The development of the WLP (Wafer Level Package) type SAW device which is 0.35mm in height with the use of the proprietary hollow sealing technology

NIHON DEMPA KOGYO CO., LTD., represented by Hiroshi Takeuchi, has developed miniaturized and low-profile WLP (Wafer Level Package) type SAW device (filter/duplexer) for module use.

In recent years, there has been a trend to modularize the wireless communication functions of mobile information terminals such as cellular phones and smart phones. This is because many telecommunication carriers have decided to adopt LTE (Long Term Evolution), the successor of GSM-UMTS, for the Next Generation Network. As a result, the shift towards multimode and multiband GSM/UTMS/CDMA/LTE has been accelerated, and thus the wireless communication functions have become more complicated. This is the reason why modularization has become essential.

Unlike the conventional SAW filters, a ceramic package is not used in this product. We have developed the WLP structure in which the piezoelectric substrate of the SAW device chip is used as the package. We have reduced the size of 1.4 x 1.1mm type SAW filter to 0.8 x 0.6mm without changing the filter characteristics and also reduced its height to 0.35mm which is essential for modularization. Our proprietary technology offers an excellent pressure resistance which can withstand the pressure of mold resin injection applied at the time of producing modules such as SiP (System in Package) and boards with built-in components.

We plan to start mass production in 2011. We will announce the product specifications as soon as they are finalized. We are confident that this product will satisfy your needs.


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