Skip to main content

HARTING Industrializes Low-Temperature Soldering Process

In order to meet its high commitment to innovation, the HARTING Technology Group consistently invests in the further development of its product technologies in its own in-house laboratory.

The company has now industrialized a low-temperature soldering process that employs a BiSnAg solder with a melting point of 138°C.

In the HARTING Mitronics division, this extends the plastics portfolio for AVT processes on laser direct structured (LPKF LDS) three-dimensional molded interconnect devices (3D-MID). Whereas, previously, only plastics with a very high heat deflection temperature could be used in conjunction with standard electronic solder, the new process enables the use of plastics with a low melting point, such as PBT (polybutylene terephthalate). The expansion of the process combinations also offers even better utilization of the potential of 3D-MID technology with regard to the more efficient use of space, integration and miniaturization. This means that HARTING 3D-MID solutions can be adapted with even greater accuracy to individual customer requirements.

The low melting solder joints have proven robust in environmental/mechanical endurance tests and, in shear tests, demonstrate retention forces comparable with those of conventional SnAgCu solders. The solder melts cleanly on the metal tracks and forms a cavity-free solder cone. In the AVT process, the solder can be applied according to an automated dispensing method.

Fielding its new colored PBT plastics for the LDS process for the manufacture of 3D-MIDs, HARTING is now also creating attractive components for visible use. PBT plastics have proven reliable base materials and are now available in many colors. Colored plastics are not only suitable for use in casings or other visible components but also for color-coding development stages or production series. In laboratory tests, the substrates have shown that they can be structured to optimum effect. In environmental/mechanical endurance tests, the metallization has delivered stable results on a level comparable with that of well-known production materials. In adhesion tests, this level has even been exceeded.

Comments

Popular posts from this blog

TURCK M8 CORDSETS WITH 100 PERCENT SHIELDING OPTION PROTECT AGAINST EMI/RFI

TURCK is now offering the option to completely shield M8 picofast ® cordsets by connecting a braided shield directly to the coupling nut. This provides a cost-effective and reliable connection with 100 percent cable and connector shielding, which protects against electromagnetic and radio frequency interference.

The 3 and 4-pin cordsets are available with flexlife ® PVC or PUR jacketed cable. All connectors deliver IEC IP 67 protection.

The M8 picofast line, like most TURCK cordsets, provides male or female, straight and right angle connectors, standard and custom lengths, and pigtails or extensions. Fully encapsulated mating receptacles are also offered, completing the system.

Banner Engineering DF-G3 Discrete Fiber Amplifier Features World-Class Long Range Sensing Capability

Banner Engineering introduces its DF-G3 discrete long-range fiber amplifier with dual digital displays for use with plastic and glass fiber optic assemblies. Featuring increased sensing power, the DF-G3 can sense more than 3 meters (10 ft.) with opposed mode fibers or more than 1 meter (3 ft.) with diffuse mode fibers. The extra power provides increased detection reliability for dark targets at long range and enhanced detection sensitivity when using specialty fiber assemblies for large area and small part detection applications.

The DF-G3 is available with a single discrete output or two dual discrete outputs. The dual discrete outputs can be independently taught to trigger at different intensity values, which is ideal for correct part-in-place or error-proofing, bottle down, and edge guiding applications.

“We developed the DF-G3 fiber amplifier to meet our customers’ need to precisely detect smaller targets at longer ranges” said Dennis Smith, Senior Marketing Manager, Banner Engin…

TURCK’s BL Compact Family Collects Analog and Digital Signals at the Source

TURCK’s BL Compact system is a revolutionary modular I/O solution for collecting a variety of signals in a single, rugged node on a network. Rather than routing all signals through a control cabinet, this device makes it possible to obtain analog, digital, thermocouple, RTD, serial, RFID or a mixture of signal types in a compact, machine-mountable device over DeviceNet™, CANopen and PROFIBUS ®.

Up to two signals types can be combined in any combination in the BL Compact system, including RFID and analog, digital and serial—and more. The BL Compact system may be customized to suit a user’s specific needs, so that devices may be added to an existing network and signals may be gathered on the machine without an enclosure. This drop-in solution can be used to connect up to 16 devices—drastically reducing the time it takes to run wires for each device back to the control cabinet and the potential for wiring errors.

The BL Compact system is currently available with four, eight or 16 ports i…