Skip to main content

Henkel’s Conductive Die Attach Films Enable Leadframe Package Scalability

Henkel announces that it has worked with STMicroelectronics, one of the world’s largest semiconductor companies and advanced chip packaging technology developers, to validate the performance of Henkel’s Ablestik C100 conductive die attach film materials for production of very small package configurations in a process called ScalPack, which incorporates die with extremely small dimensions

Commercialized in early 2011 following process testing at ST, Henkel’s Ablestik C100 materials – available in 15 micron and 30 micron thicknesses – are now extending the proven advantages of film-based materials to leadframe applications.  Notable among the benefits of Ablestik C100 conductive films are the elimination of die tilt, the ability to process thinner die and the facilitation of greater bondline control. Providing a high level of manufacturing latitude, the workability of the new Henkel materials has been established on die sizes ranging from 0.2 mm x 0.2 mm up to 6 mm x 6 mm for multiple package types, including both QFNs and QFPs.  These benefits, along with Ablestik C100’s thermal and electrical performance and ability to enable scalable package design, offer a distinct competitive advantage for leadframe packaging specialists.

“Because of the importance of electrical and thermal conductivity, we’ve worked with Henkel to develop a die placement process using its conductive die attach films, as moving to tape-based adhesive materials will guarantee even better workability and in-process control than we currently offer,” says Laura Ceriati, STMicroelectronics Corporate Package Development Director for leaded package platforms.  “Our efforts with Henkel will further enable and extend package scalability for the medium-power applications that are a key part of ST’s product portfolio.”

For leadframe package designers and manufacturers, conductive die attach films provide much more design latitude and greater process control as compared to traditional die attach pastes.  Because film-based die attach materials eliminate the fillet inherent with paste-based mediums and offer a lower die to paddle clearance, Ablestik C100 extends much greater design freedom, allowing a single leadframe design to be used for multiple package types.  In addition, Henkel’s new conductive film formulations have excellent wetting ability and a lower bonding temperature, which enables stable adhesion on all leadframe surface finishes for even greater packaging flexibility.

“STMicroelectronics is one of the premiere packaging technology innovators in the world and we are delighted to work together on a new conductive film-based production process,” comments Shashi Gupta, Henkel Global Marketing Manager for the Wirebond Segment.  “Incorporating Henkel’s film into their manufacturing portfolio has allowed ST to realize a more scalable, design-friendly solution for various die and package sizes and configurations.”

Comments

Popular posts from this blog

TURCK M8 CORDSETS WITH 100 PERCENT SHIELDING OPTION PROTECT AGAINST EMI/RFI

TURCK is now offering the option to completely shield M8 picofast ® cordsets by connecting a braided shield directly to the coupling nut. This provides a cost-effective and reliable connection with 100 percent cable and connector shielding, which protects against electromagnetic and radio frequency interference.

The 3 and 4-pin cordsets are available with flexlife ® PVC or PUR jacketed cable. All connectors deliver IEC IP 67 protection.

The M8 picofast line, like most TURCK cordsets, provides male or female, straight and right angle connectors, standard and custom lengths, and pigtails or extensions. Fully encapsulated mating receptacles are also offered, completing the system.

Banner Engineering DF-G3 Discrete Fiber Amplifier Features World-Class Long Range Sensing Capability

Banner Engineering introduces its DF-G3 discrete long-range fiber amplifier with dual digital displays for use with plastic and glass fiber optic assemblies. Featuring increased sensing power, the DF-G3 can sense more than 3 meters (10 ft.) with opposed mode fibers or more than 1 meter (3 ft.) with diffuse mode fibers. The extra power provides increased detection reliability for dark targets at long range and enhanced detection sensitivity when using specialty fiber assemblies for large area and small part detection applications.

The DF-G3 is available with a single discrete output or two dual discrete outputs. The dual discrete outputs can be independently taught to trigger at different intensity values, which is ideal for correct part-in-place or error-proofing, bottle down, and edge guiding applications.

“We developed the DF-G3 fiber amplifier to meet our customers’ need to precisely detect smaller targets at longer ranges” said Dennis Smith, Senior Marketing Manager, Banner Engin…

IDEC Releases New Line of High Efficiency Power Supplies

IDEC Corporation announces the PS5R-V line of DIN-rail power supplies, offering their customers high-efficiency in a compact form factor at competitive prices. These power supplies suit a wide range of needs in the industrial marketplace, and carry all of the required certifications necessary for use in these demanding applications. This next generation of the industry standard PS5R power supply family has updated features and specifications to meet current and future needs.

The PS5R-V line of power supplies includes 10W, 15W, 30W, 60W and 120W versions, with additional versions coming soon. These power supplies have a very compact form factor with overall dimensions reduced by up to 25% from previous generations. The reduced form factors combine with DIN-rail mounting to free up valuable control panel space and reduce installation costs.

Operating temperature ranges up to -25 to +75 degrees C offer more versatility. These extended operating temperature ranges often allow these power…