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Ramtron and Module Technology Form Partnership to Extend Fast Write, Higher Density Memory to Standard RFID Readers

U.S. semiconductor maker Ramtron International Corporation (Nasdaq: RMTR), a leading developer and supplier of low energy semiconductor products and Shenzhen, China-based Module Technology Co. Ltd., a leading supplier of UHF Radio Frequency Identification (RFID) products, today announced that they have entered into a technology partnership. Under the partnership, Ramtron and Module Technology will enhance Module Technology’s standard RFID reader hardware to support the faster and higher memory array of the Ramtron MaxArias wireless memory. The partnership will impact a wide range of customers—from smart metering, industrial manufacturing, high-value asset tracking and other data-intensive logging applications that can benefit from low power, fast write wireless memory solutions.

“Ramtron is a world-recognized leader in nonvolatile F-RAM memory,” said Mr. Wan Dunben, Module Technology’s CTO. “We believe their advanced RFID technology will enable our mutual customers to reduce their manufacturing costs and improve production throughput.”

“Modular Technology is a trailblazer in the RF space – enabling users to quickly and passively write critical data to Ramtron-enabled transponders,” said Scott Emley, Ramtron’s vice president of worldwide marketing. “We are pleased to partner with Module Technology in order to extend the benefits of our high density, fast write, and secure RF-enabled memory to a broad range of industries in the Asia-Pacific region.”

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