Molex Offers Extensive Portfolio of Automation Solutions That Deliver Proven Results for the Global Packaging Industry
Molex Incorporated will showcase its Brad® automation product line – ideal for packaging machine builders, robot manufacturers and equipment system integrators worldwide looking for competitively priced, high-performance solutions – at Pack Expo, September 26 – 28, Las Vegas, NV, booth S7115. Molex automation products are offered as a bundled solution with an extensive range of industrial network protocol options designed for the advanced-manufacturing needs in the packaging industry, including Industrial Ethernet.
“As packaging systems adapt over time, our out-of-the-box Brad products provide greater flexibility by allowing users to add power and control devices as they migrate to next generation systems,” said Tom Schoder, group product manager, Integrated Products, Molex. “Additionally, our solutions are proven, with over 40 years of powering the automation infrastructure with fast, reliable and durable connections.”
Brad automation solutions from Molex provide multiple benefits that help optimize packaging operations, including:
High-performance network interface cards (NICs) for protocols like DeviceNet, PROFIBUS and Ethernet that allow PC-based control systems to be used on packaging and material handling lines where speed and accuracy are critical.
Robot controllers that can be easily integrated into packaging lines using Molex network interface card solutions for a wide range of network protocols and bus formats.
IP67 Ethernet I/O modules and switches that decrease installation costs and enable conveyor manufacturers to provide faster, easier and more reliable on-site integration.
Harsh duty products that reduce costly downtime by providing infrastructure that is easy to install and rugged enough to endure the demanding environments found on the packaging plant floor.
At Pack Expo, Molex executives will be available to discuss and demonstrate the latest electronic technologies for the packaging industry, including:
Connectivity Products
Connectors and Receptacles: Fast and reliable in I/O and network systems, Brad connectors and receptacles provide rugged, watertight (IP67) connections for the harshest environments.
Communication Products
PLC/PAC Backplane Modules: Available in both Ethernet and Fieldbus protocols, the modules are easily integrated into Rockwell Automation’s RSLogix5000 using Add-on-Profiles for ControlLogix and can be added to the system design within Rockwell’s Integrated Architecture Builder.
PC and Remote Scanners: Use Ethernet as the backbone to access a DeviceNet or PROFIBUS network resulting in a lower-cost access method for networked I/O and diagnostic information.
Control Products
Harsh-duty (IP67) I/O: Modules are easy to install, can be machine mounted and are able to withstand areas where liquids, dust or vibration may be present.
Industrial Ethernet Switches: Feature a rugged design for industrial use in either IP30 or IP40 enclosures and are available with either copper or fiber communication ports.
Power Products
Modular Power Solutions: Modular, quick-connect systems provide easy-to-install power distribution systems that do not require specialized tools and labor.
“As packaging systems adapt over time, our out-of-the-box Brad products provide greater flexibility by allowing users to add power and control devices as they migrate to next generation systems,” said Tom Schoder, group product manager, Integrated Products, Molex. “Additionally, our solutions are proven, with over 40 years of powering the automation infrastructure with fast, reliable and durable connections.”
Brad automation solutions from Molex provide multiple benefits that help optimize packaging operations, including:
High-performance network interface cards (NICs) for protocols like DeviceNet, PROFIBUS and Ethernet that allow PC-based control systems to be used on packaging and material handling lines where speed and accuracy are critical.
Robot controllers that can be easily integrated into packaging lines using Molex network interface card solutions for a wide range of network protocols and bus formats.
IP67 Ethernet I/O modules and switches that decrease installation costs and enable conveyor manufacturers to provide faster, easier and more reliable on-site integration.
Harsh duty products that reduce costly downtime by providing infrastructure that is easy to install and rugged enough to endure the demanding environments found on the packaging plant floor.
At Pack Expo, Molex executives will be available to discuss and demonstrate the latest electronic technologies for the packaging industry, including:
Connectivity Products
Connectors and Receptacles: Fast and reliable in I/O and network systems, Brad connectors and receptacles provide rugged, watertight (IP67) connections for the harshest environments.
Communication Products
PLC/PAC Backplane Modules: Available in both Ethernet and Fieldbus protocols, the modules are easily integrated into Rockwell Automation’s RSLogix5000 using Add-on-Profiles for ControlLogix and can be added to the system design within Rockwell’s Integrated Architecture Builder.
PC and Remote Scanners: Use Ethernet as the backbone to access a DeviceNet or PROFIBUS network resulting in a lower-cost access method for networked I/O and diagnostic information.
Control Products
Harsh-duty (IP67) I/O: Modules are easy to install, can be machine mounted and are able to withstand areas where liquids, dust or vibration may be present.
Industrial Ethernet Switches: Feature a rugged design for industrial use in either IP30 or IP40 enclosures and are available with either copper or fiber communication ports.
Power Products
Modular Power Solutions: Modular, quick-connect systems provide easy-to-install power distribution systems that do not require specialized tools and labor.
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