congatec’s Smart Cooling Pipes Pave the Way for Unlimited Performance Growth for COM Express Modules
"The real problem lies with hot spots around the processor and chipset," states congatec product manager Martin Danzer. "Our improved cooling concept results in a lower processor temperature, which is essential for a more frequent activation of Turbo Boost 2 Technology to ensure maximum COM performance and energy efficiency. As a result, the processor can operate at higher levels than the maximum permitted thermal design power (TDP)."
The advantages at a glance:
- Fast spot cooling for full performance
- Elimination of gap filler layer
- Elimination of mechanical stress leads to higher quality
- Better cooling extends the life span of the module
The new cooling solution is also ideal for systems with low power dissipation. The modules have a higher thermal reserve, which increases their life span and reliability. Average temperature reductions of only 5 Kelvin can double the statistical life span – a convincing argument when considering the total cost over the lifetime of a system.