Monday, October 22, 2012

With its Catherina square ceiling fixture, the LED lighting solutions specialist FuturoLighting is presenting a new solution for widespread use in interior lighting – be it in architectural, retail or residential lighting applications. The energy-efficient luminaire is optionally available with motion sensor and emergency module and has a long operational lifetime. Duris E 5 LEDs from Osram Opto Semiconductors, a mid-power LEDs which were specially developed for applications requiring high-output, homogenous planar light – will be installed in the luminaire.

A smart sensor module detects movement and distinguishes between day and night. This functionality was developed for hotel corridors and rooms where light activation is only required when customers are present in order to decrease facility power consumption. Based on customer requirements, Catherina2  can be equipped with new emergency module based on Li-ion battery technology, this module is currently under development. Thanks to advanced Osram LED technology, Catherina2  offers high efficiency with minimal power requirements, a life expectancy of over 50,000 hours and requires no maintenance other than normal dusting/cleaning during the whole product life. “We are proud to include Osram LED technology in our products, with their high quality, reliability and excellent support,” says Valentin Kulikov, CEO at FuturoLighting.

Osram Duris E 5: The ideal LED for planar lighting

The Duris E 5 from Osram Opto Semiconductors is the perfect LED for a particularly homogenous distribution of light in panel lights. With a color temperature of 4,000 Kelvin and a color-rendering index of 85, the LEDs generate a light color which is similar to daylight – an aspect which is particularly important in office and retail lighting – the areas of application of the Catherina2. The Duris E 5 are among the most efficient LEDs on the market in their performance class (mid-power), achieving 110 lm/W (at 4,000 K and 120 mA). Since their product launch in October 2011, their output has already been increased by 25 percent. They are now also achieving very good lumen maintenance figures in accordance with the IESNA LM-80-08 standard. These results are an important factor in the Energy Star certification of LED lamps and luminaires in the USA and also are increasingly being demanded worldwide as a standardized test method for lumen maintenance. Andreas Vogler, Product Manager at Osram Opto Semiconductors said: "Duris E 5 is the ideal LED component for high-output, homogenous planar light applications such as in Caterina2. The excellent price/performance ratio of this LED is prompting more and more manufacturers to convert their product designs to LED technology from Osram Opto Semiconductors."

Catherina2 : For all areas

Catherina2 has dimensions of 300 x 300 x 55 mm, power consumption of around 25 VA and gives out around 1,600 lm in near Lambertian light distribution. Suitable applications include power-saving corridor illumination (hotels, museums, schools, hospitals, shopping centers, malls, etc.), residential illumination, retail illumination, architectural lighting, and many others.

Please refer to FuturoLighting's web site for more technical details about Catherina². Information about the Duris E 5 can be found in the product catalog.

Osram Opto Semiconductors announces the prototype of the Oslon Compact, currently the most compact high-power LED for the automotive market. Thanks to the flexible arrangement of these small LEDs it will be much easier and more cost-effective to create unique, signature headlight designs. A prototype of the Oslon Compact LED will be unveiled by the automotive semiconductor specialist from Regensburg in October at the SIA Vision conference in Versailles (France, October 9/10).

Despite their high efficiency, luminous intensity and durability, LEDs have faced a major challenge as light sources in vehicle headlights in that different LEDs have had to be used for different areas in order to achieve a uniform arrangement of the light-emitting surfaces. Sophisticated design concepts therefore involved a large amount of effort and high costs.

One for all

The extremely small size of the new Oslon Compact – combined with its high light output – enables a single LED type to be used as the default light source for all automotive forward lighting applications. The light points in the headlight can be placed in any arrangement, for example, and customized designs can be developed to give different vehicles a unique appearance. The small size of the Oslon Compact LEDs means they can be grouped very close to one another so they can even be used for light guide solutions and adaptive frontlighting systems (AFS).

Reduced to the bare essentials

The compact design has been achieved by reducing the LED to its bare essentials. The entire LED package is not much larger than the actual light-emitting surface of the chip. The platform is the successful UX:3 chip technology from Osram Opto Semiconductors which provides high luminous efficacy even at high currents. The prototype showcased at SIA-Vision measures only 1.5x1.9 mm² and produces 200 lumen from 700 mA. The clear white light from the chips is achieved through Osram’s C2 technology which converts blue light with the aid of ceramic conversion.

The solution that the market needs

“The development of the Oslon Compact is a direct response to changing market requirements in the automotive sector. There is a need now for high-power LEDs that are more compact and more cost-effective than before”, said Peter Knittl, Director Marketing Automotive. “We have been able to adapt the reliable chip and package technologies that have proved so successful in the Oslon Black Flat and Ostar Headlamp Pro LEDs to fit this smaller design and can therefore supply the market with the solution it needs.” The introduction of this space-saving solution makes a huge contribution to the spread of LED technology in the forward lighting sector and makes efficient and durable lighting solutions available as standard for more vehicle models.

Osram Opto Semiconductors now offers its first direct green diode lasers. The two compact laser diodes have an optical output of 30 and 50 milliwatts and a particularly high beam quality so they represent a milestone in the development of miniature projectors for mobile devices such as smartphones and cameras. Projection units for laser shows, point lasers and line lasers will also benefit from the new technology.

Direct green diode lasers are an important step toward powerful pico projectors. It means that the old laborious way of producing green light by doubling the frequency of infrared laser is no longer needed. What’s more, the new technology enables high color rendering and excellent contrast to be achieved. The wavelength of the new PL 520 laser diode of 515-530 nm produces precisely the right green for projection applications. Its optical output is 50 mW and its efficiency is typically 5-6 % at present. The PL 515 offers an output of 30 mW in a wavelength range of 510 to 530 nm. With a package diameter of only 3.8 mm the laser diodes enable the dimensions of projection units to be reduced considerably. “The commercial breakthrough for compact laser projectors is closer than ever before”, said Stephan Haneder, Marketing Manager for Consumer Lasers at Osram Opto Semiconductors.”

Single mode lasers with high beam quality

The lasers have a very high beam quality – in other words an extremely narrow beam that spreads out only slightly thanks to its small divergence angle. In the case of pico projectors, which project the laser light with a MEMS mirror (micro-electromechanical system) without any other optics, the size of the light point determines the image resolution. The beam quality is particularly important here. Both laser diodes operate in single mode, which means they emit only a single transverse oscillation mode.

Direct emitting lasers can be better modulated than other laser types, such as frequency-doubled infrared lasers. This is an important property for MEMS-based projectors in which the color components per pixel result from the emission time of the laser diode. There is also no need to adjust the focus of the projection image. The image is always sharp, even on curved surfaces.

Laser shows, point lasers and line lasers

The single mode lasers open up new possibilities as light sources for laser shows. Their high beam quality enables extremely fine structures to be displayed even over large distances. The projectors also benefit from the high thermal stability and small size of the lasers.

Green diode lasers are also ideal as point or line lasers for measuring distances for example. The human eye is most sensitive in the green spectrum so they offer another important advantage over red laser light. For the same laser output, and therefore the same laser safety class, green light is perceived more easily by the eye than the red light that is usually used. This means that distance meters, such as those used by builders, can be used over larger distances.

By launching one of the first direct emitting green laser diodes Osram Opto Semiconductors is underlining its leading position in lasers based on indium gallium nitride. The green laser is the result of years of intensive development work in Regensburg. It has been developed as part of the MOLAS project sponsored by the German Ministry for Education and Research and involving technologies for ultra-compact and mobile laser projection systems. In 2010, researchers at the company received the Karl-Heinz-Beckurts Award for development work on the green laser.

KYOCERA Display is offering a new capacitive touch switch based on technology experience gained in the smart phone market. This capacitive touch switch detects variations in position and command. This technology offers the highest standard of optical performance with ease of design. Capacitive touch solutions focus on a number of applications, including: handheld terminals, gaming, medical equipment, point-of-sale and mobile applications to enable human-machine interface.

The new touch switch solutions provide outstanding clarity and simplify the design. The new capacitive touch switch technology eliminates air gaps and reduces the number of layers. An improved visibility results from less reflectance and higher transparency of the display image through the touch panel and allows for a thinner display sensor stack up. (0.5mm—0.7mm thickness in viewing area). The new solutions not only offer high optical performance but also are more compact and light weight. The structure is very robust with lifetime of approximately 100 million touches. The surface is not damaged by exposure to fluid and is easy to clean.

In addition, the new touch switch solution from KYOCERA Display offers a transparency of min. 95 percent and a reflection of less than 15 percent. The operating temperature is -20°C - +70°C.

Products based on the capacitive touch technology are currently available for demonstration and design-in purposes in 3-inch (T-55149) and 3.5-inch (T-55343) display sizes. Additional sizes in 5.7-inch (T- 55265) and 6.5-inch (T-51750) will soon be available. Our touch switch solution is available alone or with out display product integrated to the touch screen.

To meet the increasing demand for LED backlighting in the industrial LCD market, KYOCERA Display Corporation, Inc., has developed one of the broadest lines in the industry of TFT LCDs with white LED backlights.

