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High-performance hotmelts for electronic components

Innovative polyamide-based hotmelts will be a main focus of Henkel in Munich from November 15 to 18, 2011, at productronica, the leading global trade fair for electronics production. The Macromelt brand products are injection molded at a pressure of about 40 bar and temperatures of less than 230 degrees Celsius, thus preventing damage to sensitive electronic components and allowing the use of cost-effective mold sets made of aluminum rather than steel. The molding compound cures within just one minute and the components are then ready for further processing.

The one-component hotmelts of the Macromelt 6 series cover a wider temperature window than their predecessors. They are mainly used to encapsulate plugs and grommets for sealing and strain relief on cables. These Henkel products are ideal for use in applications where the encapsulation also functions as a housing – for example to protect printed circuit boards against moisture, mechanical stress or aggressive media such as acid or oil. The hotmelts can also be used to encapsulate larger-sized components, without any risk of stress cracking. Macromelt products adhere very well to polar plastics such as PA, PBT and PVC and also offer convincing ecological benefits. They are based on renewable raw materials and are thus completely biodegradable. Furthermore, they emit no solvent vapors or any other pollutants during processing.

Macromelt OM 676: reliable protection under fluctuating temperature conditions
Because of its plastic-like properties, Macromelt OM 676 can be used as a substitute for plastic housings. The adhesive protects the electronics against environmental influences and also remains flexible at low temperatures. It easily withstands extreme thermal cycling from minus 50 to plus 140 degrees Celsius. Macromelt OM 676 is especially well suited for electrical and electronic components such as plugs, printed circuit boards and sensors.

Improved resistance to hydrolysis with Macromelt OM 653
Macromelt OM 653 is the first polyamide hotmelt which has a high resistance to moisture and therefore satisfies the 85/85 test. Even after 1,000 hours at a temperature of 85 degrees Celsius and a relative humidity of 85 percent, its mechanical properties remain unchanged. Unlike other polyamide hotmelts there is no loss of mechanical performance. The adhesive is suitable for electronic parts which are exposed to temperatures ranging from minus 40 to plus 100 degrees Celsius – examples include printed circuit boards, sensors, electronic devices or control system components.

Macromelt 6208S proves its worth at high temperatures
With Macromelt OM 6208S, Henkel is introducing the first polyamide hotmelt to the market that is listed on the Relative Temperature Index (RTI). Tests have confirmed its enhanced performance in terms of thermal aging resistance. At a constant temperature of 95 degrees Celsius, Macromelt OM 6208S showed reliable results for tensile strength and elongation at tear – even after 100,000 hours of testing.

At live demonstrations, visitors to Henkel’s stand No. 106 in hall B3 will have the opportunity to experience the benefits offered by molding of electronic components.
Casting and molding of LED lamps and assembly of electronic parts such as motors and magnets are further topics being showcased at this stand at productronica 2011.


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