Series Production Start for SEMIKRON SKiiP 4 - The Most Powerful Intelligent Power Module on the Market
The power components in SKiiP 4 modules can be operated at a junction temperature of up to 175°C. To make sure that these high temperatures can be used reliably, the power components are 100% solder-free. SKiiP4 modules do away with the conventional base plate, reducing mechanical stresses. The use of Skinter sinter technology also means that the solder layer, which can be detrimental to component or module life, is replaced by a sintered silver layer, achieving five times the reliability when subjected to passive thermal cycling. The power cycle is 2 to 3 times greater than that of soldered base-plate modules. In practice this means greater reliability in the field, as well as lower service costs.
The integrated gate driver in the SKiiP 4 sets new standards on the reliability and functionality fronts. The digital driver guarantees safe isolation between the primary and secondary side for both switching signals and all measurement parameters, such as temperature and DC link voltage. This means users no longer have to introduce complex and costly circuit components to provide safe isolation. The SKiiP driver features a CANopen setup and diagnosis channel – a first in a power module – which enables access to an error memory, meaning errors in the SKiiP 4 can be quickly identified and saved for later diagnosis.
Today, many decentralised green power supply systems are monitored for errors remotely. The CANopen interface facilitates the integration of diagnosis functions into the remote control and monitoring concept. Even without direct integration of the CAN interface into the controller, this feature is still very useful as regards on-site service and maintenance tasks.
Besides error diagnosis, settings in the SKiiP 4 driver can also be adjusted. For example, the switching threshold can be adapted to the given application for DC link voltage monitoring purposes.