These displays feature longer lifetimes (an average of 70,000 hours), with front of screen brightness levels ranging from 400 cd/m2 to 700 cd/m2 for indoor use and 800 cd/m2 to 1200 cd/m2 for outdoor applications. Additional features include wide viewing angles up to 160º, high contrast ratios up to 1000:1, and wide operating and storage temperature ranges. Available display sizes include 2.0”, 3.0”, 3.5”, 4.3”, 5.7”, 6.5”, 7.0", 8.4”, 10.4”, and 12.1” diagonal, with a variety of resolutions to choose from.

KYOCERA Display LED-backlit LCDs offer numerous advantages over conventional CCFL-backlit LCDs, including no warm-up time at low temperatures, lower power consumption, higher dimming ratios and, because they do not require high-voltage and high-frequency inverter circuits, significantly reduced electro-magnetic interference (EMI). And since LED backlights contain no mercury, these displays offer a more environmentally friendly option as well.

These displays feature industrial standard CMOS (complementary metal oxide semiconductor) and LVDS (low-voltage differential signaling) interfaces for easy system development. Many new products also have the LED driver built-in to the LCD models.

KYOCERA Display’s LED-backlit LCDs are designed for a board range of applications, including test & measurement, factory automation, navigation and avionics systems, POS and ATM machines, and medical equipment.

Originally developed by KYOCERA Display as one of it technological innovations for the American automotive market, Advanced Black Nematic (ABN) achieves a true black level by dramatically reducing the light leakage, resulting in exceptional performance for a passive monochrome display.

ABN technology uses a special liquid crystal alignment structure to achieve a true black level, it dramatically reduces the light leakage to 0.008%. The LCD panel features contrast ratio of 1000:1(for segment type), super wide viewing angle, and with no performance shift over wide temperature range.

This technology also exhibits practically no color shift, so any backlight color can be used without compromising contrast ratio.

Feature Highlight:
  •     Super high contrast ratio
  •     Wide viewing angle
  •     No color shifting from off angle
  •     Multiple LED colors are available to choose

ON Semiconductor (Nasdaq: ONNN), a premier supplier of high performance silicon solutions for energy efficient electronics, has expanded on the company’s extensive interface and power management portfolio with the introduction of a pair of ultra small, ultra thin, small signal MOSFETs optimized for space-constrained portable consumer electronics such as tablet computers, smart phones, GPS systems, digital media players and portable games consoles.

“As portable electronics continue to decrease in size while the number of on-board features continue to increase, there is, and will continue to be, an ongoing need for ultra small, high performance components to make feature-rich on-the-go devices energy efficient and highly functioning,” said Paul Leonard, vice president of ON Semiconductor’s MOSFET products division. “The NTNS3193NZ and NTNS3A91PZ do just this by enabling design engineers to specify a device that has the necessary features and functionality while still allowing sleek, stylish designs that consumers have now come to expect.”

The new NTNS3193NZ and NTNS3A91PZ are considered the industry’s most compact small-signal MOSFETs as they are housed in a tiny 0.62 mm x 0.62 mm x 0.4 mm XLLGA3 package. With a total surface mount area of only 0.38 mm², the XLLGA3 package is the ideal solution for the ever shrinking environments of portable electronics, and easily replaces competitive products offered in much bigger packages such as SOT-883 (with a surface mount area of 0.6mm²) or the SOT-723 (with mount area of 1.44mm²).

The NTNS3193NZ is a 20 volt (V), single N−channel, 0.75 ohms typical on resistance at ±4.5 voltage gate to source (VGS) device. This is complemented by the NTNS3A91PZ -20 V, single P−channel device, which has 1.3 ohms typical on resistance at ±4.5 V.

With low RDS(on), low threshold voltage, and 1.5 V gate drive capability, these new MOSFETs greatly reduce power consumption when incorporated in portable electronic products making both devices ideally suited for small signal load switches, analog switches and high speed interfacing. Both devices are fully Pb-free, halogen-free and are RoHS compliant.

ON Semiconductor Corporation (Nasdaq: ONNN), a premier supplier of high performance silicon solutions for energy efficient electronics, has introduced the LC898212XA-MH, an Auto Focus (AF) Control IC for camera modules in smartphones. This innovative solution is highly integrated, programmable and provides fast, accurate auto focus convergence while consuming less power and generating less noise interference than competing solutions. The space-saving design has been optimized to enable thinner and lighter smartphones.

“There is a strong and growing demand for improved smartphone camera features – specifically for fast, accurate, power-friendly auto-focus,” said Tomofumi Watanabe, general manager of ON Semiconductor’s SANYO product division. “We developed this highly integrated, compact and highly power efficient auto focus solution for the specific needs of smartphone applications. It provides an effective, single-chip solution to the technical limitations that have challenged many of our industry-leading wireless communications customers.”

LC898212XA-MH features digital logic with a closed loop control system and a function for a positioning sensor. Its closed loop architecture provides for more accurate auto focus control while also lowering power consumption relative to open loop solutions. The function for a positioning sensor is a constant current digital-to-analog converter (DAC) and gain adjustable operational amplifier to ensure accurate sensing. The output of the positioning sensor is read by an integrated 10 bit analog-to-digital converter (ADC). Furthermore, the control circuit filter coefficients are adjustable via an I2C interface, allowing the LC898212XA-MH to be programmed for optimal convergence time when paired with various different actuators. This innovative new device also incorporates an improved pulse width modulation (PWM) drive system to further lower power consumption while also minimizing noise which can affect image quality.

Omron Corporation announced today that it has reached an agreement with Aduro, Inc to acquire the Silicon Valley manufacturer of precision high-speed optical subassemblies. The Electronic Components Business Unit (ECB) within Omron assumed the assets of Aduro on December 30, 2005, and has established a new subsidiary called Omron Network Products LLC (ONP), which includes the entire Aduro team.

This acquisition brings great synergy to Omron, which has been developing a new line of optical component products including CWDM devices, passive optical switches and microlens arrays. Omron has targeted the optical components product line as a key segment for growth of its components business. The combination of Omron and Aduro core technologies will position Omron as the world’s premier optical component supplier of course wave-division multiplexing (CWDM) products. With the acquisition, Omron immediately becomes one of the leading suppliers of integrated, CWDM transmit optical subassemblies (TOSA) and receive optical subassemblies (ROSA) for the 10Gigabit Ethernet and high-definition video markets. The combined companies have already begun working with industry leaders to develop the next-generation optoelectronic components and OSAs.

Aduro was established in 2003 after buying Blaze Network Products. Aduro now has an outstanding technology base for LX4, a key optical interface defined within the 10 Gigabit Ethernet standard, which uses four multiplexed wavelengths. Aduro’s LX4 ROSA has already been accepted as the optimal solution by a number of major optical transceiver companies. Aduro is also developing new connectivity products for high-speed video transmission to and within the home.

“The acquisition brings much-desired financial resources to the company” says Brian Peters, former CEO of Aduro and now President of ONP. “Our customers, as well as the industry in general, have been pressing us to quickly ramp into mass production. The influx of capital will allow us to ramp for the LX4 transceiver market, which is gaining momentum in the marketplace, as well as several other markets including consumer electronics.” The new company plans to expand its business for FTTH and home network by developing products in collaboration with Omron, which plans to launch ONP’s products in the Japanese market as well.

OMRON Corporation (TSE: 6645, US: OMRNY), a global leader in electronic components, sensing and control technologies, announced that it will launch a new SMD Polymeric Antenna (type: WXA-N1SL) for short-range, wireless Ultra-Wideband (UWB) applications. Product launch is scheduled for 1 June, 2006.

Driven by consumer demand for simple wireless functionality, “point-and-shoot” usability and increasingly mobile lifestyles, the wireless communications market, led by Bluetooth™ and wireless LAN, has shown phenomenal growth over the past few years. UWBi is now attracting particular attention as a solution for high-speed, high-volume reliable data transmission over short distances.

UWB is a recently commercialized short-range wireless technology, expected to be widely adopted in consumer goods. Applied in dongles, personal computers, printers, mobile telephones, digital televisions and DVD players, UWB functions as a low-power-consuming wireless USB (universal serial bus), allowing users to transfer large amounts of data rapidly between various devices in close range. For example, UWB makes it possible to transmit high-definition video data wirelessly between a high definition digital TV and DVD player, thereby eliminating the need for expensive and unsightly wires.

Due to the wide frequency range on which UWB operates, electronic devices need to be equipped with a special ultra-wideband antenna for UWB-compatibility. While various antennae are currently in the market, OMRON’s new SMD Polymeric Antenna (type: WXA-N1SL) combines both compact size with high-performance, utilizing the company’s proprietary molding technology and dielectric polymer material. As a result, with OMRON’s antenna, ODMs and OEMS deploying UWB can benefit from flexibility of antenna shape design without compromising on size or performance. Capitalizing on its expertise in precision manufacturing, OMRON has now succeeded in mass production of the antenna at its factory in Shiga prefecture, Japan.

SMD Polymeric Antenna: type WXA-N1SL is optimized for WiMedia™ Alliance’s UWB common radio platform as well as for the Certified Wireless USB specifications from the USB Implementers Forum (USB-IF). OMRON will also work to optimize all future versions of the antennae for the recently announced next-generation BluetoothTM-Over-UWB platform.

OMRON has been collaborating closely with many of the UWB chipset companies over the past 12 months, including San Diego, California-based Staccato Communicationsii, a UWB technology pioneer and Certified Wireless USB leader.

