Epoxy Combines Polymeric and Inorganic Materials

Master Bond's EP30LTE-LO two-component epoxy is designed for bonding, sealing, casting and coating applications in the aerospace, electrical, electronic, chemical, optical and computer industries. Formulated with a special blend of polymeric and inorganic materials, the EP30LTE-LO is claimed to provide excellent dimensional stability. This epoxy combines excellent performance with a low thermal expansion coefficient.

Serviceable over a temperature range of -60F to 250F, the EP30LTE-LO cures at room temperature with 85 per cent of its maximum strength developed within 48 hours. Faster cures are possible at elevated temperatures. This 100 per cent reactive epoxy features a low coefficient of thermal expansion of 12x10-6in/in/C and a low shrinkage rate of less than 0.0002in/in. It bonds well to metals, glass, ceramics, wood, vulcanised rubbers and most plastics and produces bonds with a tensile strength over 5,000psi.

This electrically insulative system resists thermal cycling and chemicals including water, fuels and many acids, bases, salts and organic solvents. It has a long working life of up to 60 minutes for a 200g mass. The EP30LTE-LO has a 10:1 mix ratio by weight and can be easily applied with a spatula, a knife, a trowel, a brush or a paint roller. It can also be readily cast as thick as 1in without undue exotherm developing. The EP30LTE-LO is available in half-pint, pint, quart, gallon and five-gallon container kits. This low outgassing epoxy features a low thermal expansion coefficient with solid electrical insulation properties.

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