performance optimization offerings, to create an overall solutions business with strong local capabilities. We look forward to widening Advanced Systek’s position in its core areas of expertise with GE Energy’s broad range of world class products and global reach.”

THAT Corporation has announced that the 4320 series of Analog Engine dynamics processor ICs now includes a space saving 5 x 5 mm QFN package. This tiny QFN package saves over 55% on board space. The THAT 4320 is intended for use in companding noise reduction systems and can be configured for use in multi-band companders, limiters, AGCs and de-essers.

The THAT 4320 includes a high-performance voltage controlled amplifier, 4 op amps, a true-rms level detector and a proportional to absolute temperature (PTAT) voltage reference used to generate thermally compensated control voltages for threshold and gain settings. This single-chip Analog Engine operates from a single supply, from 16 V down to +4.5 V, and draws only 3.5 mA, making it well suited for both line powered and battery powered applications.

“Offering the THAT 4320 in a QFN package is in direct response to our customers that are designing wireless microphones, wireless instruments and in-ear monitors where space is at a premium,” commented Les Tyler, President THAT Corporation. “By adding more options to the 4320 we’re enabling designers to truly differentiate their products through the transparent sound of the Blackmer™ VCA coupled with its accurate, wide-range true-rms level detector.”

Priced at $5.48 in 1k quantities, the 4320 is available now in both a 28-pin QSOP and a space-saving 5x5 mm 24-pin QFN.

THAT Corporation, a leading provider of high-quality audio IC technologies, today announced it has entered into a business relationship with Infinity Sales, a leading manufacturers' representative in Southern California for semiconductors and other electronic devices. As part of the agreement, Infinity Sales will execute product selling strategies for THAT’s high-performance audio ICs, including low-noise preamplifiers, dynamics processors, balanced line drivers/receivers, and transistor arrays. In addition to developing intimacy with THAT’s existing pro audio customers, Infinity will look to secure new, long-term strategic customer engagements that will ultimately extend THAT Corporation’s visibility to markets outside the pro audio arena, including industrial, medical and communications, etc.

“We have a foundry in Milpitas, so we were well aware of Infinity’s solid reputation in the San Fernando Valley, Santa Barbara, Ventura, and Los Angeles Counties. We were also impressed with their staff of seasoned electronics engineers who offer in-depth knowledge of the audio market,” said Les Tyler, President, THAT Corporation. “Our alliance with Infinity promises to keep THAT Corporation at the forefront of the pro audio industry, and position us for additional growth in this region.”

“Our team sees THAT Corporation’s benchmark high performance analog portfolio continuing to outpace their less specialized competition,” said Robert Flournoy, General Manager of Infinity Sales. “THAT Corporation’s analog preamp and digital gain controllers are one example where they are the only solution available that will satisfy fidelity and performance requirements of the highly demanding audio OEM customers in our marketplace.”

THAT Corporation, a leading provider of high-quality audio IC technologies, today announced the latest addition to its best-in-class IC product line -- the THAT5173 digital gain controller, a cost-effective, high-quality solution for digitally-controlled audio preamplifier applications.

Accepting full pro-audio signal levels up to +27.5dBu without an input pad, the 5173 maintains exceptional performance over a wide range of gains and signal levels. Thanks to its advanced design and integrated DC servo amplifier, the 5173 provides click-less digital gain control for differential analog current-feedback preamplifiers. The small 5mm x 5mm 5173 controls gain from 0dB to 60dB in 3dB steps, with low noise and distortion.

The 5173 is designed to operate seamlessly with the THAT1570 high performance current-feedback amplifier, THAT's state-of-the-art analog differential microphone preamp. In combination with the 1570, the 5173 operates with supplies from ±5V to ±17V. Its differential output is ideal for connection to high-performance, differential-input A/D converters.

“The 5173 is the first significant extension to our existing line of digitally controllable preamplifiers,” said Les Tyler, President, THAT Corporation. “Customers who require the ultimate in performance will select the 5171/1570 combination, while those who are more cost-conscious will find the 5173/1570 strikes an appropriate balance between cost and performance. 3dB steps are appropriate for many mic preamp applications, and by accepting full pro audio levels without a pad, the 5173 saves space over other approaches.”

The THAT5173 digital gain controller is targeted for high performance digitally-controlled preamplifiers, either as standalone products, or within audio mixing consoles, PC-audio breakout boxes, and instrumentation amplifiers. The IC comes in a QFN24 package. It features a wide gain range of 0 to 60dB in 3dB steps, a supply range of ±5V to ±17V, an output and input swing of up to +27.5dBu (± 17V supply) and a low 1kHz THD under 0.001% for gains up to 42dB.

Texas Instruments Incorporated (TI) (NASDAQ: TXN) and AirHop Communications, the leading provider of advanced radio access network (RAN) intelligence solutions for heterogeneous networks (HetNet), today announced their collaboration to integrate AirHop's eSON™ advanced self-organizing network (SON) software on TI's KeyStone-based small cell System-on-Chips (SoCs). With this integrated solution, developers using TI's TMS320TCI6612, TMS320TCI6614 and TMS320TCI6636 SoCs will be able to design small cell base stations that will facilitate operators' ability to deploy heterogeneous networks.

To meet escalating demand for mobile data, network operators are turning to small cell base stations to increase capacity and complement existing macrocell networks. The resulting HetNet requires SON technology specifically designed for small cell networks to actively optimize system capacity and manage inter-cell interference. The combined TI and AirHop solution helps base station vendors get to market quickly with high performance small cells that satisfy telecom operators' requirements for HetNet applications.

TI's scalable KeyStone architecture includes support for both TMS320C66x digital signal processor (DSP) generation cores and multiple cache coherent quad ARM® Cortex™-A15 clusters, for a mixture of up to 32 DSP and RISC cores. In addition, TI's KeyStone architecture includes fully offloaded, flexible packet and security coprocessors and capacity expansion for SoC structural elements such as TeraNet, Multicore Navigator and Multicore Shared Memory Controller (MSMC). These structural elements provide a seamless integration between the DSP and ARM RISC cores, allowing base stations developers to fully utilize the capability of all processing elements, including the cores and enhanced AccelerationPacs.

