NXP Semiconductors offers its BC5/6xPAS family in a DFN2020 package for external linear voltage regulation
These DFN2020 medium-power transistors from NXP are released as a space saving replacement for the standard BCX5/6 and BCP5/6 series in SOT223 and SOT89. With an occupied PCB mounting area of 2.3 mm x 2.1 mm, they are much smaller while improving the power dissipation capabilities on multi-layer PCBs.
The AEC-Q101 qualified DFN2020 package is designed to use the full potential of small silicon dies. It improves the thermal performance by using a maximized collector mounting pad and a low thermal resistance design for an optimized heat transfer and packing density designs asking for high packing density.
Features and Benefits
The AEC-Q101 qualified DFN2020 package is designed to use the full potential of small silicon dies. It improves the thermal performance by using a maximized collector mounting pad and a low thermal resistance design for an optimized heat transfer and packing density designs asking for high packing density.
Features and Benefits
- VCEO of 20 V to 80 V, IC of 1-2 A; AECQ-101 qualified
- Small leadless plastic package using just 2.3 mm x 2.1 mm board space
- DFN2020D version with 100% solderable sidepads, suitable for automatic optical inspection (AOI)
- Thin lead frame to reduce Rth(j-sp)
- Big collector mounting pad directly under the transistor die to remove the heat from the BJT to the PCB
- Space saving alternative to BCP5x and BCX5x for ballast transistors and load switches on a multitude of processors or system basis chips based designs
- Linear voltage regulators
- Load switches
- Battery-driven devices
- Power management
- MOSFET drivers
- Amplifiers
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