“Omron's production-ready N1 UWB antenna offer a small form-factor, high performance and low cost solution for our customers that complement our Ripcord single-chip, all-CMOS products based on Certified Wireless USB," said Jason Ellis, Director of Business Development, Staccato Communications. "Omron's antennae were accepted for inclusion and have been shipping with our Ripcord Development Kits."

OMRON aims to achieve sales of 3bn Japanese yen for the WXA-N1SL antenna in FY2008. By maximizing the mass production potential and flexibility of its proprietary dielectric polymer molding technology, the Japanese manufacturer plans to further enhance its WiPlaDsiii series of wireless polymeric high-frequency devices including antennae to cover a wider range of device applications.

OMRON Corporation (TSE: 6645; US: OMRNY) today announced its new V750 reader platform, which will support global frequency bands for the United States (915MHz), Europe (867MHz) and Japan (953MHz). The V750 series, designed and manufactured by OMRON, will be newly introduced to the European and Japanese markets, while in the U.S. it represents an expansion to OMRON’s current V740 EPC UHF reader product range.

The V750 reader platform enables high performance EPC Gen2 reading/writing and features easy set up, advanced diagnostics, self execution and RF environmental monitoring functions.

Drawing on decades of experience in the design and manufacturing of RFID systems, OMRON has introduced the V750 in response to many global customer and system integrator requests for an interrogator that can lower total installation costs, expand RFID applications and provide site analysis assistance.

The V750 runs on a light real-time operating system (RTOS) that delivers consistent, repeatable performance to meet high-line speed and I/O requirements for supply chain as well as packaging and manufacturing operations. For example, the V750 has an “optimized” implementation for tag density self adjustment which improves actual read times required for applications that have frequent changes to the number of tags being read.

The new platform supports OMRON’s recently announced scanning antenna technology that provides direction of tag travel and eliminates “null points” in the read zone to achieve significant improvement for RFID tag read reliability.

The combination of OMRON’s global frequency Gen2 inlays and the new V750 reader platform continues to underscore and expand the company's commitment to support today's worldwide business activities.

OMRON Corporation (TSE: 6645; ADR: OMRNY; “OMRON”), a global leader in sensing and control technologies, announced that its control components have been used in a sun-tracking solar power system situated near to Madrid, Spain. The system was installed by Electricidad Alsanbo S.A. (“Alsanbo”), a Spanish systems integrator.

The system adjusts the positioning of solar cell panels to ensure that they remain perpendicular to the incident angle of the sun’s rays in order to maximize energy output. As a result, the system is able to generate 30 to 40% more power than traditional stationary systems.

In response to Alsanbo’s need for a total solution, OMRON supplied all of the components necessary for the system’s operation including solar conditioners, programmable logic controllers (PLC), a PLC-based communications interface, programmable terminals, power supplies and limit switches.

Programmed with historical data on the position of the sun, OMRON’s PLCs precisely control the horizontal rotation and vertical tilt of the solar panels to accurately track the sun’s movement.

OMRON’s solar power conditioners convert DC power generated by the solar panels into AC power for household use. They also incorporate a grid interconnection protection function which automatically stops the system operating if a disturbance occurs in the commercial power system or an accident occurs on the power company side of the interconnection.The methods and safety standards concerning interconnection for power companies vary between countries. OMRON optimized this system to conform with the Royal Decree that regulates interconnection in Spain.

Inverters alter electrical frequency in response to data from the PLC on the rotation and tilt angles in order to control the motors that move the solar panels.

OMRON Corporation (TOKYO: 6645; ADR: OMRNY) today announced the release on October 1, 2012 of the G9EN DC power relay, the world's smallest and lightest high capacity DC power relay of its class (*1). The relay is 50% smaller and lighter than Omron's previous comparable relays thanks to the use of newly developed proprietary sealing technologies and new magnetic control methods (*2).

With the global expansion of the market for environmentally-friendly clean energy vehicles such as hybrid and fuel-cell cars, there is quickly growing demand for mileage extension and new high-capacity battery DC load control technologies. Omron has been working over the last decade to meet the needs of clean energy car manufacturers for greater circuit design flexibility and components that enable down-sizing and weight reduction of onboard electrical equipment. With the G9EN (60A), Omron is taking down-sizing and weight reduction to the next level, and the company is also preparing for the release of other advanced new products including a 150A main relay, and an air-break switch pre-charge relay (*3).

OMRON Corporation (TOKYO: 6645; ADR: OMRNY), a world leader in automation technology, and STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronic applications, today announced the completion of the development of a MEMS-based gas flow sensor with industry-unique built-in correction for differences in gas composition. OMRON will start sample shipments of the new sensor in November 2012.

As with electricity-consumption measuring, gas metering is moving from conventional mechanical solutions to smart electronic meters with automatic meter-reading functions. There are over 400 million mechanical gas meters in the world and most major gas providers are readying to replace their traditional meters with more accurate and reliable electronic devices.

In addition to higher precision and reliability, the OMRON/ST sensor solution enables the development of smart gas meters that are much smaller, less expensive, and more power-efficient than the conventional equipment, resulting in substantial cost savings for the utility companies and end users alike. Industry analysts expect the global smart gas meter market to exceed 10 million units a year by 2015.1

The new gas-flow sensor combines Omron's state-of-the-art MEMS (Micro-Electro-Mechanical System) thermal flow transducer with ST's high-performance analog front-end IC, delivering high-precision gas flow-rate measurement with excellent reproducibility. Gas meters built around the OMRON/ST solution do not need to be configured for a certain type of gas at the time of shipment or installation, as they are intrinsically compensated for both temperature and pressure variations and a built-in circuit compensates for the variation of multiple gas composition. The sensor is dust-resistant to comply with international gas-meter standards.

"The successful collaboration with OMRON in gas metering expands ST's foothold in the increasingly important field of 'intelligent measurement' and sets us to replicate the great success we have achieved in smart electricity metering," said Marco Cassis, Executive Vice President and President, Japan and Korea Region, STMicroelectronics.

"We are very much excited to introduce a new powerful one-stop solution that enables a simple and very accurate Smart Gas Meter System for global markets through the successful collaboration with STMicroelectronics. By enabling IT-based smart metering, this new technology will significantly contribute to energy saving," said Yoshio Sekiguchi, Senior General Manager of the Micro Devices Division of OMRON Corporation.

MOD-GSM is 4 band cellular phone GSM/GPRS module which allow any board with UEXT connector to place and take GSM calls and to send and receive SMS-s and to connect to internet through GPRS and send and receive TCP-IP data.

Onw of our developers, Stefan made small demo example for how to use MOD-GSM with iMX233-OLinuXino, the project is at GitHub website.

you can compile it with:

$ cc MOD-GSM.c -o mod-gsm

them make it executable with

$ chmod +x mod-gsm

and use it with

$ ./mod-gsm -help

what MOD-GSM code does? Each time somebody call the SIM card phone number it will log it in CALL-LOG file, if SMS is received it’s logged in SMS-LOG

with:

$ ./mod-gsm -pb ADD OLIMEX +35932626259

you create new entry in the PHONE-BOOK

then if you got call from +35932626259 it will log it as call from OLIMEX

you can send SMS with this command

$ ./mod-gsm -sms OLIMEX

then the program will wait for the SMS text terminated with <enter> and send it

you can also run mod-gsm with & to run in background and log your calls and SMS-s

CooCox is highly integrated and free ARM Cortex-M0-3-4 development IDE with compiler, debugger and lot of code examples.

CooCox supports our OpenOCD ARM-JTAG-TINY-H, ARM-USB-OCD-H and ARM-JTAG-SWD ARM-JTAG-2010 adapters, so our customers could work with CooCox IDE with our current JTAGs.

What we missed in our product range though was the designed by CooCox team own JTAG adapter with build in support for SWD and fast programming.

This is why we built ARM-JTAG-COOCOX it’s open source hardware and software JTAG which is supported out of the box by CooCox IDE, so you can fast program and debug your code with CooCox IDE.

At EUR 24.95 ARM-JTAG-COOCOX is fast, reliable and completely open source product.

CooCox IDE generally gives you the same what commercial IDE vendors provide and sell for thousands of euro, but it’s completely free, so you should definitely give it a try when you make your next ARM project.

MOD-TC-MK2-31855 is UEXT Module whth the new MAX31855 IC and works with K-Type thermocouple and measure temperature from -200C to +1350C with 0.25 C resolution.

MOD-TC-MK2-31855 works with I2C and this allow many MOD-TC-MK2-31855 to be connected together to any of our boards with UEXT connector.

MOD-TC-MK2-31855 have also 7 general purpose GPIOs which also can be read and written with I2C commands.
Everyone have chance to win this board if answer correctly our Quiz question.

Today at 17.00 o’clock our local Bulgarian time (GMT+3) we will post on Twitter our question.

You have one hour to reply to our tweet with the correct answer.

At 18.00 o’clock we will count the correct answers and ask random.org to generate random number in range then anнounce the winner and ship the board by airmail next Monday.

Open Fest is yearly event for open source and open technologies.

This year Open Fest celebrate 10 years and it will be on 3rd and 4th of November as usual in Sofia Interpred centre.

