In recent years, digital electronic devices have evolved towards higher performance, multi-functionality, and higher data handling volumes. Consequently, the speed of signal transfer has increased as well. As a result the noise components generated within such a device are generally of a higher frequency as well. At the same time, space is limited and components need to be extremely small and thin for higher mounting density. Since multiple signal paths exist in close proximity in a single device, interference from one may affect the signal in another, leading to signal quality deterioration known as internal contamination.
TDK harnessed its high frequency expertise and proprietary thin-film patterning technology to create a miniature component that features extremely compact and highly precise coil patterns and is thus able to offer the performance demanded in high-speed digital devices.