Solder Barrier Pin Receptacles & Sockets with OFP® Knockout Bottom
14 sizes/styles are now available, 13 have standard tape & reel packaging. The advantage of tape & reel packaging for these receptacles is it permits through-hole components to be placed simultaneously with surface mount parts on pick-’n-place assembly lines – eliminating the need to hand place the receptacles in an additional manufacturing step. The OFP® barrier permits the sockets to be vacuum picked from the tape prior to placement in a hole in the circuit board.
The knock-out-bottom feature enables these sockets to be made relatively short compared to many similar receptacles. The reduced length provides two advantages: the receptacles can stand upright and stable in a carrier tape pocket and the protrusion through the PCB is minimal — especially important when working with SMT boards. The open bottom receptacle design eliminates the need to trim long device leads that would otherwise bottom out in a closed receptacle design and also makes them ideal for low profile board stacking applications via the ability to pass through.
The OFP® parts are available as discrete receptacles and can be supplied in bulk or on carrier tape,. per EIA-481 for industry standard pick and place machines.
All Mill-Max receptacles use a precision-machined brass housing with a press-fit beryllium copper “multi-finger” contact.
These are also available in strip sockets. 834 (Single Row) and 835 (Double Row) Series Pass-Through Sockets have a low .130” (3.30 mm) profile and will accept Ø.030” (.76 mm) round pin, as well as industry standard .025” (.64 mm) square pin headers.
All Mill-Max receptacles use a precision machined brass housing with a press-fit beryllium copper “multi-finger” contact (heat-treated BeCu is the best electrical spring contact material.)