AirHop's eSON software delivers multi-cell coordination and optimization that can be deployed in fully distributed, centralized or hybrid architectures and, for maximum flexibility, can be located anywhere in the core network cloud and on a variety of network edge devices. TI's KeyStone multicore SoC architecture enables more efficient measurements from the lower level PHY stack, required by the higher level SON algorithms, resulting in optimized SON solutions for customers.

"AirHop is a technology leader in helping carriers and equipment vendors use SON to optimize capacity and manage the interferences in small cell deployment, making us a natural choice to work with TI on its LTE small cell SoCs, which are the most competitive in the industry," said Yan Hui, co-founder and CEO of AirHop. "As TI's vendor of choice for SON software, we have worked closely with TI to optimize our software for its KeyStone-based small cell SoCs and look forward to delivering software solutions to TI's customers."

"The management, configuration of and interference cancellation between macro cells and small cells is one of the largest barriers to mass deployment of small cells today," said Sameer Wasson, business manager, wireless base station infrastructure, TI. "TI's small cell SoCs are in production and in development with leading base station vendors today, and with this integration of AirHop's SON software, we can truly enable operators to overcome some of the early challenges of HetNet deployments and advance the installation of small cells."

Maxim Integrated Products (NASDAQ: MXIM) announces the launch of a new Teridian/Maxim energy-measurement system on chip (SoC), the 78M6613. The 78M6613 is the industry’s first SoC energy-measurement solution for AC/DC power supplies that brings a higher level of management and control to servers and other equipment in data centers.

  The new Teridian/Maxim chip comes as Environmental Protection Agency (EPA)/ENERGY STAR® mandates toward greater efficiency and accurate energy measurement in data centers begin to bear down on enterprises around the globe. The 78M6613 enables the capture and reporting of real-time energy data, which provides data center managers with the ability to quantify where energy is needed, being used, and more importantly, being stranded. Visibility into this critical data is an absolute requirement in order to manage and control energy usage in power-starved data centers that cannot keep up with growing demands placed upon them.

“Power capping, load shedding and virtualization are all driving the need for real-time energy measurement and resource management in data centers,” said Jay Cormier, Maxim Integrated Products Director, Teridian/Maxim Business Management, Energy Measurement & Communications. “New technology and greater demands on data centers and enterprise networks are all making it even more important to understand where energy is going.”

With an embedded analog front-end and compute engine, small footprint, and embedded firmware, the 78M6613 is specifically optimized to address the unique challenges of precision energy measurement inside AC/DC power supplies. As with all Teridian/Maxim brand energy-measurement SoCs, the 78M6613 features best-in-class accuracy of ±0.5% over a 2000:1 dynamic range, but also provides powerful tools for self-calibration to help facilitate rapid design time and optimal manufacturing costs.

The 78M6613 is a highly integrated, single-phase, fully self-contained AC power-measurement and monitoring SoC integrated circuit with embedded AC load monitoring and control firmware. The small 32-pin QFN package is ideally suited for real-estate-limited designs such as power supplies, where power density and space are a premium. The 78M6613 features the full range of AC power diagnostics, including power, power factor, voltage current, voltage sag and dip. On-chip flash and a microcontroller (MCU) enable the storage of calibration coefficients and eliminate the need for external components.

Initially targeted at server power supplies, the 78M6613 is also suited to energy-measurement needs in data communications and storage equipment. The flexibility of the platform also makes real-time energy measurement a reality for home appliances, home automation networks and building automation.

The 78M6613 is available in a 32-pin QFN package. Production quantities are available now and the SoC is priced at $2.65 (1000 up, FOB USA). 78M6613 evaluation kits are also available.

TELEFUNKEN, the German traditional brand in the field of consumer electronics, is expanding its presence in Scandinavia. Starting in August 2011 TELEFUNKENS Partner TF Nordic AB offers with a first range of innovative high-class products.

The market entry starts with a TELEFUNKEN television system with integrated HD and the PerfektAudio series, which has obtained a „very good“ rating by different hi-fi magazines in Germany. It contains of two component systems and a smaller compact system for the audiophile northern customers. Until the end of this year TF Nordic AB plans to launch external storage media, small electrical appliances as well as a series of white goods.

TF Nordic AB is the first organization within the TELEFUNKEN family to launch a collection of 3D glasses for the consumer electronics market. These 3D glasses have been produced together with eyewear manufacturer Polaroid and the products are expected to be available in stores by the end of this summer.

TF Nordic AB, is a member of the TELEFUNKEN Partner Alliance since 2010. The award-winning entrepreneur Jörgen Schulze, who is also the principal owner, founded the company. All members of his team are specialists in their fields of brown goods and white goods. Sergio Klaus-Peter Voigt, CEO of TELEFUNKEN Holding AG welcomes the cooperation with the new partner: “It is of utmost importance for us to develop the brand with approved specialists. Jörgen Schultze and his team from TF Nordic AB have the best preconditions to carry the brand heritage of TELEFUNKEN into the northern markets.”

„We are excited about this opportunity, to bring a brand as traditional as TELEFUNKEN to market,“ says Jörgen Schulze and Andrej Setina, CEO of TF Nordic AB adds: „TELEFUNKEN stands for quality, innovation and design. It is a huge potential that this brand can now develop in the northern markets.“

At this year's IFA TELEFUNKEN presented to visitors from national and international visitors two new segments that have a crucial influence on the future product strategy of the brand. In the area of energy management and home control the joint venture TELEFUNKEN Smart Building GmbH (i. Gr.) was announced. The second segment concerns the solar-powered consumer electronics products that can be loaded and operated with integrated solar cells. Due to popular demand, the new devices are offered even faster than expected in international markets. A further expansion of distribution channels is taking place in Russia, South America and Australia.

The highlight of the show was SOUND.MOBILE. The solar-speaker has an excellent sound and is perfectly suitable for indoor and outdoor use. MP3 players, game consoles, computers and mobile phones are easily connected via Bluetooth. The eye-catcher convinced experts and business partners alike. An enlargement of the product line is already being planned. After initial discussions SOUND.MOBILE will be available later this year in Scandinavia, Central Europe and China.

Energy efficiency can be achieved for all existing, non solar-powered devices. Joonior, a smart building system, consists of 12 components. It networks home appliances and wireless technology and is operated via smart phones tablet PCs or computers. The TELEFUNKEN Smart Building GmbH (i. Gr.) develops intelligent building technology together with the energy supplier E.on. A cooperation agreement was signed at the IFA.

