Friday, August 31, 2012

Carlisle Interconnect Technologies announced the availability of two new connector lines to its push-on family – the TMP® and WMP® series, at last week’s IMS conference  held in Montreal, Canada. The TMP® family is designed to provide higher power handling capacity, similar to an SMA connector, for use in Radar and other high power RF & Microwave systems. The TMP® interface enables mode-free operation to 23 GHz, and is rated to handle above 200 Watts of power in the S-band. This makes it ideal for a myriad of high power military and defense applications.

The WMP® product line, in contrast, is the smallest form factor connector series within the push-on family. Designed specifically for high density microwave packages where space is a premium, the WMP® bullet adapter enables a stackable PCB height of < 0.120” (or about the same thickness as two pennies stacked on top of each other). The WMP® interface is specified up to 65 GHz; however, it can support operation to 100 GHz for millimeter-wave designs.

Both connector series provide the benefits of a push-on interface i.e. simple connection and ease of use in dense packages; and include PCB mount, Field Replaceable, Microwave Cable, and Custom connector configurations.

An article by TriQuint's Tuan Nguyen and Mark Andrews in the June issue of Microwave Product Digest describes two new best-in-class GaAs E-pHEMT low-noise amplifiers: the TQP3M9036 (400 to 1500 MHz, 0.45dB noise figure) and the TQP3M9037 (1500 to 2700 MHz, 0.40dB noise figure). You can also download the article.

TriQuint's new LNAs are well suited for 3G / 4G cellular base stations, tower-mounted amplifiers (TMAs), small cell wireless networks, repeaters, 700 MHz LTE networks, and emerging UHF “white space” systems. They simplify design by integrating key functions on-chip along with digital shut-down biasing capability for the growing TDD-LTE market. Both devices are now in low volume sampling, ramping to production in September.

TriQuint has released a new family of SAW-based, non-dispersive delay lines that offer wideband performance for communications, sensors, radar and electronic warfare (EW) applications. The family includes eight 1,000 MHz devices providing a wide range of BW, IL, delay and VSWR combinations. All products offer low amplitude variation and high selectivity with neighboring frequencies.

The devices are self-matched to 50 ohms and are available in standard 4-pin kovar flatpacks. SAW delay lines offer tremendous size and weight advantages compared to traditional coaxial delay lines and require no power compared to digital delay setups. TriQuint's new delay lines are robust and ideally suited for high-reliability applications.

TriQuint's latest amplifier product solutions offer high performance and packaged convenience for easier assembly. The new amplifiers include the TGA2501-GSG (6-18 GHz); the TGA2554-GSG (8-11 GHz); and the TGA2536-FL (13-16 GHz).

Defense Products & Foundry Services director Tony Balistreri said, "These devices are part of TriQuint's new Rapid Release program that offers solutions with long-standing reliability and performance in standard packages. These high-performance devices were previously available only as die-level products." Samples and evaluation fixtures are now available.

TriQuint's new TQP7M9105 and TQP7M9106 packaged GaAs RF driver amplifiers have the highest linearity in their class and are optimized for GSM / CDMA / WCDMA and LTE base transceiver stations. Their broad bandwidth also makes them well suited for remote radio heads, small cell amplifiers, defense communications systems, and other applications between 50 to 1500 MHz.

The TQP7M9105 delivers P1dB RF power of 1W (+30dBm) with an Output Third Order Intercept Point (OIP3) of 49dBm, gain of 19.4dB, and power consumption of only 220mA from a single +5V supply. The TQP7M9106 produces P1dB power of 2W (+33dBm), OIP3 of +50dBM, gain of 20.8dB, and draws only 455mA from its +5V supply. These rugged, integrated amplifiers provide protection against RF input overdrive, DC overvoltage, and ESD.

Tripp Lite, a world-leading manufacturer of power protection and connectivity solutions, has expanded its line of healthcare solutions to include the PSCLAMP Mounting Clamp and PS410HGOEMX Medical-Grade Power Strip. The new mounting clamp and medical-grade power strip feature built-in cord management systems and optional drip shields to provide protection from fluids, prevent cord damage and reduce tripping hazards in medical applications, leading to a safer, more organized workspace.

Key Features and Benefits:

PSCLAMP Mounting Clamp
•     Provides a safer environment when mounting medical-grade power strips on IV poles, beds, carts and other healthcare equipment
•     Mounting clamps fit diameter from 3/4" to 2 1/4" in a variety of applications
•     Included cord management system and optional drip shield
•     Fits any Tripp Lite Medical-Grade Power Strip

PS410HGOEMX Medical-Grade Power Strip
•     Versatile power distribution for mobile healthcare applications
•     4 hospital-grade receptacles and hospital-grade plug
•     All-metal housing with built-in cord management system and optional drip shield
•     Tested to UL1363A to supply power to plug-connected components of moveable equipment

Toumaz Limited (AIM: TMZ, ‘Toumaz’ or ‘the Group’), a pioneer in and provider of ultra-low power, high-performance wireless communications technologies and solutions, has today completed the acquisition of Frontier Silicon Limited ('Frontier') as announced on 3 July 2012.

Anthony Sethill, CEO of Toumaz, commented:

“Bringing these two innovative UK technology companies together is a very exciting event. Toumaz’s wireless solutions have huge potential and combined with the software systems, commercial expertise and customer access of Frontier, we will create a leading provider of wireless semi-conductor solutions. These target the healthcare, sport and fitness and consumer electronics sectors, together with our strategic technology partner and shareholder, Imagination Technologies PLC.

“The new enlarged Group is already the global leader in digital radio solutions, having shipped over 17 million chip sets to date. This market will continue to expand as more territories adopt digital radio and will be further enhanced by the availability of new lower cost, higher performance chipsets, making digital radio more accessible.

“Our professional healthcare offering continues to be a key focus for the group with clear market needs to be addressed. Up to 87% of hospitals in the US have stated an interest in installing wireless monitoring technology in the next two to five years* and our healthcare product aims to be a key driver in the evolution of healthcare monitoring. The Toumaz “Sensium Vitals” monitoring solution has FDA approval and will shortly start pilots in the US.

“By 2016, the global market for wireless sports and fitness monitoring devices is forecast at 120m units** and the opportunity to leverage our healthcare capabilities into the consumer arena is significant.”

THAT Corporation, a leading provider of high-quality audio technologies, today announced that it has partnered with  Earthworks® Audio to create a customized dbx-tv omnidirectional measurement microphone for its new dbx-tv® Total Cal audio calibration tool - a PC-based acoustic measurement and configuration system that simplifies and shortens the time required to configure a TV’s audio system.

Each Total Cal system utilizes a minimum of three state-of-the-art dbx-tv / Earthworks microphones to capture the sonic fingerprint of the TV audio system being measured through the built-in speakers. By comparing these sonic profiles to a series of preconfigured test tones, Total Cal is able to assess the performance of the TV’s existing hardware and automatically adjust its audio system to meet the setmaker's sonic objectives. Using a proprietary genetic tuning algorithm and the myriad parameters of dbx-tv’s Total Sonics audio software suite, Total Cal achieves remarkable results that can be auditioned in just minutes without the need for a trained audio engineer.

“In order for our Total Cal audio measurement and calibration solution to deliver the best possible results, we knew we would need to specify incredibly sensitive transducers throughout the system,” said Tim Brault, dbx-tv’s Product Manager for Audio Enhancement Products. “Earthworks microphones are known throughout the audio industry for their superior flat and wide frequency response, superb handling of transients, and accurate polar characteristics. “Since our respective companies share a common dbx heritage, and Earthworks has a stellar reputation for manufacturing the highest quality microphones, it was only natural to ask our friends at Earthworks to help us create something special for  Total Cal.

“Over the years, Earthworks has teamed up with dbx-tv on a number of successful audio measurement projects,” said Bill Norton, COO of Earthworks Audio. “Our new dbx-tv microphones are incredibly accurate in terms of time domain and flat frequency response with virtually no handling noise. As a result, they are ideally suited for the exacting, free-field acoustical measurement requirements of dbx-tv’s Total Cal system.”

THAT Corporation, a leading provider of high-quality audio IC technologies, today announced the latest addition to its best-in-class IC product line -- the THAT5173 digital gain controller, a cost-effective, high-quality solution for digitally-controlled audio preamplifier applications.

Accepting full pro-audio signal levels up to +27.5dBu without an input pad, the 5173 maintains exceptional performance over a wide range of gains and signal levels. Thanks to its advanced design and integrated DC servo amplifier, the 5173 provides click-less digital gain control for differential analog current-feedback preamplifiers. The small 5mm x 5mm 5173 controls gain from 0dB to 60dB in 3dB steps, with low noise and distortion.

The 5173 is designed to operate seamlessly with the THAT1570 high performance current-feedback amplifier, THAT's state-of-the-art analog differential microphone preamp. In combination with the 1570, the 5173 operates with supplies from ±5V to ±17V. Its differential output is ideal for connection to high-performance, differential-input A/D converters.