The foreign lecturers this year are: Brian Doll и Hengeveld Nick from GitHub and Harald Welte from OpenMoco.

Olimex will present where we are with the open source Hardware project OLinuXino and what is the further roadmap of devices which will be covered.

This year there will be an practical Hackathon which will run during the Open Fest. Everybody with idea to implement something with Arduino, Pinguino, Maple or OLinuXino have chance to complete the project during the event and to get as reward free board.

Please register your interest to attend the Hackathon to Marian Marinov (mm at openfest org) or to Olimex (info at olimex).

Ohmite Manufacturing Company, a leading provider of thermal solutions and resistors for high current, high voltage and high energy applications, announces that it has expanded its FC4L Series of four terminal current sense resistors. This series, previously available in five watt package sizes, is now also available in two watt package sizes.

Employing a Ni-Cu-Mn resistive element, the FC4L Series features a built in four-terminal design with two larger electrodes for current management and two smaller electrodes for voltage measurement. This Kelvin type resistor is designed for automatic insertion and features a metal foil construction, ensuring a very stable Temperature Coefficient of Resistance (TCR). In addition, it provides a tight tolerance (5% at 1 milliohm, 2% at 2 milliohms, and 1% at 3, 5, 10, 25, and 50 milliohms).

Available in industry standard sizes, the FC4L Series functions for both high heat resistant use and low heat electromotive use. Its four-wire connection improves measurement accuracy by directly sensing a voltage drop across the resistor. This eliminates inaccuracies caused by voltage drops across resistor leads and printed circuit board (PCB) traces.

These current sense resistors can be used in a variety of battery powered electronic devices to mitigate concerns with battery life, recharging frequency, and overcharging risks.

NIHON DEMPA KOGYO CO., LTD. has developed the world's smallest (2.0 × 1.6 × 0.7 mm) (*1) sized environment-friendly crystal clock oscillator “NZ2016SF” with low power-driven (0.8V min).

Recently, eco-friendly products have become popular to meet the social needs of “Carbon reduction” and “Environmental load decrease”. For this reason, there is a strong demand for electronic components constituting these products to be environment-friendly. Due to the requirements for extended battery life and multi-functionality, energy conservation through both miniaturization and power saving is desired, especially in compact devices such as mobile phones or handheld devices. NDK has previously developed “NZ2520SF” crystal clock oscillator, and we have developed a smaller sized crystal clock oscillator “NZ2016SF” to achieve the market needs of “miniaturization and low-power”.

NZ2016SF has miniaturized about 50% in capacity and weight, comparing to our previous model (NZ2520SF:2.5 × 2.0 × 0.9 mm) without impairing the quality and “ultra-low power driven” technology. In addition to these features, NZ2016SF has achieved environmental load decrease.

This product helps achieve low-power operation, has significant increase in battery life and reduction in environmental load especially in mobile devices such as multi-functional mobile phones, silicon audio players, PND (Personal Navigation Device) and notebook computers. Due to its wide frequency range (1.5 to 50MHz), it can be used in a wide range of electronic devices other than mobile applications, leading to environmental load reductions in various fields in the electronics industry.

NIHON DEMPA KOGYO CO., LTD., represented by Hiroshi Takeuchi, has developed the world’s smallest(*1) (2.0 x 1.6 x 0.7mm) TCXO with two outputs of the same reference clock frequency. We plan to offer samples in October 2010 and start mass production in or after 2011.

Mobile information terminals such as smart phones equipped with short-distance wireless communication function such as Bluetooth or W-LAN in addition to the verbal communication function is becoming increasingly popular nowadays. Previously, a dedicated reference clock signal source was needed in order to equip the short-distance wireless communication function in addition to the verbal communication function. For this reason, the need for a TCXO that can provide reference clock signal to both of the two functions mentioned above has increased amidst the ambivalent two needs: miniaturization and multifunction. In order to meet these market needs, we have developed the world’s smallest TCXO with two outputs of the same frequency.

This TCXO can provide reference clock signal to both of the two functions via independent outputs. Also, its Enable/Disable function offers more efficient power management, leading to lower power consumption.

Previously, multiple reference clock sources were needed for the short-distance wireless communication function of mobile phones. But this TCXO alone can provide the reference clock signal to both of the two functions. This will help downsize the circuit boards in mobile information terminals. Moreover, the Enable/Disable function offers lower power consumption, longer battery life and reduced environmental load.

NIHON DEMPA KOGYO CO., LTD., represented by Hiroshi Takeuchi, has developed miniaturized and low-profile WLP (Wafer Level Package) type SAW device (filter/duplexer) for module use.

In recent years, there has been a trend to modularize the wireless communication functions of mobile information terminals such as cellular phones and smart phones. This is because many telecommunication carriers have decided to adopt LTE (Long Term Evolution), the successor of GSM-UMTS, for the Next Generation Network. As a result, the shift towards multimode and multiband GSM/UTMS/CDMA/LTE has been accelerated, and thus the wireless communication functions have become more complicated. This is the reason why modularization has become essential.

Unlike the conventional SAW filters, a ceramic package is not used in this product. We have developed the WLP structure in which the piezoelectric substrate of the SAW device chip is used as the package. We have reduced the size of 1.4 x 1.1mm type SAW filter to 0.8 x 0.6mm without changing the filter characteristics and also reduced its height to 0.35mm which is essential for modularization. Our proprietary technology offers an excellent pressure resistance which can withstand the pressure of mold resin injection applied at the time of producing modules such as SiP (System in Package) and boards with built-in components.

We plan to start mass production in 2011. We will announce the product specifications as soon as they are finalized. We are confident that this product will satisfy your needs.

Tuesday, October 16, 2012

In electrical equipment that generates heat, cable bundles must be durably protected against high temperatures. With Terostat 3631 FR, Henkel has developed a flame retardant and easily applied butyl sealant which is especially suitable for applications where low flammability is essential.

Unlike conventional butyl-based sealants, Terostat 3631 FR easily withstands continuous exposure to temperatures up to 105°C and also has self-extinguishing properties in the event of a fire. As a result, Terostat 3631 FR is suited for use as a longitudinal water-repellent sealant for cable bundles in electric ovens, microwaves, heating systems or tumble dryers.

In addition to high-grade thermal protection, a further advantage offered by the sealant is its easy handling and excellent resistance to water and moisture. As a soft-moldable compound, Terostat 3631 FR is simply applied manually to seal off the cable bundle. This eliminates the fiddly work required in many cases to thread cables through grommets. Moreover, when applied hot, the sealant can also be processed automatically.

The capacity and performance of the diecasting industry is greatly dependent on the development of efficient and sustainable manufacturing technologies. Henkel will be presenting a truly future-aligned product portfolio at GIFA 2011, encompassing innovative solutions right along the entire value chain and offering industrial users all the synergy benefits ensuing from the merger.

High-quality and corrosion-resistant diecast components pass through a number of process stages before they can be deemed ‘complete’. Aside from the actual casting process, machining, component cleaning, pretreatment and final assembly all have a decisive influence on their value. Henkel is able to offer premium products covering all the manufacturing stages mentioned. Indeed, the company’s portfolio includes everything from high-performance lubricants and lubricoolants to specialty cleaners, conversion coatings, adhesives and sealants. Henkel also supplies specific application equipment for water free systems compatible with the specific fluids that it handles. Henkel is able to ensure the ideal interplay between all the process stages, securing maximum value added at every turn.

Excellent tribological performance, efficient coating application

Henkel’s lubricants and mold release agents of the Deltacast range are indispensable aids for the casting process itself, delivering first-class performance even under conditions of high temperature. They help to extend the service life of the molds, reduce scrap rates and increase productivity. The Deltacast CP-range are water-based release agents specifically designed for the pressure die casting, thixo-casting and squeeze casting of aluminum, magnesium and other non-ferrous metals. The CG-range are specific formulations for the gravity and low pressure die-casting of aluminum and non-ferrous metals. For the perfection in die management technology for pressure die-casting of aluminum and magnesium, Henkel has developed Deltacast Liquid Powder.

Despite the sophisticated production processes applied, expensive castings can sometimes be rendered unusable by porosity, blowholes or similar structural defects – unless, of course, they can be salvaged with Henkel Loctite-KID. This vacuum impregnation process enables flawed components to remain in the manufacturing process instead of being assigned to the scrap heap. Offering impressive properties such as good resistance against chemicals and solvents, a high level of thermal durability and effective resealing, the impregnating agents used by the system are approved by the major automobile manufacturers and OEM suppliers around the world. The impregnation process leaves the treated workpieces clean and free of corrosion and oxidation, enabling them to be further processed without any reworking. And the cured impregnant also remains resistant to oils, grease, most kinds of acid, liquid fuels, gases, coolants and solvents throughout the service lifetime of the components involved. For the impregnation of workpieces, LOCTITE offers a choice of an external full-service package or the tailored integration of a vacuum impregnation plant within the customer’s production process.

Focusing on the full value chain

As a world leader in the manufacturing of adhesives and sealants and based on decades of experience in industrial cleaning and surface treatment, Henkel is also in a position to supply customers with sophisticated solutions for cleaning and machining. Henkel’s P3 products are high-quality alkali, acid and neutral aqueous cleaners for efficient process, parts and maintenance cleaning. The enhance both th the efficacy and the reliability of the overall process, as well as the quality of the manufactured components. And for the machining stage, Henkel is able to offer high performance coolants which deliver economic metalworking and forming of light metals, cast iron, steel alloys and non-ferrous metals. Multan features have created an innovative push in metal operations including: High cleanliness, longer tool life, low scrap rate and reduced consumption.

