NEXT GENERATION OF POGO® CONTACT TECHNOLOGY FOR SEMICONDUCTOR TEST UNVEILED AT SEMICON WEST
The Z Interconnect Pin, “Zip,” is available in three separate design configurations: Radial, Flat, and Hybrid. The Radial Series utilizes traditional machined 3D components; the Flat Series employs innovative 2D components; and the Hybrid combines both technologies, a flat contact for the interface board married with a radial contact for the DUT. With multiple plating options, high-performance, and value pricing, Zip delivers unparalleled flexibility for users.
Bud Fabian, CPG President, commented, “The three Zip Series are designed for interchangeability in the same test tool if desired. They can be mixed and matched in the initial test socket design and built or interchanged later as needed to address specific DUT contact needs or cost objectives. This versatility increases the Zip’s value proposition for our customers.” The Z pin is available today for .5, .8, and 1.0mm test pitches with 1.27, .4, and .3mm designs scheduled for a Q4 release.
Everett Charles Technologies, a subsidiary of Dover Corporation (NYSE: DOV), is a leading manufacturer of electrical test products and services, including semiconductor test products, bare-board automatic test systems, Pogo® test contacts, and bare and loaded PCB test fixtures. ECT manufacturing, service, and support facilities are ISO registered with locations throughout the Asia , the United States, and Europe. The company has been awarded numerous patents and participates actively in developing industry standards.