“The 5173 is the first significant extension to our existing line of digitally controllable preamplifiers,” said Les Tyler, President, THAT Corporation. “Customers who require the ultimate in performance will select the 5171/1570 combination, while those who are more cost-conscious will find the 5173/1570 strikes an appropriate balance between cost and performance. 3dB steps are appropriate for many mic preamp applications, and by accepting full pro audio levels without a pad, the 5173 saves space over other approaches.”

The THAT5173 digital gain controller is targeted for high performance digitally-controlled preamplifiers, either as standalone products, or within audio mixing consoles, PC-audio breakout boxes, and instrumentation amplifiers. The IC comes in a QFN24 package. It features a wide gain range of 0 to 60dB in 3dB steps, a supply range of ±5V to ±17V, an output and input swing of up to +27.5dBu (± 17V supply) and a low 1kHz THD under 0.001% for gains up to 42dB.

Texas Instruments Incorporated (TI) (NASDAQ: TXN) today introduced the industry's most flexible and highly integrated clock jitter cleaner/multiplier for use in wired communications and test and measurement applications. The LMK04906 offers three redundant inputs with a holdover feature and seven programmable outputs. This flexibility allows designers to eliminate external components, such as oscillators and clock buffers, significantly reducing their bill of materials (BOM) cost and board space. In addition, with industry-leading RMS jitter of 100 fs and noise floor of -160 dBc/Hz, the LMK040906 can improve signal integrity in high-speed data communications systems.

Key features and benefits of the LMK04906
  •     Maximum flexibility: Integration of seven high-performance, programmable outputs offered in LVDS, LVPECL and LVCMOS simplifies timing design.
  •     Integration reduces BOM costs: High integration eliminates the need for the oscillators and clock buffers typically used to implement a low-jitter clock tree. Features such as holdover, input switching, analog/digital delay, and odd/even dividers increase clocking functionality while reducing cost.
  •     Industry's lowest jitter and phase noise: 100 fs RMS jitter from 12 kHz to 20 MHz with a noise floor of -160 dBc/Hz at 156.25 MHz output frequency enables greater signal integrity in high-speed data communication links such as 10GbE, FC, FCoE, and SAS/SATA.
In addition, TI introduced the CDCM6208 clock synthesizer and jitter cleaner, which offers similar integration and flexibility for wireless base stations, pico and femto cells, line cards and handheld medical equipment. The CDCM6208 provides eight low-jitter clock outputs, pin-control mode, flexible output voltages, and a fractional divider.

The LMK04906 and CDCM6208 can be combined with the following devices to create a high-speed data link: TMS320C66x KeyStone Multicore DSP, LMK00301 3-GHz differential fanout buffer, LMK03806 clock generator with 14 outputs, DS100DF410 10GbE quad-channel retimer, LP3878-ADJ 800-mA low-noise LDO regulator, and TLK10002 dual-channel 10-Gbps multi-rate transceiver.

Texas Instruments Incorporated (TI) (NASDAQ:TXN) today expanded its industry-leading portfolio of current shunt monitors with four new devices. The integrated circuits (ICs) monitor power supply current, voltage and power values with best-in-class features that reduce board space and bill of materials (BOM), while delivering high accuracy. The INA3221, INA282, INA223, and LMP8480 current shunt monitors are optimized for a wide range of end-equipment, from smartphones, tablets, computers and servers, to power management devices, battery chargers, and industrial, telecommunications and test equipment.

Key features and benefits:

INA3221: Triple-channel shunt and bus voltage monitor with I2C interface
  •     Industry's first triple-channel device with digital interface enables monitoring of three separate voltages, eliminating the need for discrete devices for each voltage rail.
  •     80-uV maximum offset voltage and 0.5-percent gain error enable highly accurate current measurement and precision over-current detection for end equipment such as notebook and desktop PCs, base stations and servers.
INA282: Wide common-mode range, bidirectional, high-accuracy current shunt monitor
  •     70-uV maximum offset voltage and low gain error enable the use of smaller shunt resistors to reduce power consumption, board space and BOM.
  •     First device to combine wide common-mode range (-14 V to +80 V) and high common-mode rejection ratio (120 dB) with low offset voltage across multiple gain options. This feature combination increases accuracy in high-voltage applications, such as industrial system power units and telecom power systems.
INA223: Analog output current shunt, voltage and instantaneous power monitor
  •     Industry's first analog multiple output current shunt device offers multiplexed current, voltage and instantaneous power values to reduce board space and BOM.
  •     Programmable gain of 20, 128 and 300 allows operation over a wide dynamic current load without switching the sensing element, improving response time and accuracy in high precision products, such as such as battery-powered notebooks, mobile phones and tablets.
LMP8480: Precision high-side current sense amplifier with voltage output
  •     High common-mode voltage range of 4 V to 76 V and a high supply range of 4.5 V to 76 V reduce system cost by allowing the device to be powered from the same voltage node it is monitoring.
  •     Input offset voltage of 265 uV, 50-percent lower than the competition, increases sensing accuracy in high-precision applications, such as telecom, automotive and solar power monitoring.
Designers can develop a system management solution by combining an INA3221, INA222, INA223 or LMP8480 current shunt monitor with TI's OMAP TM processors, Stellaris® ARM® Cortex™-M microcontrollers, LM75A or TMP75 temperature sensor, as well as a wide range of analog monitoring and control integrated analog-to-digital converter (ADC) and digital-to-analog converter (DAC) solutions, such as the AMC7812 or LMP92001.

Texas Instruments Incorporated (TI) (NASDAQ: TXN) today introduced a high current, ultra-low noise, low dropout (LDO) voltage regulator that achieves the industry's lowest noise at low frequency. The 1-A TPS7A4700 LDO linear regulator features less than 4.17-uVrms output noise over the 10-Hz to 100-kHz bandwidth, eliminating the need for expensive and bulky filtering in a wide range of high-performance applications, including telecom, industrial, RF, medical, avionics and military.

TI's new TPS7A4700 LDO uses a unique feature that enables the setting of any output voltage rail in 100-mV increments with simple printed circuit board (PCB) layout changes. This eliminates the need for expensive, high accuracy, external feedback resistors, which saves board area and reduces component count when compared to existing solutions.

With digital control methods such as I2C or PMBus, the user can program the output voltage by selecting to either ground or open the binary-weighted device pins. See the application note for more information:

For systems where both positive and negative voltage rails are required, the TPS7A4700 can be used together with TI's -36V/-1A TPS7A3301 LDO linear regulator. Watch a video on how to pick an LDO for noise-sensitive applications:

Key features and benefits of the TPS7A4700 LDO regulator
  •     Industry's lowest noise at low frequency eliminates the need for expensive and bulky filtering in high-performance applications.
  •     Wide bandwidth and high power supply rejection (PSR) allow effective filtering of DC/DC switching supplies running at higher frequencies.
  •     36-V input voltage rating allows use in systems running 12-V and 24-V buses with enough headroom to withstand high-voltage transients, eliminating the need for additional suppression circuitry.
  •     Unique feature provides any output voltage rail in 100-mV increments, eliminating the need for expensive external feedback resistors.
Availability, packaging and pricing

The TPS7A4700 is available in volume now from TI and its authorized distributors. Offered in a 20-pin, 5-mm by 5-mm QFN package, the suggested retail price is $2.10 in 1,000-unit quantities.

Enabling easier and more cost-effective motor control development, Texas Instruments Incorporated (TI) (NASDAQ: TXN) today announced four new compatible motor control kits that spin three-phase brushless DC (BLDC) motors in minutes. Developers can now scale their product lines using TI's broad portfolio of microcontrollers (MCUs) ranging from 16-bit ultra-low-power MSP430 devices to 32-bit ARM-based, floating-point Hercules safety and Stellaris MCU solutions. All four kits are part of a robust and growing ecosystem that provides all of the hardware, software and documentation necessary to get motors spinning out of the box in minutes.

The four new motor control kits include object-oriented software functions and drivers that make coding extremely easy and compatible, which enables simple and cost-effective portability across TI MCU and motor driver families. Each motor control kit includes a reliable, fully protected motor driver monitoring cycle-by-cycle over-current, over-temperature, cross-conduction and under-voltage situations.  This level of integrated protection reduces design complexity and board space and ensures higher system reliability.

Modular tools and software further ease design

A plug-in controlCARD module lets developers choose the right combination of motor driver for voltage, current and experimentation with different MCUs for control. All of the kits have the required firmware to run TI's sensorless InstaSPIN-BLDC™ motor control software solution out-of-the-box. InstaSPIN-BLDC is an innovative and free back-electromagnetic field (EMF) technique that sensorlessly spins any motor in seconds without knowledge of a motor's parameters. Unlike traditional back-EMF zero crossing techniques, InstaSPIN-BLDC extends sensorless operation to lower speeds and is highly immune to miscommutation caused by rapid speed changes. The Stellaris kit also includes a sensorless sliding mode observer (SMO) field oriented control (FOC) speed plus torque control application while the Hercules kits add firmware for sensored (encoder) speed plus torque control with SMO as sensorless redundancy for safety systems.

Additionally, all motor control kits contain TI's Code Composer Studio™ integrated development environment (IDE), as well as a graphical user interface to run examples and demonstrations with either the included or a self-provided motor.

