"The licensing agreement, based on the sharing of innovative patented high speed mezzanine connector and BGA connector termination technologies, leverages the respective and complementary strengths of FCI and Amphenol,” said Pete Curwen, President of the FCI Electronics Division. “Building on the existing AirMax VS® and XCede® backplane connector relationships, the InfinX mezzanine product offering permits the satisfaction of new market requirements."
FCI and Amphenol both have a strong track record of innovation, customer support, and commitment to true second source partnering. The companies’ proven second source approach includes a robust qualification program to insure interchangeability across all products for our customers.
The InfinX high-density parallel board connector meets increasing bandwidth demands in mezzanine applications and supports data rates of 25+ Gb/s in a channel. The connectors are optimized for differential signals at 44 to 66 differential pairs per linear inch and can be scaled to stack heights ranging from 10 mm to 42 mm. The connector design features rugged wafer construction with non-stubbing mating interface for mechanical reliability and BGA attachment to ensure high SMT processing yields and solder joint reliability. InfinX connectors have already achieved broad customer acceptance, are shipping in volume, and are rapidly becoming the standard for next-generation mezzanine interconnects.