Prior to Henkel’s introduction of electrically conductive die attach films, the benefits of film technology were only available for laminate-based packages. But the company’s development of Loctite Ablestik C100 in 2010 opened the door for leadframe device manufacturers to also enjoy the well-known advantages of die attach film which include consistent, uniform bondlines, elimination of die tilt and the ability to incorporate ultra-thin wafers. In addition, because films eliminate the fillet associated with paste-based materials, they allow more die per package due to tighter die to pad clearance. Now, leadframe semiconductor specialists have the option to use Henkel’s roll format Loctite Ablestik C100 or its new pre-cut, two-in-one (dicing tape and die attach film combination) Loctite Ablestik CDF 200P conductive die attach films, thereby enabling package design scalability not possible with conventional die attach materials.
Compatible with lamination equipment commonly used in the field, Loctite Ablestik CDF 200P requires no capital equipment investment. With a lamination temperature of 65 degrees Celsius, the novel material complies with most existing equipment and processes for both lamination and backgrinding. Additionally, its unique two-in-one dicing tape and die attach film combination streamlines manufacturing by facilitating an in-line process for thin wafers and a single lamination process in one, combined step.
“Not only does this breakthrough conductive die attach film offer exceptional ease-of-use,” explains Henkel’s Shashi Gupta, Global Marketing Director for Conductive Film, “the higher density chip designs it enables also help manufacturers lower costs. With no fillet to contend with, significantly less gold wire, substrate and mold compound per package unit need to be used. These factors, combined with the streamlined processing it affords, make Loctite Ablestik CDF 200P’s total cost of ownership measurably lower than that of traditional die attach materials.”
Proven effective on a wide range of die sizes (from 0.2 mm x 0.2 mm to 5.0 mm x 5.0 mm), a variety of wafer metallizations including bare silicon, TiNiAg and Au, and multiple leadframe metallizations such as Cu, Ag and Au, Loctite Ablestik CDF 200P offers superior process adaptability. The material also delivers high reliability, having been MSL-1-qualified with several package designs that include SO (SOT and SOD), QFN (DFN) and even smaller-die QFP devices. With excellent electrical conductivity and very low RDS on shift of <10 percent, Loctite Ablestik CDF 200P provides outstanding performance in a remarkable film-based formulation.