Features and benefits of the MSP430 DRV8312-430FR-KIT motor control kit:
  •     controlCARD module with MSP430FR5739 MCU features 24 MHz performance, 16KB FRAM, five 16-bit timers, 10-bit ADC and more features that allow developers to create robust yet cost-efficient motor control designs with a tiny footprint.
  •     Ultra-low-power, non-volatile ferroelectric random access memory (FRAM) technology on-board allows for incredibly fast read and write time, unified memory capable of storing program and info data on one memory block and virtually unlimited write endurance.
  •     Free supporting software includes motor control source code and InstaSPIN-BLDC library, as well as access to MSP430Ware – a complete collection of software resources including peripheral driver libraries and APIs.
  •     DRV8312 motor driver spins sub-50V, 3.5A continuous three-phase motors.
Features and benefits of the Hercules DRV8301-LS31-KIT (TMS570) and DRV8301-RM48-KIT (RM4x) safe motor control kits:
  •     Include a controlCARD module featuring a dual core, lock-step Hercules ARM Cortex-R4F safety MCU with floating point with up to 220 MHz performance, 3 MB of Flash and a safety architecture that is ideal for transportation (TMS570) and industrial (RM4) safe motor control.
  •     Enable customers to meet safety standards such as IEC61508 and ISO26262 by leveraging the Hercules safety MCU architecture.
  •     Generate PWMs and decode the quadrature encoder signal with example microcode for the flexible, integrated 32-channel timer coprocessor.
  •     Include a state-of-the-art servo motor from Teknic with built-in encoder and hall sensors for providing robust rotor angle measurements to complement the shunt current based rotor angle estimation from the sliding mode observer.
  •     Leverage standard Hercules software to ease the development of safe motor control solutions with peripheral support and configuration via HALCoGen, connectivity stacks and example motor projects.
  •     Build upon the highly-integrated DRV8301 motor pre-driver which includes self protection and two programmable gain amplifiers to control sub-60V inverters with external FETs.
Features and benefits of the Stellaris DK-LM4F-DRV8312 motor control kit:
  •     Includes a controlCARD module with Stellaris LM4F211 MCU featuring 80 MHz ARM Cortex-M4 floating point core, 256 KB Flash and two 12-bit ADCs for applications including industrial pumps, fans, blowers, compressors, vacuums, tools and robotics.
  •     Stellaris LM4F211 MCU with floating point provides all the necessary computational requirements to run technology variety of motor control solutions, StellarisWare® software libraries and other customer-developed applications.
  •     DRV8312 motor driver spins sub-50V, 3.5A continuous three-phase motors.

Pricing and availability

Developers can get started immediately with these new motor control kits. The Hercules DRV8301-LS31-KIT and DRV8301-RM48-KIT safe motor control kits are $499 USD and include the Teknic servo motor and a 24V power supply.   The MSP430 DRV8312-430FR-KIT and Stellaris DK-LM4F-DRV8312  kits are available for purchase for $299 USD and include a 24V NEMA17 BLDC motor with hall sensors and 24V power supply. Developers with a compatible motor driver base can also buy the Hercules TMDX570LS31CNCD or TMDXRM48CNCD controlCARD modules for $99 USD. The MSP430 MSP-CNCD-FR5739 and Stellaris MDL-LM4F211CNCD controlCARD modules are available separately for $49 USD.

Maxim Integrated Products, Inc. (NASDAQ: MXIM) announces a 40G transmitter chipset that provides data centers with 4x the data throughput, at very low power, and in little more space than conventional single-channel alternatives. The new 4-channel 40GBASE-LR4 QSFP+ chipset comprises the MAX3948 DC-coupled laser driver and the DS4830 optical microcontroller.
Data centers and data communication networks need to significantly increase data density while staying within their already constrained power budgets. Maxim’s QSFP+ transmitter solution addresses both challenges. The QSFP+ modules supply 4x the data throughput in only 1.5x the area of a single-channel SFP+ solution. Equally important, Maxim’s chipset enables 4 x 10Gbps QSFP+ modules to consume less power per channel than single SFP+ modules. Service providers and network operators can now enjoy the benefits of a low-power solution that extends system life, reduces operational expense, and conserves valuable energy resources.

MAX3948 Key Advantages
  •     Consumes less than 2W for 4 transmit channels, enabling less than 3.5W QSFP+ module power consumption.
  •     DC-coupled laser interface (patent-pending, application number 13/352,011) reduces power consumption and external component count.
DS4830 Key Advantages
  •     On-chip 13-bit ADC with dedicated round-robin offloads 16-bit microcontroller core and lowers clock speed; saves 75mW to 100mW compared to competitive solutions.
  •     Single-cycle multiply accumulator (MAC) allows DS4830 to speed through filter calculations and easily maintain four average power control (APC) loops.
  •     "Power consumption has emerged as the single most critical constraint in today’s data center," said Karen Liu, Principal Analyst at Ovum. "It limits density and performance which, in turn, determine cost. Maxim’s chip innovation tackles this key problem."
  •     "The MAX3948 and DS4830 demonstrate Maxim’s innovative approach to integration. This chipset resolves power-density limitations in data-center interconnects by utilizing DC coupling to the laser," said Dr. Andrew Sharratt, Senior Business Manager at Maxim Integrated Products. "This transmitter solution meets all QSFP+ requirements and provides minimum power dissipation."
Availability and Pricing

  •     MAX3948
    •         Available in a 3mm x 3mm, 16-pin TQFN package.
    •         Specified for the -40°C to +95°C temperature range.
    •         Pricing starts at $5 (1000-up, FOB USA).
  •     DS4830
    •         Available in a 5mm x 5mm, 40-pin TQFN package.
    •         Pricing starts at $2.85 (1000-up, FOB USA).
A reference design is available upon request.

Maxim Integrated Products (NASDAQ: MXIM) announced that its newest Power SoC chipset in the Galaxy S® III operates with the Exynos 4412 quad-core applications processor to provide a smaller, much thinner, and significantly more efficient smartphone.

Maxim's newest Power SoC chipset covers all power management, charging, and USB multiplexing needs. It provides an optimized balance between size and flexibility to power the Samsung® applications processor and baseband processor. It maximizes battery usage and enhances USB connectivity. Managing the power for upwards of 60 channels, the chipset offers up to 20 percent more conversion efficiency compared to the previous generation. Maxim's unique Green Mode regulators and subregulation architecture, along with the company's proprietary low-power, submicron geometry process, extend standby and active battery life. The chipset also enables fastest battery charging with minimal heat generation. High integration and advanced design techniques reduce the size, thickness, and number of external components so smartphones become even thinner.

Chipset Features
  •     One Power SoC is optimized to efficiently power the Exynos 4412 applications processor.
  •     The second Power SoC powers the LTE (4G) baseband processor for faster, more reliable data and voice.
  •     The third Power SoC provides numerous integrated functions, including a battery charger, a haptic motor driver, high-accuracy ModelGauge® technology that maximizes battery usage, and the ability to use a single USB connector for charging or connecting accessories.
  •     "Customers are demanding the smallest possible, most-efficient power solution, so end users can enjoy all-day use of the latest multimedia features," said Chae Lee, Senior Vice President, Mobility Group at Maxim Integrated Products. "Our Power SoC enables a 30 percent reduction in power solution size, while increasing efficiency by up to 20 percent compared to the previous generation."

Tektronix, Inc., the world's leading manufacturer of oscilloscopes, today announced the AFG2021 arbitrary/function generator that offers performance signal generation capabilities with entry level pricing. This new compact, easy-to-use signal generator is ideal for cost-sensitive education and manufacturing applications while offering the versatility to meet many R&D requirements.

In the past, entry-level signal generation equaled limited functionality and flexibility. The AFG2021 changes that equation with performance features including 20 MHz bandwidth, 14-bit resolution, 250 MS/s sample rate performance and an intuitive user interface for a starting price of $1,590. Included in that price is Tektronix ArbExpress software that lets users quickly create and import waveforms into the AFG2021 to meet custom stimulus requirements.

"With the AFG2021 we're delivering the perfect blend of performance, versatility and affordability that customers in education, manufacturing and some research groups have been asking for in a signal generator," said Jeff Yost, general manager, Bench Instruments Product Line, Tektronix. "With this instrument, customers can easily and quickly create precise, higher-sample rate signals at prices that provide a 20 percent savings over other alternatives."

As a result of this blend of performance and lower cost educators are no longer forced to choose a signal generator that can only be used in entry level classes. The AFG2021's performance supports development of advanced course material involving more complex concepts such as serial data streams and modulated waveforms.

For manufacturing applications the AFG2021 provides the same ease of use, functionality, computer connectivity and support software available with the Tektronix AFG3000 series, but in a smaller form factor ideal for rack mounting. For R&D applications, the ArbExpress software included with AFG2021 makes it easy to create new signals to test and validate systems. A standard 3 year warranty further lowers total ownership costs.

The innovative ease-of-use features first offered on the AFG3000 Series arbitrary/function generators are incorporated into the AFG2021, providing quick access to setup and operational features. A 3.5 inch color TFT screen shows relevant parameters in both graphic and
text formats. It includes 12 standard waveforms, modulation capability, and a built-in noise generator to thoroughly exercise designs.