Henkel is also setting new standards in metal pretreatment with its Alodine product group for chrome-free coating and anodizing processes. Given the ever-increasing concerns over environmental and health risks, the trend in the metal-coating industry is toward even more extensive use of chrome-free technologies – an area in which Henkel can already resort to more than ten years of research expertise. Its Alodine products offer ideal corrosion protection for aluminum, magnesium and light alloys while guaranteeing outstanding paint adhesion.

Last but not least, customers can also rely on the reliability of Henkel products for the subsequent component assembly phase. The company’s widely known adhesive under the Teroson brand offer multiple solutions for the structural bonding of metal and plastics, replacing conventional joining techniques such as welding and screw-fixing. Meanwhile, liquid gaskets of the Loctite brand are ideal for component surfaces of all shapes and sizes. These flange seals are resistant to oil, transmission fluids and water while also exhibiting impressively high temperature resistance.

Over the past decades, structural adhesives have evolved into effective and dependable alternatives to conventional joining techniques such as bolting, riveting and welding. They can be used to bond almost all materials commonly employed in industrial manufacturing. One essential aspect is selecting the right bonding solution for each particular construction. But which adhesive solutions are available and which factors must be considered in order to get the best results?

Structural adhesives are used to join a variety of similar and dissimilar materials effectively while achieving an optimal distribution of mechanical loads, stresses and vibrations. The range of applications stretches from bonding of single-use medical articles through to the assembly of heavy equipment. In order to ensure the structural strength of the bondlines, the structural design of the materials to be joined and the choice of adhesive technology must be very carefully evaluated. Different constructions will pose different structural bonding demands.

Structural design considerations

The strength and long-term durability of a structural adhesive bond depend especially on the adhesive used, the materials involved, and the loading to which the construction will be exposed. The loads, in other words the external forces acting on a construction, can be classified according to five types of stresses: tensile, compressive, shear, peel and cleavage forces. For each type of loading, there is an adhesive technology which optimizes the ability to withstand the forces acting on the component in question.

Tensile force is the force acting on a bondline when the component is pulled or stretched in a direction perpendicular to the bondline and the substrates it joins. With a pure tensile load, the stress distribution within the bondline is relatively uniform. The same load acts on each part of the bond area. This is also true of compressive loads. A compressive force is an external force acting on a joint when the bonded materials are subjected to pressure. In practice, pure tensile or compressive loads are generally rare and usually also involve a degree of peel loading.

In industrial constructions, the most common loads are shear, peel and cleavage forces. A shear force is the force acting on a bondline when the two joined parts are pulled in parallel and opposite directions. Peel and cleavage forces are very similar and are the least desirable forces acting on a structural bondline. These two forces occur when a load is applied to the end of a bondline, being of a peel nature when at least one of the parts can be easily deformed.

Although shear loads are by far more desirable than peel or cleavage loads, in all these three types of loading, the resulting stresses are distributed unevenly across the bondline. Adhesive bonds subjected to shear loading exhibit stress peaks at both ends of the bondline, while the stresses in the middle region are less intense. This load mode is probably the most frequent, especially in overlapped joints, which are the most common adhesively joined configurations. However, peel loads result in high stress concentration at just one end of the joint. If the adhesive starts to come away from the substrate at the edge of the bondline, small cracks will then propagate throughout the entire joint. An effective adhesive bond is therefore characterized by uniform stress distribution, which is achieved by selecting the adhesive that will deliver the best performance for that particular construction.

Adhesive technologies – An overview

In industrial manufacturing, adhesives are playing an increasingly important role in the production of many different kinds of products. They offer a number of advantages that conventional joining techniques cannot match. Compared with traditional assembly methods, adhesive bonds are superior in the presence of dynamic stress, thanks above all to their flexible nature. Rivets or bolts can only transmit forces over a very localized area (point loads), whereas in an adhesive bond, the stress distribution or force transmission is spread over the entire area of the bond. In addition, the parts to be bonded are not weakened by the drilling of holes.

The low heat build-up is another key criterion when joining parts that already have their final surface finish, for example chrome-plated steel. As non-conducting materials, cured adhesives also have an insulating effect, thus preventing contact corrosion.

The substrates involved and the demands made on the final construction are deciding factors when selecting the adhesive to be used. Depending on the field of application, various adhesive technologies with specific product properties are available for structural bonding.

Epoxies

The most widespread class of adhesives used for structural bonding are the epoxies. They are found in automotive and aircraft manufacturing as well as in the building and construction industry. Their big advantage is that they can bond both metals and plastics. Moreover, they are extremely durable, show a low tendency to creep, and only minimal shrinkage on curing. Depending on the type, they can withstand continuous exposure to temperatures ranging up to 100 – 200 degrees Celsius. A further advantage is their very good chemical resistance, although they are generally rigid. Epoxy adhesives offer a broad potlife range of five minutes up to two hours. A long potlife can be an advantage when the parts to be joined require some time to maneuver or when they have to be repositioned after they have been assembled.

Epoxies are available as one-part or two-part systems. In one-part systems, the resin and hardener components are already mixed in the correct ratio during production and only begin to react with each other when exposed to heat. Two-part systems consist of separate resin and hardener components which are only mixed directly before application. When using two-part systems, it should be remembered that the chemical curing reaction begins immediately after mixing.

Polyurethanes

Polyurethane adhesives are also available as one-part or two-part systems. They come in a large variety of viscosities, with a broad range of cure times and different specifications regarding chemical resistance. The degree of crosslinking and hence the final bond strength is determined by the combination of raw materials contained in each of these adhesive systems. Therefore, perhaps their most relevant feature is their capability to match virtually any mechanical requirement, ranging from very rigid grades to extremely flexible adhesives. In addition, they show good resistance to many kinds of solvents. With this performance profile, polyurethanes are therefore widely used for bonding tasks in industries with applications as diverse as bonding windshields to car bodies or assembling rotor blade shells for wind energy plants.

Acrylics

Acrylic adhesives offer a broad adhesion capability. They are able to bond a wide range of varied substrates, including most thermoplastics, and exhibit a good balance between high strength and some flexibility, which makes them one of the most frequent choices when dynamic loads are involved. Another interesting feature of this chemical family is their fast cure speed, which brings additional cost-saving opportunities in the manufacturing process. However, they usually smell and, therefore, when a large adhesive amount is involved it is recommended to apply it in well ventilated areas.

Acrylic adhesives can be either a one-part adhesive with an activator or a two-part adhesive system. The one-component adhesives do not require any mixing. The adhesive is applied to one substrate, the activator to the other, and the curing process only starts when the two surfaces are brought together. In two-part systems, the activator and the adhesive are mixed together using a mixing nozzle and then applied to one surface.

Silicones

In contrast to the adhesive systems described above, all of which are based on organic chemistries, silicone adhesives have an inorganic backbone. Unlike their organic counterparts, silicones remain highly elastic even at temperatures as low as minus 90 degrees Celsius. They are also able to withstand continuous service temperatures of up to 200 degrees Celsius and are exceptionally resistant to UV radiation. Applications where they can be employed as adhesives are in areas where there is a need for high flexibility and high-temperature performance capability. In addition, they show good resistance to aggressive chemical substances and excellent resistance to moisture and weathering.

Silicone adhesives are available as one-part or two-part systems. The range of applications served by one-part silicones stretches from assembly of clothes irons to vehicle manufacturing, and electrical engineering to special tasks in the aerospace industry. Two-part silicones are used in the electrical industry, household appliance manufacturing, and in the vehicle industry. They are particularly useful where atmospheric moisture levels are too low to permit completion of the curing process of one-part silicones or where an acceleration of the production process is desired.

Silane modified polymers

Silane modified polymer adhesives, often referred to as MS polymers, show very good adhesion to many different substrates. The bonds have a continuous thermal resistance of approximately 80 to 100 degrees Celsius, high elasticity (resulting in good resistance to deformation even at low temperatures), and are highly resistant to UV radiation and weathering. Adhesives based on MS polymers are used to bond parts in rail, car and container construction, in equipment and apparatus assembly, metal and sheet metal processing, solar engineering, façade and window installation, air conditioning and ventilation systems, cleanroom equipment, and in a series of building and construction applications. The advantage of this adhesive category is that it is free of silicone oils and therefore presents no incompatibilities during downstream painting of bonded parts.

Breaking new ground in materials innovation, Henkel Electronic Materials has announced its success with a revolutionary silver (Ag) sintering technology that enables high volume production of modern power packages in a process that does not require pressure. In its market debut, Henkel’s Ag sintering capability has been designed into Ablestik SSP2000, a high reliability die attach material well-suited for use with power modules such as IGBTs and high power LED products.

