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Mitsubishi Electric to Begin Shipment of Silicon Carbide Power Module Samples

Mitsubishi Electric Corporation (TOKYO: 6503) announced today it that it will begin shipping samples of five kinds of power modules for home appliances and industrial equipment starting on July 31, 2012. The modules use silicon carbide (SiC), a next generation semiconductor material expected to significantly reduce power loss in diode and metal oxide semiconductor field effect transistor (MOSFET) chips.

The modules will be showcased at POWER SYSTEM JAPAN 2012 in TECHNO-FRONTIER 2012, an exhibition on electro-mechanical parts and devices to be held on July 11-13 at Tokyo Big Sight in Japan.

Inverters are widely used in home appliances like air conditioners and refrigerators, as well as in industrial devices, to increase energy efficiency. While Mitsubishi Electric already offers a wide variety of low-loss power semiconductor modules for inverters, the SiC modules offer significant reductions in power loss and improvements in high speed switching, achieving even higher efficiency and downsizing.

Of the five new types of SiC power module samples, three types are for home appliances, while two are for industrial devices such as inverters and servos.

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