The AFG2012 offers a range of connectivity options for saving or downloading customized waveforms or instrument settings including both USB Host Port on the Front Panel and a USB Device Port on Rear Panel, plus the optional GPIB and LAN ports. The 2U height and half-rack width form factor allow the AFG2021 to be stacked on other bench instruments.

Tektronix, Inc., a leading worldwide provider of test, measurement and monitoring instrumentation, today introduced the TLA6400 Series of portable logic analyzers that combine high performance and affordability making it ideal for a wide range of embedded system debug and validation applications.

The TLA6400 Series is available in 34, 68, 102, and 136 channel configurations and comes with 25 GS/s high-speed timing resolution, up to 667 MHz state timing, up to 64 Mb record length, and Tektronix' exclusive iCapture functionality - all at a price point representing a significant price-performance breakthrough.

"The reality in today's world is that our customers are demanding more and more performance and functionality coupled with ease of use and budget-friendly pricing," said Brian Reich, general manager, Performance Products at Tektronix. "The TLA6400 is the perfect antidote; giving engineers working on digital systems a powerful and affordable weapon in their bug-fighting arsenal."

Higher signal speeds as well as shorter setup and hold times in digital systems have increased the timing resolution needed to characterize and debug timing issues. With 25 GS/s MagniVu (40 ps) high-resolution timing, the TLA6400 offers 6 times the timing resolution of other logic analyzers giving even the most cost conscious engineers the additional performance needed to accurately determine timing relationships between signals of interest. The TLA6400 also can capture buses with clock rates up to 667 MHz and data rates up to 1333 Mb/s.

The TLA6400 Series further enhances engineering productivity with advanced features like:
  •     iCaptureTM multiplexing that eliminates double probing with simultaneous digital and analog acquisition through a single logic analyzer probe.
  •     Glitch trigger and storage that allows users to trigger on and display observed signal integrity faults.
  •     iViewTM which provides seamless integration between the TLA6400 and over 100 Tektronix oscilloscopes to provide a time-correlated view of both logic analyzer and oscilloscope data on the same display.
The TLA6400 also delivers quick and intuitive operation that saves time in busy lab environments. Usability features include a familiar Microsoft Windows 7 interface, drag and drop triggering and drag and drop measurements. These usability innovations have been proven to save time, remove complexity, and reduce measurement uncertainty.

The TLA6400 is well suited for a broad range of debug and analysis applications including signal integrity analysis, FPGA debug and verification, memory system validation, and embedded software integration and debug. The signal analysis solution is completed with the addition of new P5900 Series logic analyzer probes that offer lower capacitive loading (1 pF) to accurately acquire signals with faster edges without distorting the signal.

As consumer products are getting thinner and smaller, they are becoming increasingly vulnerable to water and dust. For micro USB connectors, therefore, being able to support the devices with splashproof and dustproof features is no less important than being compatible in size and shape. TE Connectivity today launched a splashproof micro USB connector designed to seal gaps around the opening and inside the connector shell. As a result, the new connector brings the best protection and optimizes user experience.

“ICs and components like microprocessors, speakers, LCD panels and PCBs in consumer products are becoming more and more delicate. Even a small drop of water or a small dust particle could impair an expensive device. For today's modern and multifunction products, micro USB connectors create one of the largest openings on the surface, even in the connector shell, there are some  large gaps - all of which increase the risk of water or dust intrusion," said Egbert Stellinga, global product manager of I/O connectors at Consumer Devices, TE Connectivity.  "This versatile splashproof micro USB connector is TE's response to market demand and marks the next step in TE's state-of-the-art micro USB connector portfolio. It offers the possibility to protect mobile devices from being damaged by water or dust intrusion, and thus helps further protect our valuable mobile devices."

With a dimension of 8.2 x 5 x 3.8mm, TE's new splashproof micro USB connector is only slightly higher than that of its non-splash-proof counterparts, while the protection against water and dust may greatly reduce cost of maintenance or post-sale service. Completely sealed IP 54 phone can be designed using this connector with the rugged molded connector front that helps seal the connector against the device shell. The new splashproof micro USB accepts A and B type plugs, and supports normal USB and USB on the Go. Conforming to micro USB 2.0 specification, it also supports high-speed data and power transmission, while the SMD solder bracket provides additional strength from underneath the connector.

TDK Corporation has developed a new thin-film common-mode filter with the world’s highest cutoff frequency of 10 GHz*, enabling it to efficiently reduce high frequency noise emissions, especially in the 5 GHz band. The common-mode insertion loss peak of the new TCM0806T-060-2P filter is thus much higher than that of existing common-mode filters, which achieve their best noise suppression in the range from several hundred MHz to 2.5 GHz. The high cutoff frequency of the new filter ensures that no signal degradation occurs when the filter is used in communication circuits for high-speed interfaces such as Thunderbolt, USB 3.0, and Serial-ATA (Gen III), making the thin-film common-mode filter suitable for sophisticated electronic devices with high signal transfer speeds. The new component, which offers a typical impedance of 6 Ω at 100 MHz, measures in at 0.85 x 0.65 x 0.40 mm3 (EIA case size 0806). Mass production is scheduled to start from August 2012.

In recent years, digital electronic devices have evolved towards higher performance, multi-functionality, and higher data handling volumes. Consequently, the speed of signal transfer has increased as well. As a result the noise components generated within such a device are generally of a higher frequency as well. At the same time, space is limited and components need to be extremely small and thin for higher mounting density. Since multiple signal paths exist in close proximity in a single device, interference from one may affect the signal in another, leading to signal quality deterioration known as internal contamination.

TDK harnessed its high frequency expertise and proprietary thin-film patterning technology to create a miniature component that features extremely compact and highly precise coil patterns and is thus able to offer the performance demanded in high-speed digital devices.

TDK Corporation expanded its MLG0402Q series of high-frequency multilayer inductors with new types that achieve inductance values of up to 33 nH, the world’s highest* for a tiny 0402 inductor (EIA). With the development of these new components, the TDK MLG0402Q series now includes a total of 55 types with inductance values ranging from 0.2 nH to 33 nH, rated currents from 120 mA to 350 mA, and typical DC resistance values from 0.03 Ω to 2.71 Ω. Mass production began in August 2012.

To raise the inductance, TDK optimized the coil pattern design of its multilayer inductors and employed improved materials and process technologies to create a greater number of layers that are even thinner than in existing products. As a result, four new products have been added to the series, raising the maximum inductance from 15 nH to 33 nH. The new components are particularly well suited for used in the high-frequency circuits of mobile devices such as smartphones and conventional mobile phones. Thanks to the wide operating temperature range from -55 °C to +125 °C, the MLG0402Q series is also ideal for use in the high-frequency circuits of other devices such as Bluetooth devices and cordless phones.

Taoglas USA, Inc, a provider of antenna solutions to the M2M market, announced a new market innovation Near Field Communications (NFC) antenna and tag solutions for M2M devices.  The FXT.01 NFC tag antenna and FXR.01 NFC reader antenna operate at 13.56MHz and provide a well-matched solution (50ohms) for NFC readers. Taoglas will showcase these antennas at CTIA Hall D, booth # 3653 from May 8th -10th 2012.

The FXR.01 is a unique off-the-shelf NFC antenna product, which measures 54x37x0.1mm and provides an average NFC tag read distance of 5cm.  It is a flexible polymer antenna, with a coaxial cable, which connects easily to the chipset solution. It is also delivered with 3m adhesive and tape for ease of assembly to a plastic (non-metal) enclosure by a simple “peel-and-stick” method.

“In 2012, it is expected that 1.4 billion cellphones will ship and up to 40% will have a NFC tag. This means that M2M devices can now become NFC readers to cellphones by simply drawing on the NFC technology inside the M2M devices,” said Dermot O’Shea, Taoglas. “For this the Taoglas NFC antenna is an ideal solution for M2M device makers to take advantage of this opportunity and make their devices mobile payment terminals. Taoglas provides access to both their reader and tag technologies in an off-the-shelf “peel-and-stick” solution.

The FXR.01 NFC antenna has an integrated matching circuit to provide effective antenna matching.  The Q of the antenna and matching circuit combination have been selected to provide a solution where bandwidth and read performance have been optimized for best tag interrogation performance.

Custom NFC antenna design is also offered by Taoglas where antenna area is maximized for specific applications in order to enhance interrogation distance. NFC tags are normally attached to the battery of mobile devices, and Taoglas’ NFC tag can also be customized with a ferrite layer to provide isolation from a battery or any other metal or groundplane in a device.

Taoglas has also released a passive NFC tag antenna, the FXT.01. It measures 45x34x0.1mm. This is also a “peel-and-stick” flexible polymer tag solution. The tag design requires no additional matching components. Similar to the FXR.01 antenna, the FXT.01 tag’s dimensions provide interrogation capability to 5 cm distance.  This standard antenna tag is also manufactured in a flexible polymer material for ease of use and installation.

The process of building a better M2M (machine-to-machine) device - one that not only fits the application scenario but also performs well in the field - starts with choosing the right antenna.