The historic company TELEFUNKEN has entered the worldwide market for lighting by founding TELEFUNKEN Licht AG in May 2012. Based in Dreieich near Frankfurt am Main, TELEFUNKEN Licht AG develops, produces and sells eco-friendly lighting solutions worldwide based on leading-edge sustainable LED technology, with the aim of positioning itself as a fixture in the lighting segment and advancing the spread of the emerging technology LED. “Light has always played an important role in TELEFUNKEN’s history,” says Sergio Klaus-Peter Voigt, CEO of TELEFUNKEN SE and a member of the TELEFUNKEN Licht AG executive board. “Given the ongoing switch to alternative energies and quest for ways to cut CO2 emissions, the time has come to refocus on this area of the business.”

TELEFUNKEN Licht AG will focus on four product lines – Illumination, Modules, Objects and Media / Entertainment (LED screens) – covering a broad spectrum of products for private, industrial, commercial and municipal users as well as the entertainment, infotainment and architecture segments. “In an increasingly complex lighting market, our international group of companies seeks to send a signal and give users orientation. TELEFUNKEN Licht AG is fully committed to the TELEFUNKEN brand values of quality, innovation and reliability,” says Hemjö Klein, Chairman of the Supervisory Board of TELEFUNKEN Licht AG and CEO of Live Holding AG.

Teledyne Technologies Incorporated (NYSE:TDY) announced today that its subsidiary, Teledyne Brown Engineering, Inc., in Huntsville, Ala., was awarded a Cooperative Agreement by the National Aeronautics and Space Administration (NASA) to foster the commercial utilization of the International Space Station.

Under the agreement, Teledyne Brown will develop the Multi-User System for Earth Sensing (MUSES), an Earth imaging platform, as part of the company’s new commercial space-based digital imaging business. MUSES is designed to host earth-looking instruments, such as high-resolution digital cameras, and provide precision pointing and other accommodations. It can host up to four instruments simultaneously and offers the ability to change, upgrade, and robotically service those instruments. Teledyne expects to provide the first commercial imaging system on board the facility.

MUSES will help expand the research capability of the space station and provide other commercial companies with a cost-effective means to collect earth images. Under the terms of the agreement, Teledyne will operate, maintain, and sustain the MUSES and provide services to hosted instruments.

“This new venture combines our rich 50-year history in human space flight with Teledyne’s world-class digital imaging expertise to access the growing space-based earth imaging market,” said Robert Mehrabian, chairman, president, and chief executive officer of Teledyne Technologies.

The MUSES design is based on a flight releasable attachment mechanism, or FRAM, a universal mounting platform that Teledyne Brown has manufactured for over 10 years. Teledyne Brown is finalizing the design of MUSES and will fabricate, assemble, test, integrate, and qualify the platform for delivery in late 2014 to NASA. Launch of the MUSES system is scheduled to occur in early 2015.

Tektronix, Inc., the world's leading manufacturer of oscilloscopes, today announced a series of enhancements to its automated MIPI Alliance M-PHY test solutions, offering new multi-lane transmitter test setup enablement and the widest test coverage - automation of approximately 1,000 tests - for this rapidly emerging mobile device standard.

To showcase this comprehensive test coverage, Tektronix and ST-Ericsson are providing hands-on demonstrations during the MIPI Alliance All Member Meeting this week in Berlin. The demo setup features a Tektronix DPO/DSA/MSO70000 series oscilloscope connected to an ST-Ericsson device under test (DUT) to show how this solution can be used to evaluate M-PHY Tx and Rx physical layers along with MIPI DigRFv4 protocol analysis.

"We have been using Tektronix M-PHY test bench for over a year for M-PHY electrical characterization and analysis and to significantly speed up compliance testing," said Ahmed Bouaiss, High-Speed Project Lead Test Development, and Steve Kwiatkowski, High-Speed Serial Test Development Engineer for ST-Ericsson. "Advanced test solutions such as those available from Tektronix are critical to the emergence of a new standard like M-PHY. We are pleased to be partnering with Tektronix to help move M-PHY adoption forward."

With the latest release, Tektronix Opt. M-PHYTX now automates approximately 1,000 tests for verification and compliance test of all High Speed (HS) Gears including Gear3, and all Pulse Width Modulation (PWM) Gears, with the industry's widest test coverage of both HS (95 percent) and PWM (73 percent) measurements. In addition, a new M-PHYTX differential mode of acquisition enables multi-lane M-PHY setups. This means that four lanes of an M-PHY transmitter can be connected simultaneously to four channels on an oscilloscope providing faster test set-up and shorter run times.

Moving beyond compliance testing to debug & analysis, the Tektronix M-PHYTX test solution along with Tektronix Visual Trigger and DPO-JET Jitter and Timing Analysis enables engineers to quickly and confidently identify debug issues quickly across different test modes and combinations. For receiver testing, Opt. M-PHYRX uses a highly optimized setup that significantly reduces equipment costs compared to alternatives that require at least three or more instruments with numerous connectors for conducting the stringent M-PHY Receiver tests. Tektronix also provides full protocol decode and analysis solution for M-PHY UniPro and LLI protocols.

"As this latest release demonstrates, supporting the MIPI and M-PHY design community continues to be a top priority for Tektronix," said Brian Reich, general manager, Performance Oscilloscopes, Tektronix. "We were the first to market with M-PHY solutions starting in September 2010, and now offer the industry's most comprehensive, fully-automated test solutions. What's more we are now partnering with mobile industry leaders such as ST-Ericsson to move adoption of MIPI standards forward."

Tektronix, Inc., the world's leading manufacturer of oscilloscopes, today announced the availability of a fully automated transmitter (Tx) compliance testing solution for Thunderbolt technology that provides the industry's fastest test execution and time to answer. Tektronix also announced availability of setups to speed up Thunderbolt receiver (Rx) testing tasks.

Thunderbolt is a transformational I/O technology that provides a leap in performance and flexibility over current I/O technologies. It provides two 10 Gbps bi-directional, channels on a single cable and simplifies the end-user experience with support for PCI Express and DisplayPort protocols. For engineers facing time pressure to finalize Thunderbolt-enabled designs and deliver products to consumers, Tektronix delivers the testing tools they need to minimize test setup and runtimes while also offering deep insight into design issues.

