The Tektronix solution serves the comprehensive needs of Thunderbolt physical layer testing and spec conformance validation. Thunderbolt's four channel 10.3 Gbps I/O architecture is the most significant advancement in PC I/O design ever introduced into the consumer level electronics industry and Tektronix is dedicated to delivery of a broad portfolio of tools to facilitate the successful deployment of this new technology working in concert with Intel.
"As bus speeds and complexity increase, it's important that the physical layer testing tools keep pace," said Jason Ziller, director of marketing and planning, Thunderbolt Technology at Intel Corporation. "With their Thunderbolt solution, Tektronix is among those companies expanding the approach to physical layer electrical analysis that can help continue timely delivery of Thunderbolt technology to consumers."
"Engineers face increasingly more difficult challenges as they quickly solve physical layer electrical validation problems that threaten rapid technology deployment," said Brian Reich, general manager, Performance Oscilloscopes, Tektronix. "As demonstrated with Thunderbolt support, Tektronix is committed to providing the industry's best in class tools to enable the early adoption of leading technologies."