Rogers Corporation Will Offer Power Distribution and Thermal Management Solutions at APEC 2011

Rogers Corporation (NYSE:ROG) will be in full force at the upcoming Applied Power Electronics Conference (APEC) and expo in the Fort Worth Convention Center, Fort Worth, TX, March 7-9, 2011. APEC 2011 ( is a leading international conference and exhibition devoted to applied power electronics. Representatives from Rogers Power Distribution Systems (PDS) and Thermal Management Solutions (TMS) Divisions will be at Booth #234 to discuss the company’s advanced technology solutions for both power distribution and thermal management in high-power applications.

Rogers Power Distribution Systems division will announce the establishment of a new busbar design and manufacturing facility in Chandler, Arizona, USA. With this new capability in place, Rogers becomes the first laminated busbar manufacturer with a global footprint having dedicated manufacturing and engineering capabilities in the Americas, Europe and Asia Pacific regions.

Rogers Power Distribution Systems will exhibit the RO-LINX® family of custom-designed laminated busbars for power distribution applications. These high-current-density busbars provide high-power switching capabilities with minimal loss. RO-LINX Busbars, designed to control partial discharge, have a compact design and possess low inductance characteristics.

Rogers’ busbars are custom designed solutions for each application and feature long-term reliability, outstanding performance and safety characteristics. These attributes make Rogers RO-LINX busbars ideal for use in a broad range of segments like Traction and Propulsion, Renewable Energy (wind/solar) Inverters, Industrial Drives (VFDs) and Controllers, Hybrid and Electric Vehicle (HEV), and Military applications.

Rogers Thermal Management Solutions division will be making a presentation at the conference’s technical sessions. Birol Sonuparlak, TMS Technical Manager, will be presenting a paper on “Power Modules for Hybrid Electric & Electric Vehicles,” on Tuesday, March 8 at 10:00 am in room 204B.

Representatives from the Thermal Management Solutions Division will be exhibiting their HEATWAVE™ thermal-management materials, which are ideal for minimizing heat in high-power semiconductor packages and IGBT base plate applications. HEATWAVE materials are aluminum-silicon-carbide (AlSiC) metal matrix composites (MMCs) engineered for excellent thermal conductivity and tightly controlled thermal expansion, which can reduce stress in semiconductors during thermal cycling.

Supplied in a wide range of materials, HEATWAVE composites exhibit high thermal conductivities from 170 to 230 W/m-K and coefficients of thermal expansion (CTE) from 5 to 14 ppm/K. Available as standard or custom shapes, HEATWAVE AlSiC composites feature considerably lower density than other thermal management materials, including Kovar® alloy, copper and stainless steel.

Also in attendance at the Rogers booth will be representatives from Curamik Electronics GmbH, a newly acquired division of Rogers Corporation. In business since 1983, Curamik Electronics GmbH is a worldwide leader in the development and production of direct bond copper (DBC) ceramic substrate products used in the design of intelligent power management devices such as IGBT modules. These devices are used in a wide range of products, including highly efficient industrial motor drives, wind and solar energy converters and HEV drive systems.


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