Tuesday, April 17, 2012

Fairchild Semiconductor's Generation III XS™ DrMOS Family Provides Power Supply Designers Highest Efficiency, Better Power Density and Saves Board Space

New energy standards, combined with new system specifications for blade servers, high performance notebooks, gaming consoles and POL modules, are driving the requirements for better efficiency, higher current, higher switching frequency and increased power density. To meet these industry trends, Fairchild Semiconductor (NYSE: FCS) has developed the FDMF68xx Gen III DrMOS multi-chip module (MCM) family.

Designed to enable a reduced inductor and output capacitor count, the FDMF68xx series saves up to 50 percent of board space as compared to conventional discrete solutions and improves efficiency to meet new energy standards. The FDMF68xx series dramatically reduces switch ringing, using Fairchild's high-performance PowerTrench® MOSFET technology, eliminating the need for using a snubber circuit in most buck converter applications.

The Gen III DrMOS MCM family supports both 3.3V and 5V Tri-State PWM input voltages for both digital and analog PWM controllers and a 30V device option makes the DrMOS adaptable for Notebook or UltraBookTM power systems. Providing better efficiency with over 1MHz switching frequency, increased maximum load current, and greater power density, the Gen III DrMOS series achieves efficiency standards targets while providing up to 60A per phase in a 6x6mm2 PQFN package.

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