The new automated Thunderbolt Tx test solution for Tektronix DSA70000 Series oscilloscopes is the first in the industry to offer state control for the device under test (DUT) and to support two-lane testing. Compared to other offerings which only support one lane at a time, the Tektronix solution significantly shortens test times and boosts engineering productivity. On the Rx side, Tektronix has released detailed setups for the 12.5 Gbps BSA Series BERTscope for faster and more consistent receiver side testing.

Another advantage of the Tektronix Thunderbolt test solution, particularly for physical layer debug challenges, is support for separation of bounded uncorrelated jitter or BUJ. This form of jitter is usually the result of crosstalk that occurs across adjacent high-speed lanes such as those used in Thunderbolt. Other jitter decomposition models incorrectly place BUJ in random jitter, making it difficult for designers to isolate crosstalk issues.

With this Thunderbolt solution, Tektronix rounds out its deep level of support for display technology standards including DisplayPort and Dual Mode DisplayPort. This allows designers to use the same testing tools for ensuring interoperability across multiple display standards.

"With its combination of speed and compatibility with existing I/O technologies, we see Thunderbolt as the type of breakthrough technology that only comes along once a decade or so," said Brian Reich, general manager, Performance Oscilloscopes, Tektronix. "We have been working closely with Intel since the inception of Thunderbolt to develop a broad portfolio of best-in-class tools to help our customers efficiently bring Thunderbolt products to market."

Littelfuse, Inc. (NASDAQ:LFUS), the global leader in circuit protection, today announced it has been awarded the 2011 Technical Support Award by Huawei, a leading global information and communications technology (ICT) solutions provider. The annual award recognizes suppliers that provide superior advanced technology support for Huawei’s passive components and discrete devices.
“The Technical Support Award recognizes the hard work and dedication of Littelfuse associates across the company in providing value to Huawei and continuously contributing to their success,” said Deepak Nayar, Vice President and General Manager of the Littelfuse Electronics Business Unit. “We are committed to meeting customer expectations and providing quality products and services. We are proud that our high level of customer support stands out among Huawei’s more than 200 suppliers. This excellent recognition from an established leader in the telecom industry highlights the value of our advanced technologies and customer support.”

In a statement regarding the award, Huawei said, “Littelfuse has set itself apart by providing the most advanced technologies that align with the specific requirements of our telecom infrastructure, terminal devices and smart phone products. The company’s broad portfolio of circuit protection technologies, along with its strong customer commitment, has been a great fit with Huawei. We look forward to building on this mutually-beneficial relationship.”

TDK Corporation (President: Takehiro Kamigama, Head Office: Nihonbashi, Chuoku, Tokyo) announces that it has developed an isolated DC-DC converter platform that converts electrical power bidirectionally TDK-Lambda Corporation (President: Yoshiaki Hirota, Head Office: Nihonbashi, Chuoku, Tokyo) will use this platform as the basis for it’s new EZA series of dc-dc converters.

As we progress toward realization of a low carbon society, various efforts are being made on a global scale to develop effective energy management systems based on renewable energy such as electricity generated by solar power and wind force. Such standalone systems cannot store energy to cater for peaks and troughs in generation. TDK’s compact, light weight and highly efficient bidirectional DC-DC converter platform will enable charging and discharging of storage batteries.

Charging and discharging of a rechargeable battery from / to DC voltage bus needs upward and downward power conversion. Previously, it was necessary to develop a special power unit or switch between 2 DC-DC converters, one for upward conversion, the other for downward conversion, to accomplish this. TDK took advantage of its latest power supply technologies and developed a new DC-DC converter platform that can handle bidirectional power conversion. TDK-Lambda is to use it as the base to introduce its DC-DC converters the “EZA series”. The new series of high performance bidirectional DC-DC converters will help customers develop energy storage systems with rechargeable batteries.

Main features
  •     Isolated topology that has advantage in safety and noise management.
  •     Digitally controlled optimization achieves high conversion efficiency of 94% or higher in both directions.
  •     Capable of autonomous operation and can automatically change conversion direction to stabilize input or output voltage.
  •     Capable of changing conversion direction at high speed.
  •     External devices can control and monitor the status of current, voltage and conversion direction through the RS485 serial communication port.
  •     Compact size (1U full rack)

TDK Corporation (President: Takehiro Kamigama, Head Office: Nihonbashi, Chuoku, Tokyo) announces that it has developed the HWS-L/BAT series of power supply units for charging secondary batteries available as an option for TDK-Lambda's HWS series of standard power supplies for industrial equipment. The new series is available in 600W and 1000W types (4 models in total). It has been marketed by TDK-Lambda Corporation (President: Yoshiaki Hirota, Head Office: Nihonbashi, Chuoku, Tokyo). Orders can be placed from July 1, 2012.

Since the Great East Japan Earthquake, there have been increasing concerns over power loss at the time of disasters such as mega earthquakes or shortage of electricity supply during the summer season. It is vital for all industries to secure electricity in emergency situations And, consequently, there is an increasing need for power backup systems using secondary batteries. Responding to such requirements, TDK has developed the “HWS-L/BAT series” of constant current power supplies for small to medium capacity secondary batteries based on the existing “HWS series” already well established in the industrial equipment market. They can also operate in parallel mode so that a wide range of battery capacities can be handled.

The HWS-L/BAT series constant current power supplies have been developed from the “HWS series” products that are already well established in the industrial equipment market. They are optimal for charging small to medium capacity secondary batteries in both constant current and constant voltage charge modes. In addition, charge current and maximum charge voltage can be preset at any level within the range allowed by the specifications. A charger configuration can easily be built by combining backflow prevention diodes and circuitry to stop the charge operation at the time of battery failure. The HWS-L/BAT series power supplies, together with the EVA series power supplies for medium to large capacity applications that have been recently released, can meet a wide range of customer requirements.

