Telsonic Showcases Ultrasonic Packaging At Event

Telsonic is to showcase its ultrasonic packaging technology at the Total Processing and Packaging show, to be held at the NEC in Birmingham, UK, on 25-27 May 2010. This year's event will feature a number of modules and concepts targeted at sealing applications on flexible and rigid packaging. A key feature on the company's stand is a demonstration of longitudinal Fin Sealing on packaging using Telsonic's torsional ultrasonic head principals.

The equipment on show is equally suited to integration within VFFS or HFFS systems. Other concepts on display will include: VFFS and HFFS cross-sealing modules using multi-converter systems; torsional welding of 'peelable' foil lids to plastic or coated aluminium pots; rotary paddle cross-sealing modules for VFFS and HFFS machines; multi-converter cross sealing for linear or rotary (impeller) applications for stand up pouches; and Cut-n-Seal technology. Company representatives will be on hand to discuss customer applications and offer advice on the use and integration of Telsonic's ultrasonic technology for all types of packaging, sealing and machine integration projects.

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