CAE Package Helps Engineers Solve Resin Problems

Flow Science is offering a computer-aided-engineering (CAE) package aimed at solving the complex problems surrounding the development and production of products using thermosetting resins. Thermosetting resins, with their high adhesive and structural strength and thermal and chemical durability, are used in semiconductor devices, generators, transformers and switches, coils and other components for electric vehicles and hybrid electric vehicles, printed circuit boards and MRIs.

The new Flow-3D Thermoset package is intended to help engineers overcome the challenging problems presented by materials in the production process. Working with Hitachi and Terrabyte of Japan, which collaborated on the development of this customised version of Flow-3D, Flow Science can now offer engineers seeking to tackle these difficult problems an advanced tool to produce accurate predictions of void formations, incomplete filling, overfilling and gold wire deformations.

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