Main features
  •     Constant current power supply whose current and maximum charge voltage can be adjusted by the embedded trimmer.
  •     Capable of handling constant current and constant voltage charging. Optimal for charging many kinds of rechargeable batteries.
  •     Capable of handling both 24V and 48V secondary batteries. Available in 600W and 1,000W types, total 4 models.
  •     Parallel operation
  •     Small form factor just like the HWS series

Taoglas Limited, the leading provider of antenna solutions to the M2M market, today launched the PA.700.A “Viking” antenna, a LTE, septa-band, surface mount antenna (SMT).  It delivers efficiency of over 70% in a design that is significantly smaller than current market wide-band antennas. This multi-band cellular antenna covers all worldwide cellular bands from 700 MHz to 960 MHz and 1710 MHz to 2170 MHz for GSM, CDMA, WCDMA, DCS, PCS, UMTS, HSDPA, GPRS, EDGE and LTE. The PA.700.A Viking is an off-the-shelf LTE antenna that is ideal for any M2M product manufacturer that wants high performance 4G/3G/2G capabilities for small devices.

The PA.700.A Viking has many advantages over existing products in the market:
  • The antenna is delivered on tape and reel and can be surface mounted saving on assembly costs and delivering greater performance consistency.
  • With no customization required, development times are dramatically reduced.  Within one week, customers can match the antenna by simply changing the matching circuit.
  • Signal loss is minimized due to a simple 50 Ohm CPW transmission line on the short end of the device board from the module to the antenna.
  • At a size of 40x6x5 mm, the Viking has one of the highest efficiencies for a small-scale multiband antenna, enabling customers to achieve greater device performance and sensitivity in areas of low signal and deliver the data-speed rates that are critical to 3G and 4G devices such as HSPA and LTE.
  • The PA.700.A Viking builds on Taoglas’ successful PA.25.A Anam antenna, which is one of the best selling M2M antennas.
“Product manufacturers are struggling to find LTE antennas in small enough sizes to fit into tight, challenging spaces and still deliver high performance. The PA.700.A Viking improves on the best features of our PA.25.A which is used by the world’s leading auto and medical device makers in extreme environments,” said Dermot O’Shea, Director, Taoglas.  “A comparative antenna to the Viking, with more traditional materials such as metal or FR4 would have a reduced efficiency in this configuration for the same size. No other SMT antenna can match the PA.700.A Viking for the combination of size, durability, frequency range and efficiencies of over 70% on all bands including LTE.”

Taoglas USA, Inc, a provider of antenna solutions to the M2M market, announced that it is leading the market with a full range of GPS and GLONASS-enabled antennas for M2M devices. Taoglas is launching the AA.16X Dominator series of antennas, which have a wider bandwidth to cover the GLONASS operating frequencies up to 1610 MHz, a good axial ratio and a double resonance design for optimum reception at the centre frequencies.   Taoglas will showcase these antennas at CTIA Hall D, booth # 3653 from May 8th -10th 2012.

The AA.161 Dominator is a magnetic mount GPS-GLONASS IP67, external antenna incorporating a 35mm ceramic patch. It is a wide-band active patch antenna product with a large integral ground that delivers a gain up to 35dB.  With the Dominator antenna series, Taoglas is the first company to have a comprehensive range of GPS-GLONASS active embedded antennas (AGGP series) and passive embedded (CGGP) antennas. They are the choice for automotive first tier TS16949 and after-market applications.

“In the coming months, for the first time the true availability of GPS and GLONASS satellites along with the latest generation of GNSS receivers are going to dramatically change the performance of M2M location devices. With close to double the amount of satellites to draw from compared to a stand-alone GPS constellation, we are now going to see quicker time to first fixes with accuracy improving from meters to sub one meter,” said Ronan Quinlan, Director Taoglas.  “The ability to view and lock on four or more satellites in traditionally difficult reception areas such as urban canyons, city centers or locations with restricted views of the horizon, will give M2M manufacturers the ability to triangulate and pinpoint locations with greater accuracy and with quicker time to first fix.”

“Taoglas’ new Dominator antennas have been rigorously tested and pre-approved by the leading GNNS receiver companies worldwide and have been shown to display higher and more consistent gain in comparison to competing antennas. Two key components have been engineered from scratch for the Dominator series, a unique wide-band front end SAW filter (critical to prevent out of band noise entering on both GPS and GLONASS degrading the signal) and a high gain 35mm patch.”

Taoglas USA, Inc., a provider of antenna solutions to the M2M market, today launched the MA.750 Pantheon 5-in-1 Antenna, which is optimized for next-generation transport applications and supports LTE, Wi-Fi 802.11n, emerging 802.11ac and GPS.

A high-efficiency, high-gain MIMO antenna that is also rugged and durable, the MA.750 is aimed at wireless applications for vehicles such as new fleet management and video location solutions that perform real-time video uplinks and downlinks. The new MA.750 combines five high-efficiency, high-gain antennas in a robust, IP67 direct-mount package and offers excellent isolation (20dB+).

The MA.750 has its own ground plane and can radiate on any mounting environment such as metal or plastic without any impact on performance. Its cables are low loss, allowing for lengths of up to 10 meters, which is critical for applications involving buses, trains and other commercial transport vehicles.

"The demand for new wireless communications services in the transport industry is exploding but these require advanced antenna technology which is a critical part in delivering high signal-to-noise ratios and high throughput," stated Ronan Quinlan, director at Taoglas. "Our customers rely on us to continually offer ever-smaller, affordable, high-performance antennas like our new MA.750 that support new and emerging specifications and standards."

Taoglas USA, Inc, a provider of antenna solutions to the M2M market, announced a new market innovation Near Field Communications (NFC) antenna and tag solutions for M2M devices.  The FXT.01 NFC tag antenna and FXR.01 NFC reader antenna operate at 13.56MHz and provide a well-matched solution (50ohms) for NFC readers. Taoglas will showcase these antennas at CTIA Hall D, booth # 3653 from May 8th -10th 2012.

The FXR.01 is a unique off-the-shelf NFC antenna product, which measures 54x37x0.1mm and provides an average NFC tag read distance of 5cm.  It is a flexible polymer antenna, with a coaxial cable, which connects easily to the chipset solution. It is also delivered with 3m adhesive and tape for ease of assembly to a plastic (non-metal) enclosure by a simple “peel-and-stick” method.

