Air Products to Present Wave Soldering Technology

Air Products will introduce new-generation wave soldering technology for the electronics assembly and packaging industry at the IPC Apex Expo in Las Vegas on 12-14 April. The patented Inert Wave Soldering technology uses new or existing soldering equipment and addresses the major issues faced by the electronics assembly and packaging industry by providing improved nitrogen inerting in wave soldering applications.

According to the company, which will be found in Booth 621, the technology is based on original patented designs that are currently in operation around the globe. Through its efficient use of nitrogen, this new-generation technology is claimed to enable customers to reduce manufacturing and material costs, including reduced nitrogen flow rates. In addition, it increases soldering joint quality and transitions to lead-free soldering technology with minimal effort.

Greg Arslanian, global manager for electronics packaging, assembly and test at Air Products, said: 'Through extensive research, both in house and with our customers, we have added new features to our existing system that overcome the key challenges of applying nitrogen inerting in wave soldering. 'This optimised system has demonstrated dramatic results, including significantly reduced key defects and dross formation in day-on-day production,' he added.

Christine Dong, lead research scientist at Air Products, will present detailed technical information, laboratory evaluations and production trial data for Air Products' advanced nitrogen inerting technology at a conference session scheduled to be held at 15:15 on 12 April. Attendees will hear about the benefits of the technology, view hard data and learn how they can lower their cost of ownership.

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