Commencing the Mass-Production of Combined Bluetooth®/Wi-Fi Modules Made Smaller with our In-house Internal Mounting Technology
This product will be placed on exhibit during CEATEC JAPAN 2012 held at Makuhari Messe, Chiba Prefecture, between October 2 and 6, 2012.
The rapidly-expanding smart phone market requires an increasing number of electrical components to be mounted into phones due to high-functionalization, and at the same time there is a growing demand for high-density components that require less space so that high-capacity batteries can be installed. In order to meet these market requirements, Murata Manufacturing has combined our in-house internal mounting technology and ceramic multi-layer technology (LTCC*2 boards) to establish circuit board technology that enables high-density mounting, and since March of this year we have been mass-producing between 5 million and 7million BT/Wi-Fi modules per month.
And, now we have also commenced the mass-production of BT/Wi-Fi modules supporting Snapdragon™ S4 MSM8960 3G/LTE multi-mode processers manufactured by Qualcomm Incorporated.