The electronic industry’s continued trend of smaller form factors, greater circuit density, and highly integrated packaging has translated into significant thermal problems for optoelectronics manufacturers. Bulk TEC devices have been used to provide temperature control of laser diodes and other optoelectronic devices, but have not kept pace with these new requirements due to their larger size and power density limitations. With Nextreme's thin-film modules, manufacturers of laser diodes, photodiodes, infrared (IR) sensors and other semiconductor chips can now integrate cooling and temperature control functionality directly into the package during assembly, resulting in a high-volume, lower cost thermal management solution.
The Nextreme eTEC HV14 is one of the world's smallest thermoelectric modules with a footprint of only 3 mm². The thin-film module can pump up to a maximum power density (Qmax/area) of 120 W/cm² in comparison to less than 10 W/cm² for the bulk TEC. The response time of the eTEC HV14 is on the order of milliseconds compared to seconds for bulk devices. These devices are only 0.6mm high, making them the thinnest, highest heat pumping thermoelectric coolers on the market today.
The miniature size and heat pumping capability make thin-film thermoelectric modules ideal for cooling laser diodes, photodiodes, LEDs, infrared (IR) sensors, pump lasers, crystal oscillators and optical transceivers.
Nextreme will be demonstrating its cooling and thermal management product family at the SPIE Defense, Security, and Sensing conference on April 24-27 in booth #232 at the Baltimore Convention Center.