Board Connectors for High-Speed Applications

Hirose has launched the FX8/FX8C series of 0.6mm-pitch, 3-16mm stack height board-to-board connectors for high-speed applications in miniature electronic equipment. The FX8 and FX8C series can handle 3.125Gbps transmission speed with good signal integrity features. The series consists of headers and sockets in a fine surface mount pitch of 0.6mm, allowing for maximum space savings on the board. Parallel stacking heights are offered from 3-16mm.

A variety of contact sizes are offered from 40 to 280 positions. Small, mating guide ribs are provided to secure a self-alignment tolerance of +/-0.6mm, allowing design flexibility. The mating wiping distance is 2mm, ensuring effective electrical continuity. Two position pegs, also known as bosses, are positioned at each end with different diameters to avoid misinsertion into the board.

Twin, side-by-side versions are available that are joined together with a special joining bar. This enhances the mating reliability and can be removed if needed. The FX8 offers 3mm and 4mm stack height and the FX8C offers 5mm to 16mm. The connectors are suitable for a range of miniature electronic equipment needing high-speed capability.

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