“In 2012, it is expected that 1.4 billion cellphones will ship and up to 40% will have a NFC tag. This means that M2M devices can now become NFC readers to cellphones by simply drawing on the NFC technology inside the M2M devices,” said Dermot O’Shea, Taoglas. “For this the Taoglas NFC antenna is an ideal solution for M2M device makers to take advantage of this opportunity and make their devices mobile payment terminals. Taoglas provides access to both their reader and tag technologies in an off-the-shelf “peel-and-stick” solution.

The FXR.01 NFC antenna has an integrated matching circuit to provide effective antenna matching.  The Q of the antenna and matching circuit combination have been selected to provide a solution where bandwidth and read performance have been optimized for best tag interrogation performance.

Custom NFC antenna design is also offered by Taoglas where antenna area is maximized for specific applications in order to enhance interrogation distance. NFC tags are normally attached to the battery of mobile devices, and Taoglas’ NFC tag can also be customized with a ferrite layer to provide isolation from a battery or any other metal or groundplane in a device.

Taoglas has also released a passive NFC tag antenna, the FXT.01. It measures 45x34x0.1mm. This is also a “peel-and-stick” flexible polymer tag solution. The tag design requires no additional matching components. Similar to the FXR.01 antenna, the FXT.01 tag’s dimensions provide interrogation capability to 5 cm distance.  This standard antenna tag is also manufactured in a flexible polymer material for ease of use and installation.

Ideal for use in mobile devices, the BRHL2518 (2.5 x 1.8mm, with a maximum height of 1.5mm) wire-wound chip power inductors help to realize a more compact DC-DC converter, and to enhance power conversion efficiency.

Compared to Taiyo Yuden’s CBC3225T2R2M Series (3.2mm x 2.5mm x 2.5mm), the BRHL2518 reduces volume by approximately 65% and enhances DC-DC converter efficiency by about 5%. The BR Series’ efficiency is achieved through the use of single-sided electrode terminals, optimum core design and the prevention of increased DC resistance through a reduced size. The incorporation of alternative materials in the BRHL2518 has also improved its high frequency characteristics.

The BRHL2518 features low DCR ranges from 0.055 - 0.245 Ohms. Saturation current is 1,500 mA, and inductance is 2.2 µH. Operating temperature is specified at a range of -25ºC to 105ºC.
Taiyo Yuden’s BRHL2518 meets today’s demands for a reduction in size and an improvement in energy efficiency of many digital devices, including mobile devices, compact digital equipment, digital cameras and portable music players.

TAIYO YUDEN CO., LTD. has announced details of the commercial release of three new 4mm square wire-wound power inductors, the NRS4010 (4.0x4.0x1.0mm), the NRS4012 (4.0x4.0x1.2mm) and the NRS4018 (4.0x.4.0x1.8mm), each representing a maximum thickness. At an inductance value of 2.2µH, the NRS4018T2R2M achieves a saturation current of 3.0A, boasting one of the industry’s highest-ranked DC bias characteristics. Compared with Taiyo Yuden’s existing NR4018T2R2M, DC resistance has been lowered by 30% and saturation current improved by approximately 11%.

These products are ideally suited for use in choke coil and filter circuit for DC-DC converters in various kinds of digital equipment including laptop computers, tablet devices, LCD TVs and digital cameras. With the release of these new 4mm square products, Taiyo Yuden has gone one step beyond the conventional 5mm square size to answer customers’ needs for more compact power inductors and higher current needs without sacrificing space, thereby broadening available options.

The new products have been mass produced at the one of the Company’s overseas production sites, TAIYO YUDEN (PHILIPPINES) INC. (located in Lapu-lapu City, Cebu Province) at a total production volume of 10 million units per month. The price of samples is $0.30 per unit for each type.

TAIYO YUDEN CO., LTD. has announced details of the commercial release of two new products expanding its lineup of BR Series power inductors. The new wire-wound power inductor products are the BRL1608, measuring 1.6 mm x 0.8 mm with a maximum height of 0.7 mm, and the BRC2012, measuring 2.0 mm x 1.2 mm with a maximum height of 1.4 mm, for DC-DC converter applications in smartphones, cell phones, digital still cameras and other compact mobile devices.

With the BRL1608 wire-wound chip power inductor, Taiyo Yuden has achieved an industry-leading thinness of 0.7 mm. Compared with the existing BRC1608, measuring 1.6 mm x 0.8 mm with a maximum height of 1.0 mm, the BRL1608 realizes a reduction in height by 30%. On the other hand, when placed against the existing BRC2016, measuring 2.0 mm x 1.6 mm with a maximum height of 1.8 mm, the BRL2012 delivers an approximate 42% reduction in volume ratio size. Complementing this cutback in size and height, the BRL1608, with 0.13O at an inductance of 1µH, lowers DC resistance by approximately 28% when compared with conventional products. The BRC2012, with 0.060O at 1µH, also delivers approximately 29% lower DC resistance than the previous product.

Taking these factors into consideration, Taiyo Yuden is confident that each product will contribute to reductions in mobile device size, thickness and power consumption. Production began in May 2010 at an output pace of 20 million units per month for both products. The price of samples is $0.20 per unit for each type.

TAIYO YUDEN CO., LTD. introduces the Polyacene Capacitors (Supercap) PAS2126FR2R5504, measuring 26 mm x 20 mm with a maximum height of 0.9 mm. At a remarkable 0.9 mm thin, the Polyacene Capacitor realizes a high capacitance of 0.5F. This product is ideally suited for pulse current discharge of LED flash, which enables clear photographic images at low light conditions, used in mobile phones, smartphones, digital still cameras and digital camcorders, where demand centers on more compact and thinner devices. In addition, the Polyacene Capacitor can be used for pulse current discharge required by portable printers and scanners as well as SSD’s uninterruptible power supply applications.

Production began in August 2010 through subsidiary company TAIYO YUDEN ENERGY DEVICE CO., LTD. (Kikuji Fukai, president and representative director; Ueda City, Nagano Prefecture) at an output pace of 1 million units per month. The sample price is $3.9 per unit.

Thursday, June 28, 2012

Selecting multilayer ceramic capacitors for use in onboard aircraft systems has just become much easier, with the announcement from Syfer Technology of a new range of devices designed specifically for these applications. Rated for operation at 115Vac 400Hz, these MLCCs can be supplied in a range of package sizes and capacitance tolerances to suit a number of avionics system requirements.

