The eTEC™ Series of TEMs enable high powered optoelectronics to maintain peak performance by stabilizing the temperature of the device during operation. The modules are assembled using thin film technology that enables the TEMs to have ten times the heat pumping density per unit area than conventional bulk thermoelectric technology. The ceramic substrates are gold metallized to allow the product to be embedded into densely packed optoelectronics.
“As next generation packaging shrinks in size, conventional bulk technology becomes more of a design constraint due to its large package size,” said Andrew Dereka, Laird Technologies Product Manager. “Thin film technology provides our customers with more flexibility to optimize package design and keep optics stable in temperature fluctuating environments.”
The thin film eTEC TEMs have heat pumping densities ranging from 75 to 90 W/cm2 at an ambient temperature of 25°C. The new models include:
- HV14,18,F0,0101,GG – 1.4 Watts in 1 mm2
- HV37,48,F2,0202,GG – 3.7 Watts in 6.9 mm2
- HV56,72,F2,0203,GG – 4.8 Watts in 10.2 mm2