A New Dimension in Miniaturization
By 2014 it is expected that up to 40 percent of all mobile phones will be smartphones. In order to offer worldwide coverage, smartphones must support more RF bands than ever and feature growing numbers of functionalities. Despite the fact that their RF circuits are becoming more complex, the phones must remain as compact and flat as ever.
As the global market leader in SAW products for mobile communications, EPCOS has and continues to play a leading role in the miniaturization of RF components and modules. Through the introduction and further development of its patented CSSP® technology (chip-sized SAW packaging), the size of discrete RF filters and duplexers has been steadily reduced. Now with DSSP®, the components are up to 85 percent smaller than the first generation CSSP products.