Module Simulates Electrodeposition Processes

Comsol has released the Electrodeposition Module, an add-on expansion module for Comsol Multiphysics that provides engineers with the ability to model and simulate the shape of electrodeposits. Modelling and simulating the shape and composition of electrodeposits is used in processes such as copper and gold electroplating in the electronics industry; wear and corrosion-protective coatings of mechanical parts; decorative coatings, such as chrome and nickel plating, of automotive parts; and electroforming of thin and complex manufactured parts.

According to Comsol, the Electrodeposition Module allows for accurate descriptions of the electrochemistry, heat transfer and fluid flow in electrochemical cells used for electrodeposition. It enables developers to run realistic simulations of electrodeposition processes, from the micro-scale on up, using interfaces tailored for exactly these applications. The Electrodeposition Module also enables realistic simulations, for investigating the influence of cell and electrode geometry, chemistry, material properties and operating conditions.

The shape and composition of a deposited metal layer is modelled with either a thickness variable for very thin layers, or as a moving boundary for thicker layers. Electroplating firm PEM, based in Siaugues, France, reported that by using the module it made savings of between 10 and 30 per cent of the metal it deposited during electrolysis. The Electrodeposition Module has interfaces for secondary and tertiary current distribution. Laminar flow and heat-transfer interfaces, including predefined couplings for electrochemical cells, are also included.

Turbulent flow and two-phase flow capabilities are available in combination with Comsol's CFD Module. The secondary current distribution interfaces handle the electrode kinetics at the electrode surfaces and the current conduction in the electrodes and electrolyte. The tertiary current distribution interfaces also include the material balances of the ions in the electrolyte, with transport by diffusion, migration and convection, which can be modelled together with fluid flow in the cell.

Both the secondary and tertiary current distribution interfaces include detailed modelling of multiple electrode reactions; the shape and composition of the deposited layer; and also of possible dissolution processes at the anode. Each of these functions are available as predefined options in the graphical user interface and in combination with any other Comsol add-on product. The Electrodeposition Module comes with a model library, including tutorials and benchmark models demonstrating its workflow and capabilities. It allows the user to work with real CAD geometry models and leading CAD formats.

Further benefits include: mixed electrode potential and current-density calculations at zero net current; shape and composition calculations of electrodeposits using Faraday's law, as well as material balances for the deposited or dissolved metal at the electrode surfaces; moving boundaries with automatic remeshing, for large changes in cathode and anode shape; material balances in the electrolyte, including transport by diffusion, migration, convection and homogenous electrolyte reactions; surface chemistry of adsorbed species; charge balances using electroneutrality or Poisson's equation; current and potential distribution in the electrolyte, at the electrode surfaces and in the electrodes of the cell; and fluid flow and heat transfer coupled to ion transport, electric conduction in the electrode and electrode charge transfer reactions.