Sintering is a process in which particles are joined together by heating the material in a sintering furnace below its melting point until there is particle adhesion.  Conventional Ag sintering is achieved by applying both heat and pressure to the material, or device, until the metal joint is formed.  The drawback to the pressure application technique in semiconductor packaging, however, is its volume limitation, as devices must be processed individually on capital-intensive die bonding systems.  With Ablestik SSP2000, because the silver particles are joined via a unique surface tension mechanism, the pressure requirement is eliminated and the material can be cured in a standard batch oven at a temperature as low as 200 degree centigrade.  In addition, Ablestik SSP2000 can be processed on standard die bonding systems, eliminating the need to reinvest in specialist equipment and making the transition from existing materials simple, fast and cost-effective.

“The ability to now exponentially increase UPH from traditional silver sintering techniques at roughly 30 units per hour to a remarkable 6,000 units per hour with the Henkel technology is incredible,” enthusiastically explains Henkel’s Dr. Michael Todd, Vice-President of Product Development and Engineering.  “Now, semiconductor packaging specialists can have high volume and high reliability with a silver sintering material.”

While high UPH is a central advantage of Ablestik SSP2000, even more notable is the material’s thermal resistance and reliability.  When compared to high-lead soft solders, which are the current material of choice for power semiconductor devices, Ablestik SSP2000 has far superior power cycling reliability.  In power cycle testing where solder failed at 200 cycles, Henkel’s Ag sintering technology was able to reach more than 2,000 cycles before the first failure.  With thermal conductivity and thermal resistance that are superior to that of solder, Ablestik SSP2000 offers better performance and reliability. For high power devices such as IGBTs, that presents tremendous latitude as compared to traditional solutions.

“Because of Ablestik SSP2000’s superior power handling performance, IGBT designers and manufacturers are now able to reduce the number of chips in a package and save on valuable device real estate,” comments Todd.  “This material provides a technical solution that popular high-lead soft solders simply don’t have. What’s more, all the performance is achieved in a non-pressure process with lower curing temperatures, which is icing on the cake!”

Not only do semiconductor packaging specialists want higher throughput, higher performance materials, but are also actively seeking viable replacements to high-lead solders – particularly in the power device segment. The RoHS deadline for the elimination of lead-based materials from the power device market is currently set for 2014, which means that in less than three years suitable alternatives must be in place.  For power device manufacturers, Henkel already has the solution with the first Ag sintering die attach material of its kind.

As Todd concludes, the flexibility of Henkel’s solution is simply untouchable.  “The lead-free advantage, design latitude, thermal and electrical performance, reliability and high UPH capability – it’s all there.   Our silver sintering technology is already proving its worth in the power device market, has shown great promise in the high power LED market and, frankly, is ideal for any application that requires high thermal capability in high volume.  This will no doubt be a game-changer.”

Henkel announces that it has worked with STMicroelectronics, one of the world’s largest semiconductor companies and advanced chip packaging technology developers, to validate the performance of Henkel’s Ablestik C100 conductive die attach film materials for production of very small package configurations in a process called ScalPack, which incorporates die with extremely small dimensions

Commercialized in early 2011 following process testing at ST, Henkel’s Ablestik C100 materials – available in 15 micron and 30 micron thicknesses – are now extending the proven advantages of film-based materials to leadframe applications.  Notable among the benefits of Ablestik C100 conductive films are the elimination of die tilt, the ability to process thinner die and the facilitation of greater bondline control. Providing a high level of manufacturing latitude, the workability of the new Henkel materials has been established on die sizes ranging from 0.2 mm x 0.2 mm up to 6 mm x 6 mm for multiple package types, including both QFNs and QFPs.  These benefits, along with Ablestik C100’s thermal and electrical performance and ability to enable scalable package design, offer a distinct competitive advantage for leadframe packaging specialists.

“Because of the importance of electrical and thermal conductivity, we’ve worked with Henkel to develop a die placement process using its conductive die attach films, as moving to tape-based adhesive materials will guarantee even better workability and in-process control than we currently offer,” says Laura Ceriati, STMicroelectronics Corporate Package Development Director for leaded package platforms.  “Our efforts with Henkel will further enable and extend package scalability for the medium-power applications that are a key part of ST’s product portfolio.”

For leadframe package designers and manufacturers, conductive die attach films provide much more design latitude and greater process control as compared to traditional die attach pastes.  Because film-based die attach materials eliminate the fillet inherent with paste-based mediums and offer a lower die to paddle clearance, Ablestik C100 extends much greater design freedom, allowing a single leadframe design to be used for multiple package types.  In addition, Henkel’s new conductive film formulations have excellent wetting ability and a lower bonding temperature, which enables stable adhesion on all leadframe surface finishes for even greater packaging flexibility.

“STMicroelectronics is one of the premiere packaging technology innovators in the world and we are delighted to work together on a new conductive film-based production process,” comments Shashi Gupta, Henkel Global Marketing Manager for the Wirebond Segment.  “Incorporating Henkel’s film into their manufacturing portfolio has allowed ST to realize a more scalable, design-friendly solution for various die and package sizes and configurations.”

At the 26th European Photovoltaic Solar Energy Conference in Hamburg, Henkel will be presenting powerful solutions spanning the entire value chain. To meet the market challenges, Henkel develops innovative adhesives and sealants, because extremely productive manufacturing processes and new concepts for saving materials and energy are vital to the future viability of the solar industry. Customers looking for more information regarding the innovations or who would like to talk to an adhesives or sealants expert will find Henkel in Hall B6, Stand B11.

Visitors to this year’s EU PVSEC can look forward to the presentation of new trends and developments in the photovoltaic industry. As the leading global manufacturer of adhesives and sealants, Henkel will also be there presenting an extensive product portfolio for the automated production of solar modules.

High-tech adhesives for the photovoltaic industry

With solutions from Terostat and Loctite Henkel provides the photovoltaic industry with powerful adhesives, sealants and cleaners for the production and installation of solar modules. For instance outstanding and reliable results are ensured by high-strength frame bondings that are ready for transport within a few minutes or durable and highly resistant backrail bondings.

Weather-resistant PV Backsheets with Liofol

Furthermore, specialists at Henkel will display different adhesive solutions for backsheets used in PV solar modules. With two-component PUR systems developed under the Liofol brand, the world number one in sealants and adhesives has now applied its entire expertise in laminating technology to solving the problems of the solar industry.

Conductive adhesives for the production of solar modules
At the EU PVSEC Henkel will also display conductive adhesives for modern thin-film and crystalline silicon (c-Si) module assembly. These advances address the low stress, faster cure speeds and lower temperature curing requirements.

For three years now, Henkel has been engaging in promoting young engineers. In addition to offering numerous training programs, participation in the annual Formula Student contest for engineering students at the Hockenheimring has become a central component of Henkel’s commitment in this area. The special award for best use of adhesive, which Henkel instituted in 2009, was won this year by the team from Bayreuth University.

The design competition attracts a great deal of interest internationally, with teams from colleges and universities from all over the world taking part. It ranks as a kind of unofficial Olympics for engineering students. Competing against all other entrants, the teams have to design and build the prototype of a new racing car from scratch, present it as a business case, and test its performance in various trials and a final race. 78 teams in the Combustion category and 31 more in the Electric category made it to the final round to be judged at the Hockenheimring at the beginning of August.

For the General Industry business of Henkel as one of the main sponsors, the five-day event is one of the highlights every year. Up to eight Henkel adhesives experts were available at any time to give the contestants advice or lend a helping hand – in the pits, working on the cars themselves, or at the Henkel stand. The latter was not only well-stocked with high-performance repair and maintenance products from Henkel’s Loctite and Teroson brands, but also featured workbenches and even a heating cabinet to accelerate curing of different adhesives.

Special award for best use of adhesive

In order to inspire these enthusiastic students to become even more creative, Henkel established a special award for the best use of adhesive throughout the whole contest. Submissions are judged on the attractiveness and creativity of the bonding application, the way the adhesive was selected and verified, the presentation made to the jury, and the students’ knowledge about bonding technologies.

From a large number of submissions, seven teams made it through to the final round. The award went to Bayreuth University, ahead of last year’s winner Zwickau University, with Coburg University taking third place.

“Last year, the entries were already of a very high standard,” says Rudolf Neumayer, Head of Application Technology, Industrial Adhesives, Europe. “But this year, they raised the bar several notches further. This trend shows that we are definitely moving in the right direction with our educational approach.”

Henkel’s level of engagement in the entire contest earned high praise, not only from the contestants themselves but also from the organizer. “Henkel was present with a large team and often performed last-minute rescue jobs,” said Ludwig Vollrath of VDI (the Association of German Engineers), who is in charge of the event. “People were highly impressed by that.”

Multiplier effect and greater awareness of the brands

Henkel therefore also profits from this commitment. “The five-day finale of the contest was itself attended by around 2,500 students, professors and design specialists,” says Patricia Silva, Marketing Manager, General Industry. “No other event throughout the year draws so many highly interested people with a will to experiment. Having such a representative target group all in one place means that we can achieve important multiplier effects and heightened awareness of our brands.”

“Bonding is simply the most dependable solution!”

This view is shared by many people, including Moritz Berard (23), a student from Karlsruhe University, who participated in the contest. “For me, bonding is one of the best solutions there are, and easily the simplest and most dependable one,” says Berard summing up. “It opens up whole new worlds and gives an immense amount of design freedom.”

