Texas Instruments simplifies cloud connectivity to the Internet of Things (IoT) with Amazon Web Services IoT
TI's SimpleLink Wi-Fi CC3200 wireless MCU LaunchPad is an evaluation kit for the industry's first single-chip, low-power Wi-Fi solution with a built-in programmable MCU. The CC3200 LaunchPad includes a temperature sensor and an accelerometer, but through add-on BoosterPack™ plug-in boards, it enables easy integration of additional sensors to help developers prototype their IoT applications. Developers can now leverage the SDK to store and analyze sensor data, trigger actions and interact with their cloud-connected designs and products from mobile and web applications.
"We are pleased our customers can now leverage AWS IoT to build cloud-connected products for the Internet of Things on a global scale," said Avner Goren, General Manager of Strategic Marketing, Embedded Processing at TI. "AWS IoT helps TI expand on its commitment to easily add embedded Wi-Fi and Internet connectivity to a wide-range of home, industrial and consumer electronics."
Semiconductor innovations are at the foundation of the IoT connecting people, things and cloud. TI innovations are enabling the IoT by expanding from wired connections to wireless connectivity, driving down power to enable battery-operated connected products. Additionally, TI is making development easier by providing certified modules and pre-integrated cloud connectivity software stacks.
TI has the broadest portfolio of building blocks for IoT nodes and gateways spanning wired and wireless connectivity, microcontrollers, processors, sensing technology, power management and analog solutions – along with an ecosystem of cloud service providers to help our customers get connected to the cloud faster. TI is adding AWS to its IoT Cloud ecosystem – a select group of organizations that support a wide variety of TI devices to enable a quick and easily connection to the cloud.