Selecting the right antennas for a device, particularly cellular antennas, and testing and integrating them properly, can prove the difference between a device that passes network certification and testing like PCS-1900 Type Certification Review Board (PTCRB) testing, and one that does not. Good radio frequency (RF) optimization and OTA (over the air) performance in wireless devices is critical for these certifications, and incorrect antenna selection and integration can often be blamed when M2M devices fail certification testing. Often, it is a system issue, such as the overall design of the system or how that device is interacting. As with many things, system optimization is the key to success.

This article discusses the important process of antenna selection, how to incorporate antennas in M2M devices and the recipe for connectivity success. First, let's take a look at selecting the proper antenna.

Antenna Selection
Better antennas mean better devices. It’s as simple as that. Understanding the requirements for achieving specific network certification processes are the most important factors when first selecting a cellular antenna. Once the module provider and the carrier have been selected, the next part of the process should be selecting the right antenna for your application.

The first step is for the device maker and antenna company to partner from the start to incorporate their ideas for compliance and RF performance.

The second phase involves the device maker and antenna company cooperating on product design files to work out the advantages and disadvantages of each antenna configuration.

Once the antenna is selected, the customer can start to make prototypes of the device incorporating the required configuration for the recommended antenna. Depending on whether it is a custom design or not, the antenna partner either provides the device maker with a current production sample (off the shelf) or a handmade antenna for the prototype device that enables the device maker to finish their product design. When the product is finished and can connect to a network, the device maker sends the final device to the antenna partner.

Next is the stage where active device optimization happens – this means the ability to increase the device send and receive sensitivity to improve transmissions. When devices are optimized it results in superior M2M devices. The process is what cell phone companies do in their own laboratories before sending devices to final certification. M2M companies in most cases do not have the resources to do that on their own, and they are required to choose antenna partners who can do it for them.

Selecting the right antenna can streamline the whole product design process and result in M2M devices passing certification testing the first time. In general, M2M systems are getting smaller to satisfy scenarios such as body-worn medical devices. Yet, the same device has to get excellent performance and will be compared to a cellphone. When devices are smaller, performance can be compromised, but using an antenna optimized for greater send and receive sensitivity can help compensate for size.

Taoglas USA, Inc., a leading provider of antenna solutions to the Machine-to-Machine (M2M) market, announced that TZ Medical, has received Connected World Magazine’s Value Chain Gold Award in the Healthcare category for work on its body-worn,  patient-activated cardiac monitor. Cinterion and Taoglas were honored as enablers of this value chain. TZ Medical’s monitor innovatively captures recordings of infrequent and elusive heart arrhythmias and transmits this data to medical practitioners.

“Our new cardiac monitor combines the Internet, wireless communication, and leading-edge heart monitoring technology to provide constant detection, recording, and transmission of cardiac rhythm dysfunctions while the patient is fully mobile,” said Bob Doerr, project director for Aera CT with TZ Medical.  “With the Aera CT, cardiac-rhythm related problems are targeted and parameters are predetermined by the physician to provide rapid, accurate data to the prescribing physician. Reports of Afib burden, heart rate, strip samples of arrhythmias are provided daily and as needed by the physician.  Additionally, outpatient monitoring allows patients to undergo daily medication titration without the need for hospitalization.   We are delighted to team with Taoglas and Cinterion to bring this device to market.  Taoglas’ antenna and RF design work and Cinterion’s Cellular Module meant we passed FCC, PTCRB and FDA approvals first time.”

“We always love a new antenna challenge and TZMedical’s monitoring device certainly gave us that opportunity,” said Dermot O’Shea, Joint Managing Director, Taoglas. “While most devices have one PCB, TZ Medical’s had three PCB’s and a battery combined in a small form factor.  We tried a lot of different prototypes and in collaboration with Cinterion, we developed a new type of custom multiband, embedded cellular antenna.  The project with TZMedical enabled us to add new knowledge and expertise to our Taoglas team. We are delighted to be a part of the Connected World Value Chain Award.”

“It was a pleasure to work with TZMedical and Taoglas to develop a design for such an innovative medical device,” said Paul Kobos, SVP Sales, Cinterion.  “The world of M2M devices is moving at such a rapid pace that technology such as communications modules and antennas continually need to keep innovating to stay ahead of the game. As the global leader in M2M communication modules, it is an honor to be recognized by Connected World for such an innovative device design.

Held as a part of the Connected World Conference, the Value Chain Awards honor the most successful corporate adopters of M2M technology and connected devices, as well as the solution providers that make their success possible.. “Those who took home Value Chain and ConnectED Awards should be proud to find themselves among some of the best companies, and entrepreneurs, found in this industry today,” says Mike Carrozzo, chief editor, Connected World. “Each has displayed a great deal of innovation, as well as determination, to get to this point, making their successes well deserved.”

Telit Wireless Solutions, Inc., a leading global provider of high-quality machine-to-machine (M2M) modules and services, announced today that 7Layers, Digi International®, Direct Communications Solutions (DCS), Spectrum Design Solutions and Taoglas will participate as gold sponsors in Telit DevCon 2012, the second annual M2M developers conference taking place on October 8 in San Diego, California.

Joining platinum sponsor Intel, these leading companies represent the broad range of participants who will come together for this one-day forum centered on cellular device development. Building on the success of last year’s event, Telit DevCon 2012 will again play a vital role in connecting application engineers, business leaders, industry analysts and technology experts, offering invaluable guidance for successful M2M deployments in a highly segmented market.

“Maintaining Telit’s exclusive dedication and focus to M2M, we welcome the unique expertise that each of our gold sponsors brings for this year’s DevCon, and we appreciate the support they’ve demonstrated to enable the next generation of innovative M2M solutions,” said Mike Ueland, senior vice president and general manager of Telit Wireless Solutions North America.

Telit DevCon 2012 will feature informational break-out sessions and networking opportunities with organizations at all levels of the M2M value chain, providing attendees with the tools and knowledge they need to take an M2M solution from inception to deployment. This year’s gold sponsors each provide a unique product or service critical to the M2M development process:
  •     7Layers is an industry leader in Test Services, Test System Development, Test Management Software Solutions and Engineering Services for cellular and M2M devices. It is a premier global certification partner, with expertise in operator requirements, global standards (PTCRB, CTIA, GCF, FCC, R&TTE, Bluetooth SIG, etc.) and prominent wireless technologies (LTE, HSPA, WCDMA, EDGE, GPRS, GSM, CDMA , Bluetooth®, A-GPS, etc.).
  •     Digi International®, the M2M solutions expert, combining products and services as end- to-end solutions to drive business efficiencies. Digi® provides the industry’s broadest range of wireless products, the iDigi® Device Cloud, a cloud computing platform tailored for devices, as well as development services to help customers get to market fast with wireless devices and applications. Digi's entire solution set is tailored to allow any device to communicate with any application, anywhere in the world.
  •     DCS Wireless, offering the entire suite of Telit Wireless M2M Module Solutions and Internet Connectivity via Mobile Virtual Network Operator (MVNO) Agreements. DCS Wireless is a one-stop shop for procuring Telit Developer’s kits, airtime, modules, devices and integration support. DCS Wireless is a subsidiary of the DCS Group, a privately held company founded in 2006, headquartered in Coconut Creek, Florida with offices in Philadelphia, Pennsylvania and San Diego, California. DCS Group markets its MVNO under the Data2Go Brand.
  •     Spectrum, with proven experience in wireless design and integration services, enables clients to bring wireless products to market quickly. Spectrum engages clients at the idea stage, through certifications, into manufacturing and anywhere between. Its success is due to its process, experience over hundreds of successful designs, Spectrum’s state of the art RF lab and library of proven hardware and software. Every Spectrum-designed device is guaranteed to pass regulatory and carrier certifications the first time. Spectrum Design Solutions is a subsidiary of Digi International.
  •     Taoglas is a leading global antenna and RF design provider for the M2M and Connected Device market. It has a full range of external, embedded and base station antennas as well as cable and connector products. Taoglas also offers a full range of testing and custom design services from 4 global locations including San Diego, CA.

Tamura Corporation of America announces the Debut of the new "SMARTY" at CED Greentech, The industry's SOLAR distributor.

on Wednesday, August 15th, from 8AM to 4PM
CED GREENTECH is located at 5445 Ruffin Road, San Diego, CA 92123

Smarty is the latest DC:DC Converter for Solar Smart Sub-Combiners

Tamura Corp's new "Parasitic" DC supply feeds off Photovoltaic system DC voltage up to 1000VDC and safely, securely, supplies isolated 24VDC at 1 Amp, to power Smart Sub-Combiner Data collection and transmission devices.

Available in Q3 2012, in North America. Product tested to UL1741for Photovoltaic system applications.

    200VDC to 600VDC UL rated (Maximum 1000 Volt DC operation)
    Isolated 24VDC@1A power source
    DIN Rail Mounting
    Industrial Temperature range: -20 to +50 Degree C
    Future models to have Battery Charging, LED lighting, etc.

TAIYO YUDEN CO., LTD has released its 2012 Safety & Environmental Report which includes the results of safety and environmental efforts made in FY2011.

