High-Performance Liquid Dispensed Thermal Interface Material Bergquist Gap Filler 1000SR
Unlike precured gap filling materials, the liquid approach offers infinite thickness options and eliminates the need for specific pad thicknesses or die-cut shapes for individual applications. Gap Filler 1000SR is specifically designed with shear thinning characteristics to support optimized dispensing. Applying precise amounts of material directly to the target surface results in effective use of material with minimal waste. Available in cartridge and kit form, this material is well suited for manual or automated dispensing.
The Bergquist Company designs and manufactures high performance thermal management materials used to dissipate heat and keep electronic components cool. Headquartered in Chanhassen, MN, Bergquist supplies the world with some of the best-known brands in the business: Sil-Pad® thermally conductive interface materials, Gap Pad® electrically insulating Gap Fillers, Hi-Flow® phase change grease replacement materials, Bond-Ply® thermally conductive adhesive tapes, and Thermal Clad® insulated metal substrates.