Monday, June 11, 2012

Fairchild Semiconductor's P-Channel PowerTrench® WL-CSP MOSFETs Minimize Board Space in Mobile Applications

Designers of mobile devices are challenged to save space, increase efficiency and manage thermal issues in their end applications. To address this continuing trend, Fairchild Semiconductor (NYSE: FCS) developed the FDZ661PZ and FDZ663P P-channel, 1.5V specified PowerTrench® Thin 0.8mm x 0.8mm WL-CSP MOSFETs.

Using a state-of-the-art "fine pitch," thin WL-CSP packaging process, these devices minimize board space and RDS(ON), while achieving excellent thermal characteristics for a miniature form factor.

Features and Benefits:
  • Very small (0.8 x 0.8mm) packaging occupies only 0.64mm2 of PCB area, less than 16% of the area of a 2mm x 2mm CSP
  • Ultra-low profile is less than 0.4mm height when mounted to PCB
  • Low RDS(ON) ratings with VGS as low as -1.5V
  • Excellent thermal characteristics (RΘJA of 93ºC/W, on 1in2 2oz copper pad)
  • RoHS-compliant
  • Suitable for use in battery management and load switch functions in mobile applications

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