TAIYO YUDEN strives for perpetual growth while fulfilling its corporate social responsibilities. In an effort to properly disclose information, including safety and environmental efforts, and the results of these efforts in an easy to understand, comprehensive way, TAIYO YUDEN began publishing its annual Environmental Report in 2002. Since 2005 TAIYO YUDEN has been publishing its annual Safety & Environmental Report, which contains information relating to occupational health and safety.
This report focuses on activities towards medium-term environmental targets, which are split into four fields; 1) “Environmental risk management,” 2) “Contribution through environmentally friendly products,” 3) “Prevention of global warming,” and 4) “Preservation of biodiversity”.  The Safety & Environmental Report provides information about TAIYO YUDEN Group’s and our progress towards building the foundation for safety and a clean, healthy environment along with activities toward supporting the environment and health and safety.
TAIYO YUDEN recognizes that efforts toward safety and the environment are an important responsibility and we are committed to fulfilling these responsibilities. We shall continue to promote safety and environmental activities from a global perspective.

TAIYO YUDEN CO., LTD. has succeeded in developing the metal power inductor “MCOILTM”, the first of a series of coil components that use metallic magnetic materials optimal for use in choke coils for power supply circuits in compact mobile devices such as smartphones and tablet PCs that are becoming smaller, thinner, and more feature-rich. TAIYO YUDEN today announced commercial production of the 2520 size metal core wire-wound chip power inductor “MAMK2520” (2.5x2.0x1.2mm) and the 2mm square size metal core SMD power inductor “MDMK2020” (2.0x2.0x1.2mm, height is maximum value for both).

A combination of newly developed metallic magnetic materials with TAIYO YUDEN’s advanced process technology achieves for both products the best-in-class DC bias characteristics in the industry as well as size reduction. MAMK 2520T2R2M (inductance value 2.2µH, saturation current 2300mA) has 2.3 times higher saturation current than TAIYO YUDEN’s existing BRL2518T2R2M (inductance value 2.2µH, saturation current 1000mA). MDMK2020T2R2M (inductance value 2.2µH, saturation current 2000mA) has 1.5 times higher saturation current than TAIYO YUDEN’s existing NRS2012T2R2M (inductance value 2.2µH, saturation current 1350mA).

The commercial production will commence in May 2012 at the Company’s Nakanojo Plant in Gunma Prefecture, Japan at a production volume of 40 million and 20 million units per month for MAMK2520 and MDMK2020, respectively. The sample price is $1.00 each.

TSMC today announced that its Fab 12 Phase 4 facility located in the Hsinchu Science Park has earned certification from the R.O.C. Ministry of Economic Affairs Industrial Development Bureau (IDB) to gain Taiwan’s first “Green Factory Label”. This recognition once again highlights TSMC commitment to mitigating climate change and protecting the environment, and sets a new milestone for Taiwan’s green manufacturing.

TSMC’s Fab 12 Phase 4 facility is one of TSMC’s green pioneers, gaining gold-class certification from the U.S. Green Building Council’s “Leadership in Energy and Environmental Design–New Construction” (LEED-NC) standard, and diamond-class certification from Taiwan’s “Ecology, Energy Saving, Waste Reduction and Health” (EEWH) standard. The facility is also certified under the ISO 50001 energy management system.

Taiwan’s “Green Factory Label” is the world’s first green certification system designed for factories, and examines both “green building construction” and “clean production”. Applicants must first gain the Ministry of the Interior’s green building label as well as clean production certification from the IDB. The concept for the “Green Factory Label” originated at TSMC’s Green Forum in 2008, and TSMC continued to work with regulatory agencies to integrate industry views and set a standard for green factories. The “Green Factory Label” is world’s first comprehensive certification system that combines green production (energy and water conservation, waste reduction, and pollution prevention), green transportation, employee health, surrounding ecosystems, and corporate social responsibility, putting Taiwan at the forefront of setting international standards.

TSMC pledged in 2005 that all new factories and office buildings would be built to the most up-to-date green building standards. Currently, TSMC has the most green buildings of any company in Taiwan, with five LEED gold and three EEWH diamond certifications. TSMC not only plans to extend the “Green Factory Label” to all newly-built factories, the company will also continue to upgrade existing factories in line with “Green Factory” standards. In addition to Fab 12 Phase 4, Fab14 Phase 3 has already gained “green building and “clean production” certifications and has entered the final accreditation process. In addition, Fab 12 Phase 5 and Fab 14 Phase 4 were all among the first facilities to gain the IDB’s “clean production” certification.

“TSMC is dedicated to effective green management and building a world-class green enterprise,” said TSMC Spokesperson and Senior Vice President Ms. Lora Ho. “From green R&D to green manufacturing, green productions, green supply chain, green buildings and green factories, we have shown our determination to carry out our corporate social responsibility and live in harmony with the environment.”

Thursday, August 30, 2012

Imaging systems such as scanners represent the largest and most vibrant sector of the medical electronics industry. Demand for non-magnetic components is increasing, especially for medical applications such as MRI equipment. UK-based component manufacturer, Syfer Technology, has developed a new range of multilayer ceramic capacitor devices dedicated to this market, featuring a copper barrier and tin finish.

The use of conventional nickel barrier terminations is not suitable due to the magnetic properties exhibited by nickel. Silver/palladium (Ag/Pd) terminations have been used in the past, but are no longer viable due to the increase in soldering temperatures necessitated by the use of lead-free solders, as dictated by RoHS requirements. The result has been solder leaching problems for Ag/Pd terminations, making an alternative termination essential.

Syfer’s solution is to use a copper barrier, which is non-magnetic, with a tin finish on top. The company offers a wide range of multilayer ceramic chip capacitors, available in C0G/NP0, High Q and X7R dielectrics. With the C0G/NPO and High Q dielectrics, parts are offered across the capacitance range from 0.1pF to 15nF (50V to 3kV). In addition, X7R capacitors range from 47nF to 6.8µF (16V to 2kV). Devices are packaged in case sizes from 0402 to 2225, depending on value. Operating temperature range for all non-magnetic devices is -55ºC to 125ºC.

To meet high temperature 260ºC soldering reflow profiles as detailed in the medical electronics standard, J-STD-020, Syfer’s C0G/ NP0 dielectrics are supplied with sintered termination while X7R dielectrics feature Syfer’s award winning FlexiCap™ termination.

MLCCs are particularly suitable for high voltage applications where small size is required. For standard high voltage capacitors a coating may be required to be applied postsoldering, to minimise the risk of flashover from one termination on the chip to the other. By contrast, the new ProtectiCap™ high voltage range has been introduced to specifically address this issue. The integral coating minimises the risk of flashover without any requirement for the customer to apply conformal coating after soldering.

 - High voltage flashover resistance
 - High voltage / small case size, for example 3kV in 1206  
 - Voltage ranges up to 5kV
 - Case sizes from 1206 to 2220

 - Power supplies
 - Lighting ballasts
 - Inverters / DC link
 - General high voltage circuits

Supertex (Nasdaq GS: SUPX), a recognized leader in high voltage analog and mixed signal integrated circuits (ICs), today introduced the HV7331, a four channel, monolithic, high voltage, high speed pulse generator IC with integrated fast return-to-zero (RTZ) FETs. The high voltage, high speed IC is designed for use in portable medical diagnostic ultrasound devices, but can also be used in non-destructive testing (NDT) applications.

The IC brings together controller logic interface circuitry, level translators,
MOSFET gate drive buffers, and high voltage and high current P- and N-channel
MOSFETs as the output stage for each channel. HV7331 features matched delay
times of +/-2.5ns, guaranteed output of over 2.0A for each channel with a +/-70V pulse swing, and up to 20 MHz operating frequency. Integrated regulators for its gate drivers makes PCB layout easier by eliminating the need for two floating voltage supplies.

“With four high speed output channels in a compact, 9x9mm QFN package, HV7331 is optimized for space-constrained, portable, medical ultrasound imaging applications as well as non-destructive test imaging applications,” states Stephen Lin, Vice President of Marketing for Supertex. “The high voltage MOSFET output stages for each of HV7331’s channels can deliver pulses up to +/-70V with a typical current capability of +/-2.0A.” The HV7331 is available in a 64-lead QFN package (HV7331K6-G). The part is RoHS compliant. Samples are available from stock. Lead-time for production quantities is 4-6 weeks. Pricing is US$12.01 each for the HV7331K6-G in 1K quantities.

Supertex (Nasdaq GS: SUPX), a recognized leader in high voltage analog and mixed signal integrated circuits (ICs), today introduced CL8800 and CL8801, sequential, linear LED drivers designed to drive long strings of low cost, low current LEDs in solid-state replacements for fluorescent tubes, incandescent bulbs and CFL bulbs. Both ICs minimize driver circuit component counts, requiring just four or six resistors and a diode bridge in addition to the IC. Two to four additional components in the circuit provide transient protection, and neither capacitors nor magnetic components are required. Because the ICs are multi-stage linear current regulators, there are no high frequency switching currents and, thus, no
need for a front-end EMI filter. CL8800 is intended for 230VAC input, while L8801 is for 120VAC input. Luminous efficiencies of greater than 115lm/W are achievable with both ICs.

CL8800 has six current regulator outputs and CL8801 has four. These outputs tap a string of series parallel LEDs, and the regulators sink current at each tap and are sequentially turned on and off automatically, tracking the input sine wave voltage. Voltage across each regulator is minimized when conducting, providing typical efficiency of greater than 90%. Output current at each tap is individually resistoradjustable.

