TI Enhances Audio Headset Experience with Detection and Configuration Switch IC

Texas Instruments Incorporated (TI) (NASDAQ: TXN) today introduced a new audio headset detection and configuration switch integrated circuit (IC) that enables universal headset support for audio applications in a single chip. By integrating the automatic detection and switching function in a single device, the TS3A225E eliminates detection, leakage and click-pop issues caused by using discrete components in end-equipment, such as smartphones, tablets, laptops, audio docks and home audio applications. For more information and to order samples, visit www.ti.com/ts3a225e-pr.

The TS3A225E works seamlessly to extend the functionality of best-in-class TI audio codecs, such as TLV320AIC3262 and TLV320AIC3212. For customers who prefer only a 2x2 crosspoint switch functionality without headset-type detection, TI also offers the reduced-cost TS3A26746E. The TI switch portfolio also consists of other audio, video, USB, LAN and DDR switches available at TI website.

Key features and benefits
  •     Enhances the end user's experience: supports three-prong (without microphone) and four-prong (with microphone) audio headsets from all manufacturers.
  •     Eases system design: detects the configuration of the microphone and ground pins on a four-prong headset and routes them appropriately via a 2x2 crosspoint switch.
  •     More control over system operation and debug: reports headset information over I2C interface.
  •     Prevents audio signal distortion: 66-percent lower on-resistance (100 mOhms) for the ground switch compared to the competition.
  •     Easier mounting and routing in the system: available in both QFN and WCSP packages.

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