zQSFP Plus High-Speed, High-Density Interconnect for Data Rates Up To 40 Gbps
For quick-and-easy system upgrades, the zQSFP+ interconnect is backwards-compatible with current QSFP+ optical modules and cable assemblies. Designed with an enhanced electromagnetic interference (EMI) cage, the connector helps provide excellent thermal performance and EMI protection. In addition, the zQSFP+ product offers superior signal integrity as well as superior mechanical and electrical performance through a preferential coupling design -- i.e. coupled, narrow-edged, blanked- and formed-contact geometry with insert molding.
Users will see PCB space savings with this new connector as its staggered press-fit pins accommodate belly-to-belly applications -- enabling the use of both sides of a PCB. Additionally, the connector's housing is made from high-temperature, thermoplastic material to withstand lead-free processing.
Mechanical characteristics include a mating force of 40N, durability of 250 cycles (minimum) and an operating temperature ranging from -20 to +65 degrees Celsius. The connector's electrical current rating is 0.5 Amps per pin with a maximum voltage rating of 30 VDC.
Product offerings include 1x1 single port and 1x3 ganged cages with heat sink and light pipe options.
Target applications include cellular hubs, servers, switches, network interfaces, power supplies, medical diagnostic equipment, and test and measurement equipment. The connector can also be used in current 10-Gbps and 16-Gbps applications with substantial margin.