Although more and more students beginning to realize this, Henkel’s engagement is actually a medium to long-term investment that not many companies take the trouble to make. But the benefits can already be estimated today, thinks Alfred Kaltenbach, Area Sales Manager for Baden-Württemberg of Henkel’s General Industry business.

“In Germany alone, about 2,200 young engineering graduates start their careers by going straight from university into private enterprise, where sooner or later they will occupy key positions,” he explains. “When engineers who have previously learned about our adhesives and sealants then design new components, they will already be familiar with all the advantages of adhesive bonding technologies and will include this joining technique in their design considerations right from the beginning. This way, adhesive bonding, which was unfortunately often regarded as a last resort in the past, will gain the status it deserves. And we intend to make sure that the young engineers’ experiences with Henkel have been entirely positive.”

The energy turnaround and the push to expand renewable energy generation is posing major challenges for manufacturers of wind energy plants. To ensure economic viability, efforts are focusing first on improving the availability and productivity of existing production facilities. One of the wind energy industry’s top priorities is to maximize utilization rates by speeding up manufacturing processes in order to reduce unit costs and achieve a rapid payback on investments. The use of new material technologies is making an important contribution to this.

In rotor blade production, one obvious way of accelerating the process would be to use polyurethane-based adhesives for rotor blade bonding, although these represent a very recent development in the wind power industry. Traditionally, blade shells and spars have been bonded using two-component epoxy resins. While these materials reliably meet the extremely high mechanical specifications, they are rapidly reaching their limits when it comes to the automation of manufacturing processes. New technologies are therefore needed to speed up and automate production.

Henkel is now presenting a solution in the shape of its newly developed polyurethane adhesive Macroplast UK 1340. The specialist in high-performance polyurethane adhesives has succeeded in developing a PUR adhesive that satisfies the specific mechanical requirements for use in the wind power industry and, on top of this, makes rotor blade production more efficient.

Higher capacity utilization through faster curing

One of the major benefits offered by Macroplast UK 1340 is its accelerated cure speed. Polyurethane-based adhesives react much faster than the epoxy resins used up to now. Since it is not only highly reactive but also produces less reaction heat, this two-component adhesive considerably reduces both the duration and the temperature of the cure phase. Extensive tests have shown that substantial reductions can be achieved in bonding and tempering times. The lower cure temperature also has a positive impact on energy consumption in addition to reducing the risk of stress cracking due to excessive thermal loading. And heat-sensitive foam inserts also remain unaffected.

What is more, Macroplast UK 1340 satisfies the high mechanical demands for this application, as confirmed in a variety of tests. The key criterion for achieving the technology shift is described by Nicole Schlingloff, product developer at Henkel who played a major role in developing this product: “One absolute essential for wind energy plants is that they have to be in technically perfect condition. Rotor blades are among the most highly stressed components one can imagine. Even the tiniest flaws can have disastrous consequences, and that can result in high costs for repairs, downtime, or even replacement of complete rotor blades. For all of those reasons, we had to make sure that Macroplast UK 1340 would entirely satisfy the market’s high demands.”

GL approved and IWES tested

Macroplast UK 1340 fulfills all the key parameters specified by Germanischer Lloyd (GL) and is the first PUR adhesive in the world to have obtained GL approval. GL’s requirements for the adhesive primarily relate to its tensile shear strength, resistance to aging, creep behavior and glass transition. Rotor blades manufactured using Macroplast UK 1340 have already proven their worth in a field trial of more than twelve months.

Further evidence of the functional capabilities and fatigue strength of the processed adhesive was recently furnished when it successfully passed load tests performed by the Fraunhofer Institute for Wind Energy and Energy System Technology IWES. In a long-term test lasting some four months, an ENERCON rotor blade bonded with Macroplast UK 1340 was subjected in Bremerhaven to stresses and strains that would normally occur over a period of 20 years. The bonded joints of the 40-meter long blade passed the static and dynamic tests specified in the IEC 61400-23 standard to determine the rated load and fatigue behaviour of the blade. The test criteria specified for approval of wind energy plants were met without any problems. And ENERCON’s own specifications were also satisfied in this blade test.

Elegant in Appearance - functional in Design

The Han-Yellock® - a special Han® connector

Han-Yellock® is a new product series which retains the core functionality but differs significantly from current size and shape formats.

The approach of this series makes many new functions possible, for example:
  •     An internal, latched locking mechanism on the hood
  •     Multiplies the potentials in the connector with Han-Yellock® modules
  •     Usage of Han-Modular® modules with adapter frames
  •     Insulators can snap into the front or back walls of the housing
  •     Protected Earth contact (PE) in crimp or Quick Lock termination
Thus, the Han-Yellock® offers improved functionality in the form of increased variability, multiplied potential, simplified handling, reduced incidence of errors and maximized safety.

SC contacts are now available for 1 mm POF

HARTING has expanded its portfolio of FOC contacts. SC contacts are now not only available for GI and HCS fibres, but also for 1 mm POF, while two variants feature "Quick-Assembly" technology. This assembly technology has been proven in for F-SMA and F-ST contacts in the course of many years and enables safe fixation of the fibre in the contact without any tools required - making it the ideal solution for field assemblies. In addition to the standard variant, HARTING is also providing a version with anti-kink guard.

The third variant is now available for crimp connections using standard crimp tools and meets even the most stringent requirements in terms of vibration resistance for transportation technology. All SC contacts can be utilized as single connectors and are also optimized for applications with Han® connectors. Users can integrate up to four contacts in connectors of the Han® 3 A size. The Han-Modular® product range is available for applications which require more contacts. It is even possible to conveniently integrate hybrid constellations consisting of a combination of FOC contacts and electrical contacts, for example, for power supplies.

The integration of the contacts in the Han® connector forms a robust, IP-protected solution meeting all the essential requirements of operations in industrial environments.

Han-INOX® - stainless steel connector series designed for operations in the harshest environments

Han-INOX® is HARTING's stainless steel connector series that is designed for operations in the harshest environments. The new angled hoods, bulkhead mount housings and surface mount housings of the new Han® 3 A size have gained many design options that complement those of the standard Han® 3 A hoods and housing series. Moreover, the product range has been extended with protective caps for bulkhead mount housings and hoods. This feature ensures degree of protection IP 65/67 for the service interfaces at all times, regardless of whether or not they are in use.

Han-INOX® meets all requirements for the implementation of high-quality connectivity solutions for applications presenting special demands. In addition to outdoor applications, this especially includes applications in process technology and in the food and beverages industries.

Han® 3 A - more than 25 contact inserts

Since many years HARTING's Han® 3 A product range with more than 25 contact inserts has established itself as the standard for interfaces for the transfer of electrical signals and data transmission, as well as for the power supply to small-scale units in industry. Two new housings are now extending the Han® 3 A application options.

Han® 3 A angled bulkhead-mount housing

A new angled bulkhead-mount housing that can be fastened with four screws is one of the available options. Especially with a look to machinery that is subject to high mechanical stress, this metal housing represents the ideal solution for a rugged design. It is predestined for applications in mechanical engineering where the connectors are also exposed to extreme forces generated by high velocities. The bulkhead-mount housing is also equipped with a special sealing system that ensures direct contact between the connector housing and the mounting surface for optimum EMC performance.

Han® 3 A Split Hood housing

The Han® 3 A Split Hood housing made of metal is HARTING’s second innovation here. This version can also be combined with all Han® 3 A contact inserts and is suitable for mounting from the front or rear side of control cabinet panels. The housing can also be sealed on termination side with a screwed gland so that the entire interface is protected for applications with IP 65 / 67 degree of protection.

Straight and angled cable entry – two-piece structure for highly convenient handling

HARTING's new hoods of the Han-Compact® product range have exceeded market requirements. The compact metal hood with different cable entry directions is suitable for all contact inserts of the Han-Compact® size.

The hoods are available with straight and angled cable entries. Variants with surfaces for standard and EMC applications are also available for this product range. The outer threads are moulded onto the hood. With that are also cost-efficient half-cable glands for diverse cable diameters and an IRIS spring for shield termination available for this hood.

Thanks to the two-piece design of the hood, users can slip the hood element including the cable gland onto the cable during assembly. This facilitates fast and with that cost-effective wiring of the contacts. The hood element is then closed again and fastened with the screws.

A separate ground conductor terminal on the hood enables the use of connectors with higher rated voltages and currents. The connectors Han® Q 4/2 with crimp and axial screw termination, the Han® Q 8/0 with crimp and Han-Quick Lock® termination, the Han® Q 17/0 with crimp termination and the Han® Q Data RJ 45 can all be used with the new metal hood.

Integrated 24 V power supply module is a further, decisive step in simplifying installation technology

HARTING'S Han-Power® S series represents a decisive step in simplifying installation technology. In addition to communication, the 400 V Power and 24 V cables are vital for industrial automation technology. With regard to the power range, consistency in the installation concept means that the 400 V, 230 V and 24 V lines are considered as integral elements.

Distributed field devices that require both 400 V power and a 24 V auxiliary voltage can be wired efficiently using Han-Power® S.

