The baseplate-free SKiM4 module is the most powerful IGBT module in the range, with rated currents of between 200A and 600A. As much as 250kVA can be achieved without several modules having to be connected in parallel. SKiM4 modules come in TNPC technology for 650V and 1200V, and 1200V in NPC topology. The modules in TNPC topology can deliver up to 900VDC and 480VAC, while those in NPC topology can push the EU low voltage directive to its limits of 1500 VDC and 1000 VAC.
For smaller currents, baseplate-free, spring-contact IGBT MiniSKiiP modules are available. These modules feature solder-free mounting and are intended for rated currents of between 75A and 200A and reverse voltages of 650V, enabling powers of up to 85kVA. At 4.9A/cm², the power density is very high compared with competitor products, making this module ideal for use in compact systems. A further merit of these modules is the easy single-screw connection between module and heat sink and controller board.
The counterpart to solder-free MiniSKiiP modules is the SEMITOP, an IGBT module which is 12mm in height and soldered on to the Power Circuit Boards and used in applications with current ratings of 20A -150A. These baseplate-free solder-connection modules come in NPC topology and can deliver up to 65kVA. The voltage rating is 600V.
The fact that no solid busbars are needed in SEMITOP and MiniSKiiP modules is the reason for their compact design.