Wednesday, June 13, 2012

Emerson & Cuming Microwave Products, a Unit of Laird Technologies to Attend the 2012 International Microwave Symposium

Laird Technologies, Inc., a global leader in the design and supply of customized performance-critical components and systems for advanced electronics and wireless products, today announced it will be attending the 2012 International Microwave Symposium and Exhibition. The event is taking place at the Palais des Congrès de MontrĂ©al in Montreal, Canada, June 19-21, 2012. Emerson & Cuming Microwave Products, a unit of Laird Technologies can be found at booth #2308. 

Three product lines from newly acquired Emerson & Cuming Microwave Products will be showcased at the event: ECCOSORB®, ECCOSTOCK® and ECCOSHIELD®. These solutions offer a wide range of microwave materials for engineers working with VHF, UHF, microwave and millimeter wave frequencies in industries including telecommunications, wireless, medical, automotive, electronics and military. 

“We have the capability to engineer materials to precise configurations and formulate materials with specific electromagnetic properties,” said Doan Quach, Sales and Marketing Coordinator for Emerson & Cuming Microwave Products. “We offer customized solutions and IMS 2012 is an excellent opportunity to showcase our technology and why we are an industry-leader in EMI solutions.”

As an industry-leading EMI solutions provider, Laird Technologies has a complete portfolio of standard and customized EMI products for industries around the world. The addition of the ECCOSORB®, ECCOSTOCK® and ECCOSHIELD® product lines enhance Laird Technologies EMI solutions product offerings.   For more information, white papers are available on the Theory and Application of RF/Microwave Absorbers and Application and Theory of Dielectric Materials in RF/Microwave Systems.

The 2012 International Microwave Symposium and Exhibition is the world’s largest gathering of RF and microwave professionals with over 12,000 attendees and more than 800 exhibitors. Attendees will have the opportunity to participate in technical sessions, application seminars, panel discussions and industrial exhibits.

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