Skip to main content

NXP Reveals World’s Smallest Logic Package with the Largest Pads

NXP Semiconductors N.V. (NASDAQ: NXPI) today announced the new SOT1226 “Diamond” package – the world’s smallest general-purpose logic package, featuring a unique pad pitch design. Measuring at 0.8 x 0.8 x 0.35-mm, the new SOT1226 is a leadless plastic package 25-percent smaller than the SOT1115, previously the world’s smallest logic package, also from NXP.

Despite its smaller package size, the SOT1226 saves engineers time and costs by offering a 0.5-mm pad pitch that is 50-percent larger for easier soldering. Ideally suited for leading-edge portable devices such as smartphones where PCB space is critical, the unique form factor of the Diamond package enables device miniaturization by offering a space-saving logic solution without the added manufacturing costs associated with smaller pad pitch patterns.

Typical manufacturing processes for packages use a small 0.3-mm or 0.35-mm pad pitch, requiring Electronic Manufacturing Services (EMS) and assembly houses to use a step-down mask in order to successfully mount the devices on the PCB. Due to the Diamond package’s larger 0.5-mm pad pitch, a step-down mask is not needed during the soldering process, saving costs for the manufacturer. In addition, the larger pad pitch of the Diamond package offers greater contact area, resulting in easier component placement, as well as improved joint strength and robustness, while reducing the risk of short circuits. With larger pad pitches, PCB assemblers can thus avoid costly mistakes such as solder bridging, or the formation of accidental bridges between contacts, which can render electrical devices useless.

“Mobile designers are constantly faced with the challenge of adding more functionality and features into portable devices while using less space, which in turn introduces new challenges,” said Kristopher Keuser, director of marketing, Logic business line, NXP Semiconductors. “NXP’s new Diamond package is a game-changing solution that allows our customers to design within smaller geometries without increasing manufacturing costs, and to standardize their entire product portfolio. It underscores our commitment to leadership, innovation and understanding of a market that is driven by the need for smaller, cheaper and more reliable solutions.”


Popular posts from this blog

Banner Engineering DF-G3 Discrete Fiber Amplifier Features World-Class Long Range Sensing Capability

Banner Engineering introduces its DF-G3 discrete long-range fiber amplifier with dual digital displays for use with plastic and glass fiber optic assemblies. Featuring increased sensing power, the DF-G3 can sense more than 3 meters (10 ft.) with opposed mode fibers or more than 1 meter (3 ft.) with diffuse mode fibers. The extra power provides increased detection reliability for dark targets at long range and enhanced detection sensitivity when using specialty fiber assemblies for large area and small part detection applications.

The DF-G3 is available with a single discrete output or two dual discrete outputs. The dual discrete outputs can be independently taught to trigger at different intensity values, which is ideal for correct part-in-place or error-proofing, bottle down, and edge guiding applications.

“We developed the DF-G3 fiber amplifier to meet our customers’ need to precisely detect smaller targets at longer ranges” said Dennis Smith, Senior Marketing Manager, Banner Engin…

IDEC Releases New Line of High Efficiency Power Supplies

IDEC Corporation announces the PS5R-V line of DIN-rail power supplies, offering their customers high-efficiency in a compact form factor at competitive prices. These power supplies suit a wide range of needs in the industrial marketplace, and carry all of the required certifications necessary for use in these demanding applications. This next generation of the industry standard PS5R power supply family has updated features and specifications to meet current and future needs.

The PS5R-V line of power supplies includes 10W, 15W, 30W, 60W and 120W versions, with additional versions coming soon. These power supplies have a very compact form factor with overall dimensions reduced by up to 25% from previous generations. The reduced form factors combine with DIN-rail mounting to free up valuable control panel space and reduce installation costs.

Operating temperature ranges up to -25 to +75 degrees C offer more versatility. These extended operating temperature ranges often allow these power…


TURCK is now offering the option to completely shield M8 picofast ® cordsets by connecting a braided shield directly to the coupling nut. This provides a cost-effective and reliable connection with 100 percent cable and connector shielding, which protects against electromagnetic and radio frequency interference.

The 3 and 4-pin cordsets are available with flexlife ® PVC or PUR jacketed cable. All connectors deliver IEC IP 67 protection.

The M8 picofast line, like most TURCK cordsets, provides male or female, straight and right angle connectors, standard and custom lengths, and pigtails or extensions. Fully encapsulated mating receptacles are also offered, completing the system.