Laird Technologies to Attend SPIE Defense, Security and Sensing 2012 Conference and Exhibition

Laird Technologies, Inc., a global leader in the design and supply of customized performance-critical components and systems for advanced electronics and wireless products, today announced it will be attending the SPIE Defense, Security and Sensing 2012 Conference and Exhibition with Nextreme Thermal Solutions. The conference will be held at the Baltimore Convention Center in Baltimore, Maryland, April 23-26, 2012. Laird Technologies will present at booth #232. Laird Technologies will showcase its high-performance thermoelectric product line which can be used to temperature stabilize optoelectronic components, lasers and sensors to maintain their peak performance or cool infrared systems and charged couple devices to low temperatures to maximize the light spectrum bandwidth.

Nextreme will showcase its thin-film eTEC and eTEG thermoelectric product lines. The miniature size and heat pumping capability make eTECs ideal for cooling laser diodes, photodiodes, infrared (IR) sensors, and other optoelectronic devices. Recent technology advancements deliver eTECs with a 60°C temperature difference at an ambient temperature of 25°C, bringing them on par with the performance of bulk thermoelectric technology. Nextreme’s thin-film eTEG thermoelectric power generators convert waste heat into electricity to power a wide range of devices including autonomous, self-powered security sensors and wireless transmitters for data acquisition.

Jim Mundell from Nextreme will be speaking on emerging applications and markets for thin-film thermoelectric energy harvesting. Advances in distributed sensors and sensor networks have led to an increased interest in the use of renewable power sources to replace or augment existing power systems.


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