LI SERIES OF REED RELAYS NOW OPTIMIZED FOR HIGH VOLTAGE APPLICATIONS
MEDER electronic Inc., a manufacturer of precise, reliable, and long-lasting miniature switches, sensors and relays, announces the availability of the new and improved LI series of reed relays, an ultra-miniature relay ideal for use in high-voltage applications, including cable and in-circuit test equipment, high voltage test equipment, photovoltaic application change-over switches, as well as the emerging electric vehicles market.
The LI series reed relay design features a PCB through-hole package, capable of switching voltage up to 1 kilovolt of direct current (kVDC) and breakdown voltage up to 5kVDC. It features the smallest possible housing in a space-saving package. High insulation resistance is available at greater than 10 teraohms (TΩ) with insulation voltage between the coil and contact of up to 7 kVDC.
The newly updated LI series has been specially optimized for high voltage applications. The improved mechanical design features a new base plate that provides a stable relay structure, and improves the electrical isolation between pins. The new base plate also prevents resin from wicking up the connection pins, improving the pins’ solderability. The resin filling process now has a fully automated dispensing process that ensures consistent, high quality, and uniform fill.
The product’s updated laser marking is another key improvement, with product marking and date code applied only after 100 percent final inspection, so there will be no issues of fading ink or worn off markings.
The LI series reed relay design features a PCB through-hole package, capable of switching voltage up to 1 kilovolt of direct current (kVDC) and breakdown voltage up to 5kVDC. It features the smallest possible housing in a space-saving package. High insulation resistance is available at greater than 10 teraohms (TΩ) with insulation voltage between the coil and contact of up to 7 kVDC.
The newly updated LI series has been specially optimized for high voltage applications. The improved mechanical design features a new base plate that provides a stable relay structure, and improves the electrical isolation between pins. The new base plate also prevents resin from wicking up the connection pins, improving the pins’ solderability. The resin filling process now has a fully automated dispensing process that ensures consistent, high quality, and uniform fill.
The product’s updated laser marking is another key improvement, with product marking and date code applied only after 100 percent final inspection, so there will be no issues of fading ink or worn off markings.
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