Commencing the Mass-Production of Combined Bluetooth®/Wi-Fi Modules Made Smaller with our In-house Internal Mounting Technology

Murata Manufacturing Co., Ltd. has commenced the mass-production of combined Bluetooth® (hereinafter known as BT) /Wi-Fi modules supporting Snapdragon™ S4 MSM8960 3G/LTE multi-mode processers*1 manufactured by Qualcomm Incorporated using internal mounting technology. The use of our in-house internal mounting technology has enabled us to reduce the mounting space of this module by between 25% and 50% over regular discrete modules.

This product will be placed on exhibit during CEATEC JAPAN 2012 held at Makuhari Messe, Chiba Prefecture, between October 2 and 6, 2012.

The rapidly-expanding smart phone market requires an increasing number of electrical components to be mounted into phones due to high-functionalization, and at the same time there is a growing demand for high-density components that require less space so that high-capacity batteries can be installed. In order to meet these market requirements, Murata Manufacturing has combined our in-house internal mounting technology and ceramic multi-layer technology (LTCC*2 boards) to establish circuit board technology that enables high-density mounting, and since March of this year we have been mass-producing between 5 million and 7million BT/Wi-Fi modules per month.

And, now we have also commenced the mass-production of BT/Wi-Fi modules supporting Snapdragon™ S4 MSM8960 3G/LTE multi-mode processers manufactured by Qualcomm Incorporated.

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