Han-Power® S - the assembly is very simple and comfortable

The installation calls for a power cable with 7 x 4.0 mm² or 5 x 4.0 mm² conductors, for example. The outer insulation of the cable is stripped to the defined length, the stranded wire conductors are inserted into the Han-Power® S and tapped via the insulation displacement terminal. The power cable is routed, as accustomed, via the Han® Q 4/2 connector. It is also possible to use this connector to wire the distributed frequency converter. The 230/24 V power supply module is installed in the Han-Power® S. The connection is made using M12 connectors at the Han-Power® S. Thanks to the distributed configuration a maximum current of 2 A is sufficient for almost any application.

The installation of a Han-Power® S with maintenance switch proceeds in a similar manner. The special feature here is the fact that the maintenance switch isolates the three poles of the power train from mains.

Ha-VIS 4000 and Ha-VIS EtherRail® form the basis for reliable Ethernet networks in and between wagons

The Ethernet switches of HARTING's product range Ha-VIS 4000 and the Ha-VIS EtherRail® data cables form the basis of reliable Ethernet networks in and between wagons. The implementation of redundant networks that are specially attuned to meet requirements in busses, street cars and trains can be optimized with a combination of supplementary, interactive products, such as Ethernet Switch with PoE, highly flexible data cables (compliant with LSZH) and HARTING connectors.

The 8-port PoE switch (Ha-VIS eCon 4080-BPoE1) can be used to efficiently install video networks enhancing passenger safety in the cabin or at bus/train stops. The highly flexible data cable with four-star construction can be used both as connecting cable at the carriage transition and for installations in the vehicles and conforms to current fire regulations to TS EN 45 545-5 for rail and bus vehicles.

Three new har-mik® Bellows SMC female right angled connectors complete the HARTING portfolio

HARTING’s Miniature D connectors in 1.27 mm pitch, the so-called har-mik® series, are a must in various cable-to-board applications where space saving and high data transfer rates are demanded. HARTING has expanded the har-mik® Bellows SMC portfolio of female right angled connectors with the addition of three new variants with 20, 50 and 68 poles respectively.

Fielding the complete har-mik® Bellows SMC connector range from 14 to 68 poles, HARTING is offering customers a perfect solution, as the connectors can be terminated in the same solder reflow process as all other board mounted SMT components. The connectors are available in suitable tray or reel packaging, which are fully compatible with the various handling equipments of an automated assembly line.

Drawing on the bellows mating technology, HARTING’s har-mik® Bellows SMC connectors are the perfect choice for applications requiring repetitive plugging and blind mating.

The new HARTING AdvancedMC plug connector replaces the card edge with gold pads for AdvancedMC and MCH modules

HARTING has pushed the envelope in the development of plug-in connectors for AdvancedTCA and MicroTCA. The new HARTING AdvancedMC plug connector replaces the card edge with gold pads for AdvancedMC and MCH modules. This has created again a two-piece plug-in connection with considerably improved contact reliability.

The new version of the plug-in connector is mounted onto the basic side of the AdvancedMC module, optional with the help of an automatic pick-and-place machine. Usually, the plug-in connector is soldered by way of the "pin-in-hole-reflow" process, but is now also suitable for wave soldering. As an alternative solution, HARTING offers a version for the assembly on the bottom component side (extended side).

The improved HARTING AdvancedMC plug supports data transmission rates up to 12.5 Gbps. Instead of the card edge, the connector now defines the interface and therefore allows the selection of PCBs with a thickness beyond the specified range. The design of the insertion tongue reduces the insertion force.

HARTING AdvancedMC plug reduces manufacturing process costs

The HARTING AdvancedMC plug connector also helps to reduce the manufacturing costs of AdvancedMC modules. As the PCB does not have to be equipped with gold pads, for example, users are able to save quality control costs and only require a simple hole array.

HARTING is offering a special plug-in connector for MCH modules to MTCA.0 that can be used to transmit signals from one PCB via two vertically stacked insertion tongues.

The Ha-VIS RFID system from HARTING is a complete software and hardware platform for the realization of RFID solutions.

In addition to integrated Ha-VIS RFID middleware for the convenient connection of peripheral devices (readers, label printers etc.), the Ha-VIS RFID system can now also communicate directly with an PLC via fieldbuses like ProfiNet, ModBus, Ethernet/IP, etc. This makes the Ha-VIS RFID system even more attractive for industrial applications as it enables the exchange of RFID data with ERP systems as well as with PLCs.

The Ha-VIS RFID system now allows all functions at field level to be controlled directly and process data to be recorded in ERP.

HARTING’s Ha-VIS RFID system is an open platform for system integrators enabling quick and easy implementation of RFID solutions.

1. Mormon women have reported “horror stories” about Romney from when he served as a Mormon bishop.

2. He reportedly pushed Bain employees to lie to get information.

3. He paid for his son and daughter-in-law’s surrogacy agreement, which included an abortion clause.

4. He’s annoying his neighbors by quadrupling the size of his beach house.

5. He publicly berated a man for drinking and smoking weed.

Monday, October 15, 2012

NXP Semiconductors N.V. (NASDAQ: NXPI) today announced that its SmartMX2™ secure microcontroller has been awarded the world’s first Common Criteria EAL6+ certification for a secure microcontroller with a contactless interface based on 90-nm technology. Issued by the German Federal Office for Information Security (BSI), the EAL6+ security evaluation adds rigorous mathematical testing of the entire security architecture to resistance against various invasive, semi-invasive and non-invasive attacks, thus also formally proving the security concept. The formal mathematical methods implemented leading to the new SmartMX2 security architecture and the corresponding CC EAL6+ certificate provide a significantly higher trust level to customers.

NXP’s advanced security expertise has made it the global leader in Identification and security technology. The SmartMX™ family of secure microcontrollers leverages the groundbreaking IntegralSecurity™ architecture that combines more than 100 different security features including NXP’s SecureFetch™ protection against laser attacks. It provides security for a wide range of applications such as eGovernment, banking, mobile transactions, public transport, access management and device authentication. NXP has shipped more than one billion SmartMX chips to its customers including 86 out of 102 countries with ePassport projects.

“ID applications, devices and infrastructures to authenticate identities and secure transactions are becoming more prevalent and smarter, which is why the demand for hardware-based security is increasing. Financial institutions and governments in particular require tamper-resistant high-security microcontrollers that provide the best possible security and contactless performance. The CC EAL6+ certificate shows our customers that they can rely on NXP to continuously invest and improve in security, providing customers with trusted solutions for their smart life applications,” said Steve Owen, senior vice president of global sales, Identification business, NXP Semiconductors.

NXP Semiconductors N.V. (NASDAQ: NXPI) today announced its state-of-the-art DC6M DC/DC switching regulator family featuring a very high 6-MHz frequency, an ultra-low output voltage ripple performance of 7 mV, and high efficiency up to 95 percent. The DC6M family supports up to 650 mA supply current in a very small wafer-level chip-scale package (WLCSP6), measuring only 1.36 x 0.96 x 0.47 mm. With an input voltage range from 2.3 to 5.5 V, the new DC/DC converters are ideally suited for battery-driven portable devices such as smartphones, as well as other consumer devices where reliable, efficient power management is essential and space is limited.

With a typical output voltage ripple of only 7 mV, the DC6M family (including the DC6M4, DC6M5 and DC6M6) minimizes disturbances to the output voltage signal caused by the switching mechanism, thus enabling a stable signal, enhancing energy efficiency, and overcoming a common limitation of most other DC/DC converters today. In addition, the high switching frequency of 6 MHz allows the usage of SMD inductors as small as 470 nH in a flat 0805 package size (available with heights as small as 0.8 mm), further reducing the space required in the design. To illustrate, a typical smartphone application area occupied by a step-down converter and its surrounding components can be reduced by 40 percent when using a 6-MHz DC/DC converter, instead of a 3-MHz alternative. Further, the DC6M buck converter supports the ability to disable the device, which reduces the quiescent current down to 0.2 µA.

“DC/DC switching regulators offer built-in efficiency advantages over other voltage regulators. Providing best-in-class performance in a very flat package, our DC6M step-down regulators open exciting new possibilities for engineers in designing sub-systems with higher efficiency, cleaner signals and much smaller footprint – whether they use the DC6M as a standalone or in combination with LDOs,” said Frank Hildebrandt, international product marketing manager, standard linear product line, NXP Semiconductors.

The DC6M DC/DC switching regulators are the latest additions to NXP’s high-quality DC power management products, including DC/DC converters, low-dropout (LDO) voltage regulators, and voltage references.

NVE Corporation today was granted patent number 7,813,165, titled “Magnetic Memory Layers Thermal Pulse Transitions,” relating to Magnetothermal Magnetoresistive Random Access Memory (MRAM).

MRAM is an integrated-circuit memory which is fabricated with nanotechnology and which uses electron spin to store data. Magnetothermal MRAM is an MRAM design that uses a combination of magnetic fields and ultra-fast heating from electrical current pulses to reduce the energy required to write data.

NVE has more than 50 U.S. patents, and more than 100 patents worldwide issued, pending, or licensed from others. Links to the new patent and NVE’s other U.S. patents can be found on the Patents page of the company’s Website.

NVE is a leader in the practical commercialization of spintronics, a nanotechnology that relies on electron spin rather than electron charge to acquire, store and transmit information. The company manufactures high-performance spintronic products including sensors and couplers that are used to acquire and transmit data. NVE has also licensed its spintronic magnetoresistive random access memory technology, commonly known as MRAM.