New JRC has Established a Mass Production Technology of a Thick Copper Wire Bonding to Aluminum Electrodes
We have been putting our energies into research and development focusing a high reliability and an environmental load reduction. They are suitable for various applications requiring high voltage and high current such as industry equipments, electric vehicles, hybrid cars and smart grid power transmission/distribution.
New JRC has been researching and developing the thick copper wire bonding technology to apply it to our semiconductor products. Generally, the direct bonding to aluminum electrodes on chip with the thick copper wire has been difficult to use in mass production. In combination with bonding machine and material manufacturers*2, we have achieved the thick copper wire (over 200μm wire diameter) bonding to aluminum electrodes on chip as the established mass production technology using wedge bonding technology*3.