Chemask® NA – Non-Ammoniated Solder Masking Agent - For All Sensitive Metal Surfaces

Chemask® NA, an ammonia-free, peelable, temporary solder mask is now available. It is formulated for a fast cure, safe use with sensitive metals, and is non-contaminating, non-staining and noncorrosive. Specifically engineered for high temperature applications (to 550˚F / 288˚C), this revolutionary product is ideal for lead-free or tin/lead processes, compatible with gold, copper, nickel, silver and OSP finishes, and can go directly into a preheat oven. As all of ITW Chemtronics temporary spot masks, Chemask NA is completely compatible with all fluxes and cleaning solvents normally used in PCB manufacturing. In addition, it is phthalate-free, has very low toxicity and is environmentally safe.

Chemask® NA Solder Masking Agent
The safest spot mask available for all sensitive metal surfaces
  • Stable to 550F (288 C) – withstands lead-free processing temperatures
  • Ideally suited for use with gold, copper, nickel, silver and OSP finishes
  • Works with both lead-free and tin/lead applications
  • Phthalate-free, low toxicity and environmentally safe
  • Compatible with all flux types and cleaning solvents
  • Dries tack free in 15 minutes (10 mil thick application)
  • Can be introduced into the pre-heat oven without being fully cured
  • Removes easily by hand and leaves no residue
  • Non-contaminating, non-staining and non-corrosive on all surfaces
  • RoHS compliant


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