IR’s µIPM™ Power Modules Deliver up to 60% Smaller Footprint, High Efficiency, Cost Effective Motor Control Solution for Appliances and Light Industrial Applications
Available in an ultra-compact 12x12x0.9mm PQFN package, the µIPM family comprises a series of fully integrated 3-phase surface-mount motor control circuit solutions. The new alternative approach pioneered by IR for this market segment utilizes PCB copper traces to dissipate heat from the module, providing cost savings through a smaller package design and, even eliminating the need for an external heat sink. By using standard packaging QFN technology, assembly is simplified by eliminating through-hole second pass assembly and improving thermal performance compared to traditional dual-in-line module solutions.
“By utilizing an innovative packaging solution, IR’s µIPM products not only offer up to 60 percent smaller footprint compared to existing leading solutions but also deliver advantages in output current capability and system efficiency. Combined with ease of use, improved thermal performance and overall system size reduction, the µIPM family enables designers and system integrators to deliver more cost effective and advanced motor control solutions,” said Alberto Guerra, Vice President, Strategic Market Development, IR’s Energy Saving Products Business Unit.
IR’s µIPM product family offers a scalable power solution with common pin-out and package size. Featuring the most rugged and efficient high-voltage FredFET MOSFET switches specifically optimized for variable frequency drives and IR’s most advanced high-voltage driver ICs, the µIPM product family offers DC current ratings ranging from 2A to 4A and voltages of 250V and 500V.