Measuring just 22.9 x 10.2 x 7.1 mm, the SIP package meets Distributed-Power Open Standards Alliance (DOSA) specifications and is designed as a drop-in replacement for other DOSA-compliant parts.
These highly efficient converters, typically 94.5% at 3.3 Vout, and capable of driving ceramic capacitive loads up to 1,000 uF, have tight load regulation making them ideal for powering applications such as FPGAs and DSPs. The output voltage is programmable from 0.75 to 3.63 VDC for the 5 Vin part, and up to 5 VDC for the 12 Vin part.
Input under voltage lockout, output short circuit, output over current, and over-temperature protection features are offered across the OKX series. The On/Off Control feature is also standard in either Positive or Negative logic.
The converters have exceptional thermal derating performance and can operate in most environments from -40 to +85 degrees C.
Typical applications include powering CPUs, datacom / telecom systems, server and storage equipment, industrial systems, and programmable logic and mixed voltage designs.
The modules are RoHS-compliant and meet the international safety standard UL/EN/IEC 60950-1 for IT and commercial equipment.