Cross regulation, as the IC switches from one regulator to another, provides smooth transitions. The current waveforms of both ICs can be tailored to optimize for input voltage range, line/load regulation, output power/current, efficiency,
power factor, THD, dimmer compatibility and LED utilization. Both ICs are compatible with phase dimming with the addition of an RC network.

“CL8800 and CL8801 deliver very easy retrofit solutions for designers looking to
replace existing fluorescent tubes or incandescent bulbs with more energy efficient solid-state lighting fixtures,” states Jimes Lei, Director of Applications Engineering for Supertex. “The minimal component count required for both devices, as well as their efficient operation, make them an extremely attractive solution in terms of cost and performance.”

CL8800 and CL8801 are available in 40- and 33-lead QFN packages (CL8800K6-G, CL8801K6-G, CL8800K63-G, CL8801K63-G, respectively). The parts are RoHS compliant. Samples of CL8800K6-G and CL8801K6-G are available from stock. Lead-time for production quantities of CL8800K6-G and CL8801K6-G is 4-6 weeks. Consult factory for samples and lead times of CL8800K63-G and CL8801K63-G. Pricing is US$2.38 each for all parts in 1K quantities.

Supertex (Nasdaq GS: SUPX), a recognized leader in high voltage analog and mixed signal integrated circuits (ICs), today introduced HV7360 and HV7361, high voltage, high speed ultrasound pulser ICs with fast return-to-zero (RTZ) outputs. The ICs are designed as space-efficient alternatives to discrete solutions using MOSFET drivers and discrete complementary MOSFET arrays for medical ultrasound applications. The ICs combine controller logic interface circuitry, level translators, MOSFET gate drive buffers, and high voltage, high current P- and N-channel MOSFETs as the output stage in compact, 22-lead, 5mm x 7mm, LFGA packages. HV7361 also features an integrated transmit/receive switch.

HV7360 and HV7361 both feature 2.0ns matched delay times, up to 35 MHz operating frequency, and +/-2.5A source and sink currents with up to +/-100V of pulse swing. The direct AC coupling topology of these ICs not only eliminates two floating voltage supplies, it also makes designing the circuit board much easier.

“The simple to use HV7360 and HV7361 add to Supertex’s already substantial family of products for the medical ultrasound imaging market,” states Jimes Lei, Director of Application Engineering for Supertex. “These ICs offer designers the
benefits of a compact, 5mm x 7mm, LFGA package.” HV7360 and HV7361 are available in 22-lead LFGA packages (HV7360LA-G and HV7361LA-G). The parts are RoHS compliant. Samples of HV7361LA-G are available from stock. Consult Supertex for samples of HV7360LA-G. Lead-time for production quantities is 4-6 weeks. Pricing is US$4.40 each for HV7360LA-G and US$5.09 for HV7361LA-G, both in 1K quantities.

Supertex, Inc. (Nasdaq GS: SUPX), a recognized leader in high voltage analog and mixed signal integrated circuits (ICs), today introduced FP0030, a 20V current limiting protection device. The FP0030 can be considered as a normally closed switch with a typical resistance of 4.5 ohms. The IC starts to turn off when the voltage drop across its two terminals exceeds a nominal value of +/-1.5V. In the off state, the FP0030 can withstand up to +/-20V across its terminals and allow typical current of 700uA to flow through it.

The FP0030 may also be used as a resettable fuse to protect power lines against output short circuit conditions. Its fast switching speed protect the system
against abrupt over current conditions. “Supertex’s FP0030, with its small 3-pin package and no external supplies needed, provides Ethernet system designers a space-saving and easy-to-layout solution,” states Jimes Lei, Director of Applications Engineering for Supertex. “The IC features low on-resistance of typically 4.5 ohms for minimal signal attenuation.”

The FP0030 is available in a three lead SOT-23 package (FP0030K1-G). The part is RoHS compliant. Samples are available from stock. Lead-time for production quantities is 4-6 weeks ARO. Pricing is US$0.38 each for FP0030K1-G in 1K quantities.

STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications and a leading supplier of automotive electronics, together with China FAW Group Corporation (FAW), one of the global leaders in the vehicle manufacturing industry, today announced the establishment of a joint laboratory in the FAW Group Research and Development Center emphasizing advanced research covering comprehensive cutting-edge solutions in power train, chassis, safety, car body, car infotainment, and new-energy technologies, as well as other automotive applications. FAW will adopt ST’s microcontrollers (MCUs), Application Specific Standard Products (ASSPs) and smart drivers in their advanced research in automotive electronics platforms.

The joint lab will focus on advanced research in automotive electronics systems. Building on ST’s global automotive electronics experience and know-how, devices including PowerPC series 32-bit microcontrollers and EMS (Engine Management System) highly integrated chip solutions, reference designs and technical support, the ST/FAW lab will accelerate joint development of advanced automotive-electronics technologies such as ECU (Engine Control Units), TCU (Transmission Control Unit) and EPS (Electric Power Steering), which will ultimately add more value to FAW’s new-generation automobiles.

“China is a huge market for automotive semiconductors and China’s automotive shipments have ranked No. 1 worldwide for three consecutive years. Today, automotive safety and comfort are attracting increased attention from consumers and the market for automotive electronics is also growing dramatically,” said Jun Li, Deputy Chief Engineer and Director of FAW R&D Center. “The cooperation between FAW and ST will drive our innovation in automotive-electronics technologies to support our development of optimized products at competitive cost, while strengthening our technological competences by overcoming technical constraints.”

“A collaboration between FAW, the leading automotive manufacturer in China, and ST, ranking the 1st supplier of automotive ICs in China in 20112, and the 3rd automotive supplier globally in 20112, will contribute to FAW developing advanced vehicles that well address the market,” said Edoardo Merli, Head of Marketing & Application, Automotive Product Group, STMicroelectronics Greater China & South Asia Region. “ST is already well-positioned in the applications of power-train, car body, and safety, as well as infotainment, and that position is well recognized among Chinese car makers and we are confident this cooperation will further strengthen ST’s position in China’s automotive electronics industry.”

STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications and a leading supplier of imaging technologies, today announced a strategic agreement with MicroOLED, a Grenoble, France-based company dedicated to the development and commercialization of state-of-the-art organic light emitting diodes (OLEDs), as well as a minority equity investment of approximately 6 million Euros in the company. With exceptionally high resolution and extremely low power consumption that is the most power efficient on the market, OLEDs are ideally suited to micro-displays in a wide range of portable applications, spanning from camera viewfinders, video goggles to medical and security applications.

 At about half the power consumption of competitive displays, MicroOLED’s cutting-edge technology provides superior pixel density for enhanced image quality. The technology produces OLEDs with pixel densities double those of alternate displays and contrast ratios 10 to 100x better. To complement these technology advantages, ST brings its outstanding manufacturing machine, broad consumer-market expertise, and deep IP portfolio, in the form of design, development and supply services for new micro-displays, targeting a broader range of customers and applications with the next generation of the technology.

ST owns several fully integrated CMOS processes that will be used to develop a complete product roadmap. With a large portfolio of design IP, ST will contribute to better integrate micro-display functions that today are on external controllers, which add cost and complexity to the final solution. ST’s experience in designing for low-power is key to enabling applications like video goggles.

“In recognition of the substantial growth opportunities for Electronic View Finders in digital still cameras and other applications, and in line with ST’s strategy to diversify and enhance our offerings in Imaging, we sought and found in MicroOLED the high-resolution OLED micro-displays with the best performance/quality and lowest power consumption on the market,” said Eric Aussedat, Corporate Vice President and General Manager of STMicroelectronics’ Imaging, BiCMOS ASIC and Silicon Photonics Group. “Bringing ST’s deep manufacturing and technology expertise, customer relationships and IP portfolio will accelerate adoption of OLEDs and significantly expand the market.”

“Dramatically increasing the pixel density and the picture quality while cutting the power consumption in half has greatly impressed customers,” said Eric Marcellin-Dibon, CEO and cofounder of MicroOLED. “By establishing our strategic relationship with ST, and being in a position to leverage their strong manufacturing capabilities, we’ll be able to bring the technology to the next step, expand the potential market, and help consumers see the world through amazing low-power micro-displays.”

STEC, Inc. (Nasdaq:STEC), a leading global provider of solid-state drive (SSD) technologies and products, and PogoStorage, the leading open source systems integrator, today announced an alliance whereby Pogo Storage will now feature STEC's highly reliable, high-speed ZeusRAM® and ZeusIOPS® SSDs in its StorageDirector Z-Series family of unified storage solutions. The two companies are showcasing the solution August 26 to 29 at VMworld 2012, booth #2113, in San Francisco.

Pogo's flagship StorageDirector Z-Series NAS and SAN products run on the NexentaStor™ ZFS platform, which unlocks enterprise-class storage capabilities such as high availability, unlimited snapshots and deduplication, with Open Storage technologies. Nexenta recently certified an all-STEC SSD-configured system, which delivers up to 5X better performance for such enterprise applications as database indexing and email exchanges, resulting in an 8X reduction in cost per user and a 4X reduction in cost per transaction.

