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Vishay Intertechnology to Showcase Industry-Leading Wire-Bondable, Ceramic Thin Film, and MLCC Products at IMS 2012

Vishay Intertechnology, Inc. (NYSE: VSH) today announced that it will be showcasing the company’s latest industry-leading wire-bondable and ceramic thin film products, and multilayer ceramic chip capacitors (MLCCs), at the 2012 IEEE MTT-S International Microwave Symposium (IMS), being held from June 19-21 at the Montreal Convention Center in Montreal, Canada.

At booth 2002, Vishay Electro-Films will be providing demonstrations of its wire-bondable thin film resistors, capacitors, and inductors for RF module, hybrid, and chip-on-board applications. In addition, the company’s thin film RF filters and ceramic thin film interconnect substrates will be on display for distributed element filters, embedded lumped element filters, surface acoustic wave filters, delay lines, resonators, couplers, circulators, and other RF components.

Also on display will be Vishay’s surface-mount, high-frequency RF and microwave MLCCs with high Q = 2000 in 0402, 0603, and 0805 case sizes. The devices are ideal for high-frequency commercial applications, including filter and matching networks, and amplifier and DC blocking circuits in power amplifier modules, VoIP networks, cellular base stations, GPS systems, and satellite, WiFi (802.11) and WiMAX (802.16) wireless communication.

Part of International Microwave Week, IMS is the world’s premier microwave conference. It features a large trade show, technical sessions, workshops, and panel sessions covering a wide range of topics, including wireless communication, radar, RF technologies, microwave electronics and applications, and more.

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