Liqui-Form 2000

Features and Benefits

    Thermal Conductivity: 2.0 W/m-K
    Applies very low force on components during assembly
    Low volumetric expansion
    Excellent chemical and mechanical stability even at higher temperatures
    No curing required
    Stable viscosity in storage and in the application

Liqui-Form™ 2000 is a high thermal conductivity liquid formable material designed for demanding applications requiring a balance between dispensability, low component stresses during assembly and ease of rework.

Liqui-Form™ 2000 is a highly conformable shear-thinning material which requires no curing, mixing or refrigeration. Its unique formulation assures excellent thermal performance, low applied stress and reliable long-term performance. Liqui-Form™ 2000 is thixotropic and has a natural tack ensuring it forms around the component and stays in place in the application.

Typical Applications Include:

    Bare die to heat spreader lid
    Filling various gaps between heat-generating devices to heat sinks and housings
    Devices requiring low assembly pressure
    BGA, PGA, PPGA

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