Utilizing STEC's ZeusRAM SSD as the write log and ZeusIOPS SSD as the read-only cache within the StorageDirector Z-Series system alleviates performance bottlenecks. This accelerates read/write capabilities, which is ideal for business-critical applications, such as enterprise e-commerce, databases, online transaction processing (OLTP), cloud infrastructures and virtualization.

"With all the solid-state drive technologies on the market, our customers and resellers trust us to integrate only the most enterprise-reliable SSDs into our products," said Erik Logan, CEO of Pogo Storage. "As the first Nexenta Premier Partner, we are excited to partner with STEC to integrate their powerful Nexenta-certified STEC ZeusRAM and ZeusIOPS SSDs into our StorageDirector Z-Series systems. These SSDs deliver the best solid-state drive platform to run NexentaStor in terms of I/O performance and I/Os per second (IOPS), which is consistent with the quality and performance our customers expect from Pogo Storage."

"Integrating STEC's ZeusIOPS SSDs into Pogo's groundbreaking StorageDirector Z-Series solution, powered by Nexenta's OpenStorage software, provides the enterprise market with a high-performance, high-availability storage solution," said Jim Ting, vice president of product marketing at STEC. "This all-SSD solution delivers incredible I/O performance at a price point not achievable using HDDs."

Standex International Corporation (NYSE:SXI) today announced that three of its Standex Electronics Group’s products recently ranked among the top 101 components for 2012 according to Electronic Design, an industry-leading trade journal with the highest circulation of any design focused publication in the electronics market.

Based on Electronic Design web site page views and site visitors’ votes for their favorite components, two products from Standex Electronics made the list, including Standex planar transformers at number 21 and custom conductive fluid level sensors at number 47. The MK27 magnetically activated reed sensor from Meder Electronics, which was acquired by Standex in July 2012, was named number 68 on the list.

“It is exciting to see these three high-quality electronic components voted among the industry’s best,” said John Meeks, President, Standex Electronics Group. “Their ranking among the 101 favorite products of the readers of Electronic Design demonstrates the strength of the combined Standex and Meder product portfolio. The combination of Meder’s reed switches, reed relays and reed sensors, coupled with Standex’s reed switch, magnetics and sensor product lines provides the combined global sales forces with a broader suite of products and technologies to address our customers’ needs.1”

“The selection of these products also demonstrates the diversity of our industry exposure as a combined company,” Meeks said. “Sensor products such as Standex’s patented conductive fluid level sensor technologies and Meder’s MK27 magnetically activated reed sensor/actuator solutions are enabling both companies to achieve success in the automotive, medical, consumer appliance and industrial markets.1

Our planar transformers, which have superior space saving and power density properties, as well as our comprehensive portfolio of magnetic components, are fueling growth for Standex Electronics in the military, aerospace, alternative energy and power distribution sectors.1

In addition, by broadening our geographic coverage, the combination of Meder and Standex Electronics has resulted in a global organization with engineering capabilities and sales professionals close to the customer – enhancing the collaborative development of customer driven engineered solutions.”

Microchip Technology Inc., a leading provider of microcontroller, analog and Flash-IP solutions, today introduced the volatile MCP47A1 Digital-to-Analog Converter (DAC).  This low-power, low-cost DAC features a 1.8-5.5V wide operating voltage range, and is offered in a 6-pin SC70 package.  The MCP47A1 is ideal for applications in the automotive, audio and industrial markets, such as portable, handheld battery-operated products, and applications such as set-point or offset trimming and sensitive mechanical-trim pot replacement.

The extended temperature range of -40 to +125 degrees Celsius allows for use in high-temperature automotive and industrial applications.  Additionally, the small SC70 packaging allows for more portable and space-constrained consumer applications.  The MCP47A1 DAC also provides 65 taps, through an I2C™ interface, including taps to both full-scale and zero-scale, providing additional functionality.  Low power consumption extends lifetimes in applications with finite power supplies, and the low cost is suitable for cost-sensitive applications.

“The MCP47A1 is optimized for system power reduction and cost reduction,” said Bryan J. Liddiard, vice president of marketing with Microchip’s Analog & Interface Products Division.  “Because of its extended temperature range, this new DAC can also be used in high-temperature automotive and industrial applications.”

Spansion Inc. (NYSE: CODE), a leading innovator in Flash memory solutions for embedded markets, today announced it has been honored as a 2011 Technology Support Award winner by Huawei, a leading global information and communications technology (ICT) solutions provider. The annual award recognizes suppliers that provide superior advanced technology support for Huawei's passive components and discrete devices.

Spansion has been supplying Flash memory solutions to Huawei since 2003 for product applications, such as wireless base stations, switching routers and set-top box applications.

"We value our partnership with Huawei and this award demonstrates our commitment to delivering world-class service and technical support," said Jay Legenhausen, senior vice president of worldwide sales at Spansion. "We look forward to our continued partnership and providing a broad portfolio of products and differentiated service for years to come."

Times-7, a fast growing manufacturer of RFID reader antennas, announced today that it appointed SkyeTek, Inc., a leading provider of RFID reader technology, as a North American Reseller.

“As we expand our point of presence into the RFID solutions market, we are excited to partner with SkyeTek to offer more customers our extensive range of uniquely slim, robust and high performing RFID reader antennas”, says Antony Dixon, CEO of Times-7.

“We are extremely pleased to be partnering with Times-7, the leading manufacturer of ultra slim antennas that can meet the growing demand for RFID product that is deployed directly in a customer facing environment”, said Josh Peifer, VP of Sales of SkyeTek. “Benchmarked and validated in our labs for combining with our class leading embedded reader modules, software and multiplexers, we believe the Times-7 antenna range is a great extension in offerings for our customers.”

Silicon Laboratories Inc. (NASDAQ: SLAB), a leader in high-performance, analog-intensive, mixed-signal ICs, today introduced a family of high-performance 8-bit microcontrollers (MCUs) featuring the company’s latest mixed-signal breakthrough, an integrated temperature sensor with best-in-class accuracy over an extended temperature range and without the need for calibration. Offering a unique mix of integrated high-performance analog peripherals and a very fast 8051 CPU in a compact package, the new C8051F39x/7x MCU family provides an optimal solution for optical transceiver modules, sensor interfaces and brushless dc motor applications for fans, dryers, vacuum cleaners and remote control toy vehicles.

Many consumer and industrial applications require highly accurate temperature sensors to adjust for behavior shifts over temperature for on-board components such as sensors, lasers or power sources. The C8051F39x/7x MCUs’ on-chip temperature sensor provides ±2 oC accuracy through an extended temperature range (up to 105 oC) without the need for calibration. Providing five times higher accuracy than competing in-class MCUs, the C8051F39x/7x family improves temperature compensation routines, resulting in better end-product reliability. In addition, the temperature sensor reduces manufacturing cost by eliminating the need for the factory calibration step required by competing MCUs.

C8051F39x/7x MCUs are more than 30 percent smaller than competing solutions, making them an excellent choice for space-constrained applications such as optical transceiver modules. The MCU family’s exceptional integration eliminates the need for external components such as a temperature sensor, a crystal, a differential analog-to-digital converter (ADC), a voltage reference and two digital-to-analog converters (DACs), further reducing bill-of-materials (BOM) cost and PCB footprint. These on-chip analog peripherals enable developers to minimize discrete components and reduce the BOM cost by more than $0.30 (USD). In addition, the MCU family’s innovative crossbar technology gives developers the flexibility to assign peripherals to specific pin locations, thereby easing system layout and eliminating pin conflicts.

The C8051F39x/7x MCUs are based on a patented, pipeline 8051 core that provides 2.5x faster CPU performance (up to 50 MIPS) than competing devices. Finer resolution pulse-width modulation (PWM) offers the ability to execute more complex algorithms, enabling a greater range of motor speeds and higher efficiency in motor control applications. Support for four interrupt priorities allows fast interrupt handling for real-time applications.

Addressing the industry need for low-power operation and green energy compliance, the C8051F39x/7x MCUs are designed to consume an ultra-low 160 µA/MHz in active mode, enabling up to an 80 percent power savings compared to competing devices. Low-power active mode is vital for portable applications to extend battery life and for space-constrained and enclosed applications such as optical transceiver modules to minimize self-heating.

The C8051F37x devices are the first Silicon Labs MCUs with 512B of EEPROM, supporting ten times more write/erase cycles (1M vs. 100k typical) and faster programming times (3.5 ms vs. 112 ms) compared to standard flash implementations. These increased write/erase cycles are useful for applications such as wireless sensor nodes and data loggers that must constantly write to memory. The faster programming times often are needed for applications such as industrial controls and optical modules that require tight calibration loops.

“The new C8051F39x/7x MCUs leverage our mixed-signal capabilities to provide enhanced on-chip analog peripherals such as our high-precision temperature sensor without compromising product cost, performance or size,” said Mike Salas, vice president and general manager of Silicon Labs’ microcontroller products. “Our customers are faced with the need to pack more functionality in smaller footprints, and we excel at architecting MCUs that deliver the utmost in computational throughput, integration, power efficiency and analog performance.”