Major Upgrade to COMSOL’s Acoustics Module Enables Realistic Acoustic Simulations of Mobile Devices and Automotive Components

COMSOL, Inc., today announces the release of a major upgrade of its add-on Acoustics Module for its flagship product COMSOL Multiphysics. This latest version of the Acoustics Module offers new capabilities and expanded multiphysics user interfaces for simulating thermoacoustic effects, poroelastic waves, acoustic-shell interactions, and piezo-acoustic devices. The new version of the Acoustics Module is available immediately.

“This release of the Acoustics Module brings a new level of predictive power to acoustic simulations,” says Dr. Mads J. Herring Jensen, technical product manager for acoustics at COMSOL. “For the first time, manufacturers of acoustic devices for smart phones, hearing aids, and earpieces can perform thermoacoustic simulations with an industry-standard commercial multiphysics software package. The ability to combine such simulations with electrical circuits and structural vibrations raises the bar for state-of-the-art acoustics simulations of mobile devices.”

Additional application areas for the Acoustics Module, adds Herring Jensen, include speakers, microphones, and sonar devices as well as noise control in areas such as muffler design, sound barriers, and building acoustics. The module's physics interfaces provide easy-to-use tools to model acoustic pressure wave propagation in air, water, and other fluids. The Acoustics Module also enables users to model vibrations and elastic waves in solids and piezoelectric materials, as well as their bidirectional interaction with a surrounding fluid, easily.


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