Syfer's Marketing Manager, Chris Noade, commented: “This range is aimed squarely at applications in aircraft, where much of the equipment is powered by lines running at 115Vac 400Hz.”  The devices are designed to take into account associated voltage and frequency transients as specified in MIL-STD-704, Noade explained.

Multilayer chip capacitors are typically supplied with a dc rating only, such that the designer has to apply whatever he considers an appropriate de-rating.  There are a number of factors to consider including reliability, the rms vs peak voltage trade-off and operating frequency.

Now Syfer has conducted reliability testing on its parts specifically to ensure the required performance in 115Vac 400Hz device applications.  The higher frequency rating can lead to self heating due to losses in the capacitor, creating additional stresses on the parts.  But Syfer's characterisation work shows the heating effects are limited to an acceptable level of a 25°C rise with neutral mounting at room temperature.

Accelerated life testing has also been carried out at maximum rated voltage and frequency, and at elevated temperatures, to ensure reliability. With the assurance of higher reliability, avionics designers today do not need to spend time establishing an equivalent dc working voltage for MLCCs but need only consider physical size, capacitance and dielectric type.

Syfer's avionics MLCCs are available in a choice of X7R or ultra-stable C0G dielectrics, with capacitance values from 4.7nF to 100nF and 330pF to 15nF respectively.

Package size, depending on capacitance required, ranges from 0805 to 2220.  Termination options include nickel barrier for RoHS compliance and tin/lead for RoHS-exempt application where developers may be concerned about the possibility of tin whiskers, which can be regarded as possible cause of short circuits. FlexiCap™, Syfer's proprietary flexible polymer termination option, offers increased security against the possibility of cracking due to substrate flexing during board assembly, depanelisation or temperature cycling during operation.

Syfer has announced that its E01 and E07 ranges of feedthrough 3 terminal ‘C’ chip filters are now available in smaller packages, as small as 0603. These devices are designed primarily for general signal filtering in circuits incorporating high speed digital circuitry, particularly in automotive and communications industries.

In operation, the filtered signal passes through the chip’s internal electrodes and the noise is filtered to the grounded side contacts, resulting in reduced length noise transmission paths. This helps ensure reduced inductance, compared to conventional multilayer chip capacitors (MLCCs), when used in signal line filtering. When used to help provide electromagnetic compatibility, the filters effectively block electromagnetic interference (EMI) emanating from high speed circuitry, and prevent the propagation of high frequency noise along power lines.

Devices in the range are available in C0G/NP0 and X7R dielectrics, with voltage ratings ranging from 25Vdc to 200Vdc. Current ratings available include 300mA (E01), and 1A and 2A (E07). The higher current parts are ideal for installing on the DC power lines on printed circuit boards. With the DC current fed directly through the E07 chip filters, PCB designers will find that a significantly improved high frequency filtering performance is the result. Many of the parts in the E01 lower current (300mA) range are qualified to the automotive AEC-Q200 standard.

Depending on the capacitance and voltage rating required, the chip capacitors are offered in package sizes from 0603 to 1806. The newest filters come in the smallest 0603 package. Typical devices offer a capacitance range of 150pF to 390pF (300mA, C0G dielectric, 25V) or 2.7nF to 12nF (1A, X7R, 50V).

Devices in both the E01 and E07 ranges are also available with Syfer’s FlexiCap™ termination.  Tin-lead plated devices are optionally available for use in high reliability, RoHS exempt applications, such as in the space/aerospace industry, where tin whiskers can be considered an issue.

Selecting the best multilayer chip capacitor (MLCC) for the application can involve difficult trade offs involving stability, capacitance and cost. European passive component manufacturer, Syfer Technology, has introduced a range of devices that increases the choice and reduces compromise.

For applications that require maximum stability, then chip capacitors based on the C0G/NP0 dielectric are the obvious choice as capacitance does not vary with applied voltage. But what if you want higher capacitance values than the few nF maximum typically available in C0G?

X7R capacitors deliver higher capacitance, as they have a dielectric constant in the region of 2000-4000. With more capacitance per unit volume, they are generally smaller for the comparable capacitance values, and are typically much lower cost than C0G. However, their capacitance variation with temperature can be as much as ±15% over the temperature range from -55°C to +125°C with no voltage applied. In fact no limit at all is specified for X7R with applied voltage, and so significant capacitance loss can occur. This effect is magnified for less stable dielectrics.

But now X7R dielectric MLCCs are available from Syfer with a defined capacitance variation under applied DC voltage, across the full operating temperature range. Derating or using a higher voltage rating can reduce the capacitance drop but where an application requires more stable performance with minimal voltage derating then these parts are particularly suitable. The advantage of devices with a clearly specified limit for the fluctuation is that they give designers the data they need to make an informed choice for their application.

Syfer’s TCC/VCC range of X7R MLCCs is available in two versions. The “B” code dielectric conforms to MIL STD BX dielectric and IECQ-CECC 2X1 standards, while the “R” code dielectric (conforms to MIL STD BZ dielectric and IECQ-CECC 2C1 standards.) The 2X1 (BX) devices, for example, are the most voltage stable of the X7R versions, at +15 to –25% capacitance charge with full rated DC voltage applied across the full temperature range. The 2C1(BZ) offer +20 to -30% capacitance charge.

The 2X1 (BX) range includes devices rated at 50V, 100V and 200V, and with capacitance ranges from 100pF to 4.7nF (50V, 0603), through 2.7nF to 180nF (50V, 1808) up to 15nF to 1µF (50V, 2225). Comparable devices in the 2C1 (BZ) range are 100pF to 5.6nF (50V, 0603), 2.7nF to 220nF (50V 1808), and 15nF to 1.5µF (50V, 2225).

These X7R dielectric MLCC ranges are eminently suitable for use in a wide range of coupling and power supply bypassing applications, while the higher voltage types are particularly sought after in switching power supplies, dc-dc converters, automotive and aerospace equipment.

The devices are available with FlexiCap™ terminations using Syfer’s proprietary flexible termination material, which make them considerably more resistant to damage through bending or flexing, and when under stress and temperature cycling extremes. Alternative terminations are also available.

Leading UK passive component manufacturer, Syfer, has announced the availability of a number of important extensions to its already wide range of solder-in panel mount EMI filters.

