- Complies with EN50121-4 environmental requirement for railway applications
- Complies with NEMA TS1 & TS2 environmental requirements for traffic control equipment
- Complies with IEC61000-6-2 EMC generic standard immunity for industrial environment
- Proprietary " α-ring" support for network redundancy; recovery time <15ms
- IEEE802.1w RSTP, IEEE802.1S MSTP and IEEE802.1D STP compatible
- IP multicast filtering through IGMP Snooping V1, V2 & V3
- Supports port-based VLAN and IEEE802.1Q VLAN tagging and GVRP
- IEEE802.1p QoS with four priority queues
- MAC-based trunking with automatic link fail-over RS-232 console, Telnet, SSL/SSH, SNMP V1, V2c & RMON, Web browser, and TFTP management
- Supports command line interface in RS-232 console
- Supports IEEE802.1x security
- Bandwidth rate control
- Per-port programmable MAC address locking
- Up to 24 static secure MAC addresses per port
- Port mirroring
- 1000Mbps-full-duplex, 10/100Mbps-full/half-duplex, auto-negotiation, auto-MDI/MDIX
- Full wire-speed forwarding rate
- Redundant power inputs with terminal block and DC jack
- -40°C to +75°C (-40°F to +167°F) operating temperature range
- Hardened aluminum case
- Supports NTP
congatec Future-Proofs ETX and XTX Standard
congatec AG, a leading manufacturer of embedded computer modules, is giving the ETX and XTX form factors a viable future with the integration of AMD Fusion technology. Modules based on AMD Fusion processors deliver significant improvements with regard to performance and scalability. Intel’s discontinuation of the 855 chipset family left a major gap in the market particularly for ETX computer modules, which primarily affected the higher performance range of applications. This gap has now been closed by processor manufacturer AMD with the Fusion architecture. Fusion also opens up new perspectives for a wide range of innovative and graphics-oriented applications.congatec has integrated the AMD Fusion architecture into its product range of ETX and XTX COM modules, opening up new scalability options for this form factor to meet even the most demanding tasks. The company supports the Fusion architecture with two new COM modules: conga-EAF and conga-XAF. While conga-EAF is an ETX module, co...
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