Advanced in-house research and development has resulted in the introduction of a series of discoidal capacitor versions, which offer the advantage of high capacitance values, up to several microfarads, in a compact and robust package. Ideal as low-profile, panel mount filters, the SFSS devices are constructed with a discoidal capacitor soldered to a feedthrough pin. They are offered with a choice of C0G/NP0 or X7R ceramic dielectrics.

Available in 5 different diameters (2.3mm, 2.8mm, 3mm, 5mm and 8.75mm), capacitance values range from 10pF to an impressive 2.2µF. Working voltages range from 50V to 3kV and operating temperature range is -55 to 125oC. These devices are able to withstand a solder-in temperature of 250°C. Syfer maintains its global reputation for performance, offering the highest voltage and capacitance for any given size. For designers looking for space saving solutions, Syfer’s solder-in EMI filter ranges allow the specification of smaller parts when compared to competitive offerings. Custom devices can also be produced on request.

Aimed primarily at applications where high filtering performance is required, these low cost, yet robust and reliable devices will also meet the demands of equipment manufacturers in the communications, industrial, military/aerospace and sensors markets.

The SFSS discoidal series joins the existing SFSR, SFST and SFSU ranges of feedthrough EMI filters for soldering direct to a chassis or panel, suitable for hole diameters of 2.9mm, 3.5mm and 5.8mm respectively. Featuring a metal body and epoxy encapsulation, they offer superior filtering performance in a robust package. Working voltages are from 50Vdc to 500Vdc.

With an introduction that provides systems integrators and their clients with direct sunlight-readable digital signage displays that are completely weatherized and optimized for outdoor use to enable a broader base of businesses to deploy, SunBriteTV today debuted the new Marquee Series All Weather Digital Signage Displays at InfoComm 2012. Employing SunbriteTV’s proprietary Enhanced Solar Tolerance (EST) technologies and standard weatherproof features, the Marquee Series offers the best performing, most durable, affordable, and easiest outdoor digital signage solutions in the industry. At InfoComm 2012, SunBriteTV, the innovator and global leader in outdoor TV technology, is showcasing the company’s groundbreaking digital signage products with screen sizes ranging from 47- to 55- inches.

“There has long been a need for true all-weather digital signage displays that can perform in intense direct sun-light,” said Tom Dixon, Vice President of Marketing for SunBriteTV. “With the introduction of the SunBriteTV Marquee series, we have created a product that commercial integrators have dreamed of: a true outdoor all-weather flat panel display that will not go black in direct sunlight. We’re excited about this new product and believe the unique value proposition of the Marquee series will open up a host of new markets and applications for our commercial integrators.”

Available in 47-inch (DS-4707EST) and 55-inch (DS-5507EST) sizes, the Marquee Series features a weatherproof design and ultra-bright LCD displays that have the ability to perform in direct sunlight with no isotropic blackout effects.

The SunBriteTV Marquee Series offers the same qualities of all-weather durability, full 1080p HD image quality and high value that have made SunBriteTV’s outdoor TVs an industry standard. Both models feature extra bright 700nit LCD panels and SunBriteTV’s high-temperature Enhanced Solar Tolerance (EST) technology that cools the LCD panel. The result is a high performance HD display that delivers incredibly bright images and is capable of enduring exposure to direct sunlight while avoiding isotropic blackout, without the need for external housings and cooling systems that are employed in current applications.

The Marquee Series displays are designed with extremely tough and durable powder-coated aluminum all-weather exterior construction, and are engineered to resist moisture, humidity, dust, insects, sunlight and temperature extremes. A comprehensive array of video and audio connections is provided, to facilitate use with a wide variety of signal sources. All Marquee Series digital signage displays include a tempered anti-reflective glass front window that provides added protection to the LCD screen and include a sealed wiring compartment to keep moisture out.

SunBriteTV provides a host of wall-, ceiling- or pole-mount installation options for both of these models. All SunBriteTV outdoor TVs are backed by a two-year warranty. SunBriteTV Marquee Series digital signage displays will be available in Summer 2012 at MSRP of $4,995 (DS-4707EST) and $6,995 (DS-5507EST).

STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, and Wasion Group, China’s leading supplier of advanced energy-metering products and solutions, announced the availability of NFC-enabled post-pay power meters for deployment in the municipal grid of ChongQing, China. Wasion’s new meters rely on ST’s Near-Field Communication (NFC) technology enabling convenient mobile payments of electricity bills with uncompromised data security.

ST’s NFC system-in-package solution uses the international-standard 13.56MHZ RF interface adopted for NFC mobile phones worldwide. With Wasion’s post-pay NFC power meters, consumers can use their NFC mobile phones to read smart meters via a contactless RF interface and send the encrypted data over the 2G/3G mobile network to the banking back-end to complete the electricity-fee transaction.

The system-in-package contains an NFC contactless interface (ST21NFCA) and a Secure Element (ST33F1M). The ST33F1M Secure Element embeds a secure operating system from Gemalto, based on Global Platform GP2.2/Java3.0.1, which is among the most advanced secure NFC payment platform available in market. The Java OS and Java applets provide a secure environment for the application to run and store metering data. With this level of security, the same solution can also be used for pre-pay contract users. The STGNFC is used along with an STM32 MCU and ST’s EEPROM in Wasion’s power meters.

ST is one of the first semiconductor manufacturers to offer both the NFC controller and a high-performance SWP1 Secure Element to provide a complete NFC mobile payment solution. By working with various mobile phone makers, mobile operators, and smart card vendors, ST can deliver a competitive complete NFC solution and product offer to the market.

“Our NFC solution with high-performance Secure Element assures a secure user experience when making mobile payments with NFC-enabled smart phones,” said Arnaud Julienne, Director, MMS Marketing and Application, Greater China & South Asia Region, STMicroelectronics. With Wasion’s dedicated application running on an NFC-enabled mobile phone, users can easily make their electricity-fee payments from home.”

“ST’s innovative solution can be adapted for use in various applications such as Smart Metering, NFC mobile payment applications, and Internet of Things, enabling equipment manufacturers to ride the popular mobile payment trend by offering NFC payment capability on their products.” said Xijun Feng, Wasion’s Chief Technology Officer.

The NFC-enabled power meter prototype has been available since January 2012 and volume production will begin in June 2012.